NXP Producten

BF904,235

NXP

MOSFET N-CH 7V 30MA SOT143

• Transistor Type: N-Channel Dual Gate
• Frequency: 200MHz
• Gain: -
• Voltage - Test: 5V
• Current Rating: 30mA
• Noise Figure: 1dB
• Current - Test: 10mA
• Power - Output: -
• Voltage - Rated: 7V
• Package / Case: SOT-143R
• Supplier Device Package: SOT-143R

package: SOT-143R

BC640,126

NXP

TRANS PNP 80V 1A TO-92

• Transistor Type: PNP
• Current - Collector (Ic) (Max): 1A
• Voltage - Collector Emitter Breakdown (Max): 80V
• Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA
• Current - Collector Cutoff (Max): 100nA (ICBO)
• DC Current Gain (hFE) (Min) @ Ic, Vce: 63 @ 150mA, 2V
• Power - Max: 830mW
• Frequency - Transition: 145MHz
• Operating Temperature: 150°C (TJ)
• Mounting Type: Through Hole
• Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
• Supplier Device Package: TO-92-3

package: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

BZX384-C7V5/ZLX

NXP

DIODE ZENER SOD323

• Voltage - Zener (Nom) (Vz): 7.5V
• Tolerance: ±5%
• Power - Max: 300mW
• Impedance (Max) (Zzt): 15 Ohms
• Current - Reverse Leakage @ Vr: 50nA @ 700mV
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: SC-76, SOD-323
• Supplier Device Package: SC-76-2

package: SC-76, SOD-323

NUR460/L01,112

NXP

DIODE GEN PURP 600V 4A DO201AD

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 600V
• Current - Average Rectified (Io): 4A
• Voltage - Forward (Vf) (Max) @ If: 1.28V @ 4A
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 65ns
• Current - Reverse Leakage @ Vr: 50µA @ 600V
• Capacitance @ Vr, F: -
• Mounting Type: Through Hole
• Package / Case: DO-201AD, Axial
• Supplier Device Package: DO-201AD
• Operating Temperature - Junction: 150°C (Max)

package: DO-201AD, Axial

NX18P3001UK

NXP

IC PWR SWITCH ESD PROT 12WLCSP

• Switch Type: USB Switch
• Number of Outputs: 1
• Ratio - Input:Output: 1:1
• Output Configuration: High Side
• Output Type: N-Channel
• Interface: On/Off
• Voltage - Load: 3 V ~ 30 V
• Voltage - Supply (Vcc/Vdd): Not Required
• Current - Output (Max): 3A
• Rds On (Typ): 62 mOhm
• Input Type: -
• Features: Slew Rate Controlled
• Fault Protection: Over Temperature, UVLO
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 12-UFBGA, WLCSP
• Supplier Device Package: 12-WLCSP (1.6x1.3)

package: 12-UFBGA, WLCSP

N74F10D,623

NXP

IC GATE NAND 3CH 3-INP 14-SO

• Logic Type: NAND Gate
• Number of Circuits: 3
• Number of Inputs: 3
• Features: -
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Quiescent (Max): -
• Current - Output High, Low: 1mA, 20mA
• Logic Level - Low: 0.8V
• Logic Level - High: 2V
• Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Supplier Device Package: 14-SO
• Package / Case: 14-SOIC (0.154", 3.90mm Width)

package: 14-SOIC (0.154", 3.90mm Width)

74LVCH322245AEC:55

NXP

IC BUS TRSCVR 3-ST 32BIT 96LFBGA

• Logic Type: Transceiver, Non-Inverting
• Number of Elements: 4
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 12mA, 12mA
• Voltage - Supply: 1.2 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 96-LFBGA
• Supplier Device Package: 96-LFBGA (13.5x5.5)

package: 96-LFBGA

SC28L202A1DGG,112

NXP

IC UART DUAL W/FIFO 56-TSSOP

• Features: Configurable GPIO, Internal Oscillator, Timer/Counter
• Number of Channels: 1, UART
• FIFO's: 256 Byte
• Protocol: RS485
• Data Rate (Max): 3.125Mbps
• Voltage - Supply: 3.3V, 5V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: -
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Surface Mount
• Package / Case: 56-TFSOP (0.240", 6.10mm Width)
• Supplier Device Package: 56-TSSOP

package: 56-TFSOP (0.240", 6.10mm Width)

MPC8569EVTAUNLB

NXP

IC MPU MPC85XX 1.333GHZ 783BGA

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.333GHz
• Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
• RAM Controllers: DDR2, DDR3, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (8), 1 Gbps (4)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 1.0V, 1.5V, 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

package: 783-BBGA, FCBGA

MC8640VJ1000HE

NXP

IC MPU E600 SGL CORE 994FCCBGA

• Core Processor: PowerPC e600
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 994-BCBGA, FCCBGA
• Supplier Device Package: 994-FCCBGA (33x33)

package: 994-BCBGA, FCCBGA

MCHC11F1CFNE5

NXP

IC MCU 8BIT ROMLESS 68PLCC

• Core Processor: HC11
• Core Size: 8-Bit
• Speed: 5MHz
• Connectivity: SCI, SPI
• Peripherals: POR, WDT
• Number of I/O: 30
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: 512 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V
• Data Converters: A/D 8x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 68-LCC (J-Lead)
• Supplier Device Package: 68-PLCC (25x25)

package: 68-LCC (J-Lead)

LH79525N0Q100A1;55

NXP

IC MCU 32BIT ROMLESS 176LQFP

• Core Processor: ARM7?
• Core Size: 32-Bit
• Speed: 76.2MHz
• Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
• Number of I/O: 86
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.7 V ~ 3.6 V
• Data Converters: A/D 10x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 176-LQFP
• Supplier Device Package: 176-LQFP (20x20)

package: 176-LQFP

MC9S12DJ256CCPV

NXP

IC MCU 16BIT 256KB FLASH 112LQFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, I2C, SCI, SPI
• Peripherals: PWM, WDT
• Number of I/O: 91
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 12K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

package: 112-LQFP

DSP56F803BU80

NXP

IC MCU 16BIT 64KB FLASH 100LQFP

• Core Processor: 56800
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number of I/O: 16
• Program Memory Size: 64KB (32K x 16)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 16
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

package: 100-LQFP

SPC5746CK1MMJ6

NXP

IC MCU 32BIT 3MB FLASH 256MAPBGA

• Core Processor: e200z2, e200z4
• Core Size: 32-Bit Dual-Core
• Speed: 80MHz/160MHz
• Connectivity: CAN, Ethernet, I2C, LIN, SAI, SPI, USB, USB OTG
• Peripherals: DMA, LVD, POR, WDT
• Number of I/O: 178
• Program Memory Size: 3MB (3M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 80x10b, 64x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 256-LBGA
• Supplier Device Package: 256-MAPPBGA (17x17)

package: 256-LBGA

MC9S08AC16CFGER

NXP

IC MCU 8BIT 16KB FLASH 44LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 34
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-LQFP
• Supplier Device Package: 44-LQFP (10x10)

package: 44-LQFP

MC9S08SH16CTLR

NXP

IC MCU 8BIT 16KB FLASH 28TSSOP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 23
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 28-TSSOP

package: 28-TSSOP (0.173", 4.40mm Width)

MPC9446FA

NXP

IC CLK BUFFER 2:10 250MHZ 32LQFP

• Type: Fanout Buffer (Distribution), Divider, Multiplexer
• Number of Circuits: 1
• Ratio - Input:Output: 2:10
• Differential - Input:Output: No/No
• Input: LVCMOS
• Output: LVCMOS
• Frequency - Max: 250MHz
• Voltage - Supply: 2.375 V ~ 3.465 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (9x9)

package: 32-LQFP

KTY83/150,113

NXP

IC TEMP SENSOR DO34

• Resistance in Ohms @ 25°C: 1k
• Resistance Tolerance: -
• Operating Temperature: -55°C ~ 175°C
• Power - Max: -
• Mounting Type: Through Hole
• Package / Case: DO-204AG, DO-34, Axial
• Supplier Device Package: DO-34

package: DO-204AG, DO-34, Axial

MMA2612IKGCWR2

NXP

ACCELEROMETER DSI2.5 16QFN

• Type: Digital
• Axis: X
• Acceleration Range: ±125g
• Sensitivity (LSB/g): 4.096
• Sensitivity (mV/g): -
• Bandwidth: -
• Output Type: PCM
• Voltage - Supply: 6.3 V ~ 30 V
• Features: Selectable Low Pass Filter
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-QFN Exposed Pad
• Supplier Device Package: 16-QFN-EP (6x6)

package: 16-QFN Exposed Pad

MMA6825BKWR2

NXP

ACCELEROMETER 100G SPI 16QFN

• Type: Digital
• Axis: X, Y
• Acceleration Range: ±100g
• Sensitivity (LSB/g): 4.883
• Sensitivity (mV/g): -
• Bandwidth: -
• Output Type: SPI
• Voltage - Supply: 3.135 V ~ 5.25 V
• Features: -
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 16-QFN Exposed Pad
• Supplier Device Package: 16-QFN (6x6)

package: 16-QFN Exposed Pad

MMA6900KQ

NXP

ACCELEROMETER 3.5G PCM/SPI 16QFN

• Type: Digital
• Axis: X, Y
• Acceleration Range: ±3.5g
• Sensitivity (LSB/g): 291
• Sensitivity (mV/g): -
• Bandwidth: 1.2kHz
• Output Type: PCM, SPI
• Voltage - Supply: 3.15 V ~ 5.25 V
• Features: Temperature Sensor
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-QFN Exposed Pad
• Supplier Device Package: 16-QFN-EP (6x6)

package: 16-QFN Exposed Pad

JN5169MOD/02Z

NXP

MODULE WIRELESS MCU

• RF Family/Standard: -
• Protocol: -
• Modulation: -
• Frequency: -
• Data Rate: -
• Power - Output: -
• Sensitivity: -
• Serial Interfaces: -
• Antenna Type: -
• Memory Size: -
• Voltage - Supply: -
• Current - Receiving: -
• Current - Transmitting: -
• Mounting Type: -
• Operating Temperature: -
• Package / Case: -

package: -

MW7IC2750NBR1

NXP

IC PWR AMP RF 2700MHZ TO-272-14

• Frequency: 2.3GHz ~ 2.7GHz
• P1dB: 47dBm (50W)
• Gain: 26dB
• Noise Figure: -
• RF Type: WiMax
• Voltage - Supply: 28V
• Current - Supply: 550mA
• Test Frequency: 2.7GHz
• Package / Case: TO-272-14 Variant, Flat Leads
• Supplier Device Package: TO-272 WB-14

package: TO-272-14 Variant, Flat Leads

SPC5642AF2MVZ2R

NXP

NXP 32-BIT MCU POWER ARCH CORE

• Core Processor: e200z4
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 151
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.25 V
• Data Converters: A/D 40x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 324-BBGA
• Supplier Device Package: 324-TEPBGA (23x23)

package: 324-BBGA

MIMX8QM6CVUFFAB

NXP

MPU I.MX8 QUAD MAX

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

package: -

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SAF4000EL-101S534Y

NXP

SOFTWARE DEFINED RADIO

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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MIMX8QX6GVLFZAC

NXP

I.MX 8X FIPS

• Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
• Number of Cores/Bus Width: 3 Core, 64-Bit
• Speed: 1.2GHz, 264MHz
• Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
• RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
• Graphics Acceleration: Yes
• Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
• Ethernet: 10/100/1000Mbps (2)
• SATA: -
• USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 125°C (TJ)
• Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
• Package / Case: 609-BFBGA
• Supplier Device Package: 609-FBGA (21x21)

package: -

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