The Texas Instruments TPS92664 16-channel, low-noise LED matrix manager device provides fully dynamic adaptive lighting solutions by enabling individual pixel-level LED control. The device incorporates four sub-strings of four series connected integrated switches for bypassing individual LEDs. The individual sub-strings allow the device to accept single or multiple current sources.
Diodes Incorporated has released a new transistor array. The DIODES ULN62003A comprises seven 500mA-rated open-drain transistors, where all their sources are joined to a common ground pin. This high-current transistor array is targeted at climate control and home appliance designs and is able to drive a wide variety of loads, such as solenoids, relays, DC motors, and LED displays.
Diodes Corporation introduces new transistor array products. The ULN62003A consists of seven 500mA rated open-drain transistors, all of which have their sources connected to the same ground pin. This high-current transistor array can drive a variety of loads, such as solenoids, relays, DC motors, and LED displays, and is primarily designed for climate control and home appliances. This product can be used in washing machines, dryers, microwave ovens and air conditioning units.
The Japan Avionics Industry has developed the "MX74 series" of board-to-wire connectors with high-quality transmission performance. This series of products supports 100BASE-T1 of IEEE802.3bw standard. This product is compatible with UTP (Unshielded Twisted Pair: Unshielded Twisted Pair) cables and contributes to the lightweighting of automobile bodies.
Xfuse. LLC has entered the race to produce the next generation of AI vision technologies. The company's proprietary high-performance ISP technology supports numerous different sensor types simultaneously to fuse data-rich HDR video in real-time with minimal latency.
Infineon Technologies AG has combined the hybrid flyback (HFB) controller, XDP digital power controller XDPS2201 and the CoolGaN integrated power stage (IPS) 600V (IGI60F1414A1L) for high-efficiency and high-power density charger and adapter designs.
KDPOF has designed and validated the first 1000BASE-RH SFP module for vehicle optical gigabit connectivity. The design of this new small form-factor pluggable transceiver module is based on a standard SFP supporting MSA registers through I2C bus.The module can function at 100 and 1,000Mb/s. It incorporates the whole 1000BASE-RHC PHY and the header connector for SI-POF optical harness.
Mercury Electronics Europe has released a new range of ultra-miniature, ultra-low phase noise crystal oscillators. The new surface mount HJ22 oscillator provides a 15pF load LVCMOS output from 20 to 50MHz with a typical RMS phase jitter of only 48fs , up to 300fs. They are ideal for embedded automotive applications.
Cutting-edge innovations deliver TLC NAND with the highest performance and wafer density, all in the industry's smallest packages
The isolated Sigma-Delta modulator NSi1303 and NSi1305 series chips newly developed by NOVOSENSE have extremely low offset error and temperature drift, high common mode immunity up to 150kV/us and 5000Vrms electrical isolation certified by UL1577 performance, the above techniques are suitable for current-sampling designs for complex high-voltage systems in typical applications in the industrial and automotive markets.
element14 and Bourns launch new partnership to meet growing demand for advanced magnetic solutions , EMC compliance equipment, signal transformers, common mode choke coils and ferrite cores, etc.
Qorvo introduces seven 750V Silicon Carbide (SiC) FETs in a surface mount D2PAK-7L package. With this package option, Qorvo's SiC FETs can be used for on-board chargers, soft-switching DC/DC converters, battery charging (fast DC and Tailored to fast-growing applications such as IT/server power supplies, it can provide better solutions for high-power applications with higher efficiency, lower conduction losses and superior cost-effectiveness in thermally enhanced packages.
Siemens Digital Industries Software has expanded its integrated circuit (IC) physical verification platform, Calibre, with a range of electronic design automation (EDA) early-stage design verification capabilities that “shift left” the physical and circuit verification tasks to the higher end of the design and verification process. Identify, analyze, and resolve complex IC and system-on-a-chip (SoC) physical verification problems at an early stage, helping IC design teams and companies accelerate tape-out.
Smartphone Electronic Technology Co., Ltd. officially launched the Cellphone Sensor (CS) Series mobile phone application image sensor products SC520CS and SC820CS. Both new products are built with 12-inch wafer technology, equipped with SmartSens' innovative SFCPixel patented technology and ultra-low noise peripheral reading circuit technology
ScioSense announced that the latest product that can accurately detect air quality, the APC1 all-in-one environmental combination sensor, will be the first to be used in related products in China. After being used in related products in China, this environmental combination sensor, which is only the size of a matchbox but has excellent performance, can help hundreds of millions of people get cleaner and healthier air quality.
Infineon has announced the WLC1115 transmitter controller IC, the first product in the new WLC line of controllers, which uses inductive wireless charging technology. In addition, Infineon offers a WLC1115-based and Qi V1.3.2 certified MP A11 wireless charging transmitter reference design solution that can be used in a variety of applications such as smartphones, smart speakers, docking stations, display holders, industrial or medical device accessories.
The Keysight Open Radio Architecture (KORA) solution helped MICAS achieve its first O-RAN certification for its 5G O-RU. The O-RAN conformance certification is issued by the OTIC Certification Center of Zhongguancun Pan-Joint Institute. Keysight Technologies provides advanced design and verification solutions designed to accelerate innovation and create a secure, connected world.
Fibocom Wireless has officially launched the high computing power AI module SCA825-W based on the Qualcomm QCS8250 chip platform, which will be fully applied to the AIoT field of complex video image analysis such as networked medical care, digital signage, smart retail, and video collaboration. Guanghetong AI module enriches the intelligent module product line, AI performance generates strong potential energy, and has accumulated a lot in the field of digital economy applications.
