NXP Producten

A2T21H360-24SR6

NXP

IC TRANS RF LDMOS

• Transistor Type: LDMOS
• Frequency: 2.14GHz
• Gain: 16.2dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 500mA
• Power - Output: 63W
• Voltage - Rated: 65V
• Package / Case: NI-1230-4LS2L
• Supplier Device Package: NI-1230-4LS2L

package: NI-1230-4LS2L

PDTC144ES,126

NXP

TRANS PREBIAS NPN 500MW TO92-3

• Transistor Type: NPN - Pre-Biased
• Current - Collector (Ic) (Max): 100mA
• Voltage - Collector Emitter Breakdown (Max): 50V
• Resistor - Base (R1) (Ohms): 47k
• Resistor - Emitter Base (R2) (Ohms): 47k
• DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
• Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
• Current - Collector Cutoff (Max): 1µA
• Frequency - Transition: -
• Power - Max: 500mW
• Mounting Type: Through Hole
• Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
• Supplier Device Package: TO-92-3

package: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

ASL2500SHNY

NXP

IC LED BOOST DVR 2PH 32HVQFN

• Type: -
• Topology: -
• Internal Switch(s): -
• Number of Outputs: -
• Voltage - Supply (Min): -
• Voltage - Supply (Max): -
• Voltage - Output: -
• Current - Output / Channel: -
• Frequency: -
• Dimming: -
• Applications: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

PCA9624BS,118

NXP

IC LED DRIVER LINEAR DIM 24HVQFN

• Type: Linear
• Topology: -
• Internal Switch(s): Yes
• Number of Outputs: 8
• Voltage - Supply (Min): 2.3V
• Voltage - Supply (Max): 5.5V
• Voltage - Output: 40V
• Current - Output / Channel: 100mA
• Frequency: 100kHz ~ 1MHz
• Dimming: PWM
• Applications: Backlight
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 24-VFQFN Exposed Pad
• Supplier Device Package: 24-HVQFN (4x4)

package: 24-VFQFN Exposed Pad

74AVCM162834DGG,11

NXP

IC TRANSCVR 3-ST 18BIT 56TSSOP

• Logic Type: Universal Bus Driver
• Number of Circuits: 18-Bit
• Current - Output High, Low: 12mA, 12mA
• Voltage - Supply: 1.2 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 56-TFSOP (0.240", 6.10mm Width)
• Supplier Device Package: 56-TSSOP

package: 56-TFSOP (0.240", 6.10mm Width)

N74F00D,623

NXP

IC GATE NAND 4CH 2-INP 14-SO

• Logic Type: NAND Gate
• Number of Circuits: 4
• Number of Inputs: 2
• Features: -
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Quiescent (Max): -
• Current - Output High, Low: 1mA, 20mA
• Logic Level - Low: 0.8V
• Logic Level - High: 2V
• Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Supplier Device Package: 14-SO
• Package / Case: 14-SOIC (0.154", 3.90mm Width)

package: 14-SOIC (0.154", 3.90mm Width)

HEF4000BT,652

NXP

IC DUAL 3-IN NOR GATE 14-SOIC

• Logic Type: NOR/INVERT Gate
• Number of Circuits: 2
• Number of Inputs: 7 Input (3, 3, 1)
• Schmitt Trigger Input: No
• Output Type: Single-Ended
• Current - Output High, Low: 3mA, 3mA
• Voltage - Supply: 3 V ~ 15 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SO

package: 14-SOIC (0.154", 3.90mm Width)

74HC590N,112

NXP

IC COUNTER REGISTER 8BIT 16DIP

• Logic Type: Binary Counter
• Direction: -
• Number of Elements: 1
• Number of Bits per Element: 8
• Reset: -
• Timing: -
• Count Rate: -
• Trigger Type: Positive Edge
• Voltage - Supply: 2 V ~ 6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

package: 16-DIP (0.300", 7.62mm)

SC68C752BIBS,157

NXP

IC UART DUAL 32HVQFN

• Features: -
• Number of Channels: 2, DUART
• FIFO's: 64 Byte
• Protocol: -
• Data Rate (Max): 5Mbps
• Voltage - Supply: 2.5V, 3.3V, 5V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: Yes
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)

package: 32-VFQFN Exposed Pad

PTN3392BS,518

NXP

IC DISPLAYPORT TO VGA 48HVQFN

• Applications: Desktop, Notebook PCs
• Interface: I2C
• Voltage - Supply: 3 V ~ 3.6 V
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-HVQFN (7x7)
• Mounting Type: Surface Mount

package: 48-VFQFN Exposed Pad

74HC4066PWHL

NXP

IC MUX/DEMUX 16CH ANLG 14TSSOP

• Switch Circuit: SPST - NO
• Multiplexer/Demultiplexer Circuit: 1:1
• Number of Circuits: 4
• On-State Resistance (Max): 95 Ohm
• Channel-to-Channel Matching (ΔRon): 3 Ohm
• Voltage - Supply, Single (V+): 2 V ~ 10 V
• Voltage - Supply, Dual (V±): -
• Switch Time (Ton, Toff) (Max): 30ns, 20ns
• -3db Bandwidth: 200MHz
• Charge Injection: -
• Channel Capacitance (CS(off), CD(off)): 3.5pF
• Current - Leakage (IS(off)) (Max): 1µA
• Crosstalk: -60dB @ 1MHz
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 14-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 14-TSSOP

package: 14-TSSOP (0.173", 4.40mm Width)

MC8641DHX1500KE

NXP

IC MPU MPC86XX 1.5GHZ 1023FCCBGA

• Core Processor: PowerPC e600
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.5GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 1023-BCBGA, FCCBGA
• Supplier Device Package: 1023-FCCBGA (33x33)

package: 1023-BCBGA, FCCBGA

MPC8572PXARLD

NXP

IC MPU MPC85XX 1.067GHZ 1023BGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.067GHz
• Co-Processors/DSP: Signal Processing; SPE
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 1023-BFBGA, FCBGA
• Supplier Device Package: 1023-FCPBGA (33x33)

package: 1023-BFBGA, FCBGA

KMPC862TCZQ80B

NXP

IC MPU MPC8XX 80MHZ 357BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 80MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (4), 10/100 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 115°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

package: 357-BBGA

MCF51AG128VQH

NXP

IC MCU 32BIT 128KB FLASH 64QFP

• Core Processor: Coldfire V1
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: DMA, LVD, PWM, WDT
• Number of I/O: 53
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 19x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-QFP
• Supplier Device Package: 64-QFP (14x14)

package: 64-QFP

MCF5208CVM166

NXP

IC MCU 32BIT ROMLESS 196MAPBGA

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 166.67MHz
• Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
• Peripherals: DMA, WDT
• Number of I/O: 50
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.4 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 196-LBGA
• Supplier Device Package: 196-MAPBGA (15x15)

package: 196-LBGA

LPC1752FBD80,551

NXP

IC MCU 32BIT 64KB FLASH 80LQFP

• Core Processor: ARM? Cortex?-M3
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
• Number of I/O: 52
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
• Data Converters: A/D 6x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 80-LQFP
• Supplier Device Package: 80-LQFP (12x12)

package: 80-LQFP

IP4387CX4/LF,315

NXP

TVS DIODE 8VWM 13VC 4WLCSP

• Type: Zener
• Unidirectional Channels: 1
• Bidirectional Channels: -
• Voltage - Reverse Standoff (Typ): 8V (Max)
• Voltage - Breakdown (Min): 10V
• Voltage - Clamping (Max) @ Ipp: 13V
• Current - Peak Pulse (10/1000µs): 33A (8/20µs)
• Power - Peak Pulse: -
• Power Line Protection: No
• Applications: General Purpose
• Capacitance @ Frequency: 290pF @ 1MHz
• Operating Temperature: -35°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 4-UFBGA, WLCSP
• Supplier Device Package: 4-WLCSP (0.76x0.76)

package: 4-UFBGA, WLCSP

JN5168/001,515

NXP

IC RF TXRX+MCU 802.15.4 40-VFQFN

• Type: TxRx + MCU
• RF Family/Standard: 802.15.4
• Protocol: ZigbeePRO?
• Modulation: O-QPSK
• Frequency: 2.4GHz
• Data Rate (Max): 1Mbps
• Power - Output: 2.5dBm
• Sensitivity: -96dBm
• Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM
• Serial Interfaces: I2C, JTAG, SPI, UART
• GPIO: 20
• Voltage - Supply: 2 V ~ 3.6 V
• Current - Receiving: 17mA
• Current - Transmitting: 15.3mA
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 40-VFQFN Exposed Pad

package: 40-VFQFN Exposed Pad

MKL81Z128VMC7R

NXP

KINETIS L 32-BIT MCU ARM CORTEX

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: I²C, SPI, UART/USART, USB OTG
• Peripherals: DMA, I²S, LVD, POR, PWM, WDT
• Number of I/O: 85
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 96K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 12x16b, D/A 1x6b, 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 121-LFBGA
• Supplier Device Package: 121-MAPBGA (8x8)

package: 121-LFBGA

SPC5603BAMLL4

NXP

NXP 32-BIT MCU POWER ARCH CORE

• Core Processor: e200z0h
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: CANbus, I²C, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 79
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 28K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 28x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

package: 100-LQFP

FS32K146UAT0VLQT

NXP

S32K146 144 LQFP

• Core Processor: ARM® Cortex®-M4F
• Core Size: 32-Bit
• Speed: 112MHz
• Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 24x12b, D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

package: 144-LQFP

S908QY4AE0CDTER

NXP

8-BIT MCU HC08 CORE 4KB FLASH

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: -
• Peripherals: LVD, POR, PWM
• Number of I/O: 13
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

package: 16-TSSOP (0.173", 4.40mm Width)

S912ZVC64AMLFR

NXP

IC MCU 16BIT 64KB FLASH 48LQFP

• Core Processor: S12Z
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: CANbus, I2C, SCI, SPI
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number of I/O: 28
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
• Data Converters: A/D 10x10b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

package: -

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MIMX8QX6AVLFZAC

NXP

IC MPU 609FBGA

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: 609-BFBGA
• Supplier Device Package: 609-FBGA (21x21)

package: -

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LS1028AXN7PQA

NXP

IC MPU QORIQ 1.5GHZ 448FBGA

• Core Processor: ARM® Cortex®-A72
• Number of Cores/Bus Width: 2 Core, 64-Bit
• Speed: 1.5GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3L, DDR4
• Graphics Acceleration: Yes
• Display & Interface Controllers: -
• Ethernet: 1Gbps (1), 2.5Gbps (5)
• SATA: SATA 6Gbps (1)
• USB: USB 3.0 (2)
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Secure Boot, TrustZone®
• Package / Case: 448-BFBGA
• Supplier Device Package: 448-FBGA (17x17)

package: -

FB32K144UAT0VLHT

NXP

S32K144 32-BIT MCU, ARM CORTEX-M

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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LPC5536JBD64MP

NXP

IC MCU 32BIT 256KB FLASH 64TQFP

• Core Processor: ARM® Cortex®-M33
• Core Size: 32-Bit Single-Core
• Speed: 150MHz
• Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Number of I/O: 39
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
• Data Converters: A/D 13x16b; D/A 1x12b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-TQFP Exposed Pad
• Supplier Device Package: 64-HTQFP (10x10)

package: -

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