PVL has introduced a new line of IO-Link sensors for deployment in Industry 4.0. What the new sensors have in common is the combination of the IO-Link protocol for point-to-point communication between compatible IO systems and field devices. Io-link communication offers many advantages, including the possibility of using standard unshielded three-wire cables, advanced diagnostics and increased data availability, remote configuration and monitoring, and simplified equipment replacement
TDK has introduced tdK-Lambda PXD40 and PXD60 series 40W and 60W DC-DC converters. These latest models offer single output of 3.3,5,12,15,24, and 48V, or ±12, ±15, and ±24V dual output voltages. The device measures 2 "x 1" x 0.4 "(50.8mm x 25.4mm x 10.2mm) and can operate at temperatures from -40 ° C to +105C.
Renesas high-performance RZ/T2M motor control microprocessors for AC servo drives and industrial robots. The microprocessor consists of two Arm cortex-r52 cores and operates at a maximum frequency of 800MHz. In addition, for major industrial networking protocols such as EtherCAT, PROFINET RT and EtherNet/IP, the company has added support for the PROFINET IRT protocol to RZ/T2M.
The global semiconductor industry productivity crisis suffered in the past two years, lead to all sorts of chips are appeared out of stock, the price situation, influence the automotive, consumer electronics and other industries, originally supply will be improved significantly in the second half of 2022 chip, TSMC suddenly spread bad news at this time, however, warn customer productivity than expected next year, the year after next.
Car charger is a charging accessory that every car owner will not be unfamiliar with. If you want to charge your mobile phone in the car, it depends on it. Many charging brands have launched a variety of car chargers to provide consumers with sufficient choices. BMW also launched a series of car charger products, with single USB-A port, dual USB-A port and 1A1C three interface configurations.
ASIL certification has become the admittance rule for automotive supply chain manufacturers. In particular, if IC practitioners want to enter the field of automotive electronics and produce chip products in the field of vehicle functional safety, they must pass ASIL certification before being adopted by vehicle enterprises and Tier1.
Japan will cooperate with the United States to mass-produce 2-nanometer chips locally as early as 2025
Intel reiterated that it is consolidating its roadmap for high-performance CPUs and GPUs as it moves to newer manufacturing processes and packaging technologies in the coming years. The company is combining the CPU and GPU lineups into a single chip (code-named Falcon Shores), which Intel calls the XPU.
The GT308L offers eight LED drivers and a 16-step light controller. For the touch output result, it can be used through I2C or 1:1 direct output interface. I2C interfaces may be useful for MCU IO or applications where connector resources are insufficient. The GT308L can be used in a wide supply voltage range of 2.5V to 5.5V.
Apple unveiled a new M2 chip with a second-generation 5nm process and 20 billion transistors. Apple compared its performance to that of the previous M1 model and the i5-8210Y MacBook from years ago.
Infineon Technologies inc. has released the new 1700 V TRENCHSTOP™ IGBT7 module in the EconoDUAL™ 3 standard industrial package. With this new chip technology, the EconoDUAL 3 module delivers industry-leading 900 A and 750 A current ratings to further extend the power range of the inverter. The module can be widely used in wind power, motor drive and static reactive power generator (SVG) applications.
Schurter has introduced the new 4750 series IEC Strip block, IEC connector Type F, to meet the highly specific power distribution needs of data centers. The series power supplies are neatly arranged and compactly combined with functions, saving space in dense PDUs. The series is rated for international safety under IEC/CCC at 10A / 250 VAC 50Hz and UL at 15A / 250 VAC 60Hz. Available in black, grey and white.
Murata introduced the small RAIN RFID tag at Pharmapack in Europe. Tags are created to provide unique identifiers that allow RFID readers to determine the identity and authenticity of items in healthcare applications. The company integrated the antenna in a multi-layer ceramic substrate to produce a small, robust RFID tag capable of automatic identification and batch reading in excess of 400 units/min to improve throughput efficiency.
Ams OSRAM AS7056 and AS7057 Medical and health sensors, currently available in Mouser, are the next generation OF AFE vital signs sensors. The sensor is optimized to support space-constrained applications such as in-ear vital sign monitoring. They were placed in a WLCSP.
The LPDDR4 input/output interface has data transfer speeds of up to 3200Mbps. LPDDR4X comes in an ultra-thin premium package that delivers the same speed as LPDDR4 while speeding up multitasking and optimizing the user experience.
In the early morning of June 7, Beijing time, Apple held its Worldwide Developers Conference (WWDC), in which Apple announced four major systems, namely iOS 16, Watch OS 9, iPad OS 16, and Mac OS Ventura. As the successor to the first self-developed M1 chip in 2020, Apple has made a number of improvements to the M2 chip to shoulder the responsibility of launching the M2 series of chips.
ES9023 is a single-end output 24bit stereo audio digital-to-analog DAC chip, integrated with 2Vrms output driver op-amp. SABRE digital-to-analog conversion technology is adopted. Set sound quality, high cost performance in one, making it an ideal choice for digital to analog conversion.
The NCN5140S simplifies access control and control panel development and is the industry's first KNX Institute certified system-level package (SiP). The NCN5140S integrates all key and verifiable components of KNX devices in a single package, including a digital KNX transceiver, a 32-bit Arm® Cortex®-M0+ microcontroller with pre-certified software stack, and a system power DC-DC converter. NCN5140S 'high integration greatly reduces material costs, allowing manufacturers to develop very thin and modern designs (total thickness & LT; 5 mm).
