NXP Producten

MRF6V2010NBR1

NXP

FET RF 110V 220MHZ TO272-2

• Transistor Type: LDMOS
• Frequency: 220MHz
• Gain: 23.9dB
• Voltage - Test: 50V
• Current Rating: -
• Noise Figure: -
• Current - Test: 30mA
• Power - Output: 10W
• Voltage - Rated: 110V
• Package / Case: TO-272BC
• Supplier Device Package: TO-272-2

package: TO-272BC

MRF5S9070NR1

NXP

FET RF 68V 880MHZ TO-270-2

• Transistor Type: LDMOS
• Frequency: 880MHz
• Gain: 17.8dB
• Voltage - Test: 26V
• Current Rating: -
• Noise Figure: -
• Current - Test: 600mA
• Power - Output: 14W
• Voltage - Rated: 68V
• Package / Case: TO-270AA
• Supplier Device Package: TO-270-2

package: TO-270AA

TLVH431ACDBZR,215

NXP

IC VREF SHUNT ADJ SOT23-3

• Reference Type: Shunt
• Output Type: Adjustable
• Voltage - Output (Min/Fixed): 1.24V
• Voltage - Output (Max): 18V
• Current - Output: 70mA
• Tolerance: ±1%
• Temperature Coefficient: -
• Noise - 0.1Hz to 10Hz: -
• Noise - 10Hz to 10kHz: -
• Voltage - Input: -
• Current - Supply: -
• Current - Cathode: 80µA
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: TO-236AB (SOT23)

package: TO-236-3, SC-59, SOT-23-3

MCZ33099EGR2

NXP

IC VREG ALTERNATOR ADAPT 16-SOIC

• Applications: Automotive
• Current - Supply: 6.5mA
• Voltage - Supply: 7 V ~ 18 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SOIC

package: 16-SOIC (0.295", 7.50mm Width)

N74F521N,602

NXP

IC COMPARATOR IDENTITY 8B 20DIP

• Type: Identity Comparator
• Number of Bits: 8
• Output: Active Low
• Output Function: A=B
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Output High, Low: 1mA, 20mA
• Max Propagation Delay @ V, Max CL: 9.5ns @ 5V, 50pF
• Current - Quiescent (Iq): -
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 20-DIP (0.300", 7.62mm)
• Mounting Type: Through Hole

package: 20-DIP (0.300", 7.62mm)

74AHC244PW/AUJ

NXP

IC BUFF/DVR TRI-ST DUAL 20TSSOP

• Logic Type: Buffer, Non-Inverting
• Number of Elements: 2
• Number of Bits per Element: 4
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 8mA, 8mA
• Voltage - Supply: 2 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

package: 20-TSSOP (0.173", 4.40mm Width)

N74F242D,602

NXP

IC BUS TXRX TRI-ST 4BIT 14SOIC

• Logic Type: Transceiver, Inverting
• Number of Elements: 1
• Number of Bits per Element: 4
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 15mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SO

package: 14-SOIC (0.154", 3.90mm Width)

SC68C752BIB48,157

NXP

IC UART DUAL 48LQFP

• Features: -
• Number of Channels: 2, DUART
• FIFO's: 64 Byte
• Protocol: -
• Data Rate (Max): 5Mbps
• Voltage - Supply: 2.5V, 3.3V, 5V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: Yes
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

package: 48-LQFP

PCA9701D,112

NXP

IC SPI GPI 16-BIT 24-SOIC

• Number of I/O: 16 (Input Only)
• Interface: SPI Serial
• Interrupt Output: Yes
• Features: -
• Output Type: Push-Pull
• Current - Output Source/Sink: -
• Clock Frequency: 5MHz
• Voltage - Supply: 2.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 24-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 24-SO

package: 24-SOIC (0.295", 7.50mm Width)

NX5DV330PW,112

NXP

IC VIDEO MUX/DEMUX 1X2 16TSSOP

• Applications: Video
• Multiplexer/Demultiplexer Circuit: 2:1
• Switch Circuit: -
• Number of Channels: 4
• On-State Resistance (Max): 10 Ohm
• Voltage - Supply, Single (V+): 4 V ~ 5.5 V
• Voltage - Supply, Dual (V±): -
• -3db Bandwidth: 300MHz
• Features: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

package: 16-TSSOP (0.173", 4.40mm Width)

P1010NSE5HHA

NXP

IC MPU Q OR IQ 1.0GHZ 425TEBGA

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Security; SEC 4.4
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (3)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
• Package / Case: 425-FBGA
• Supplier Device Package: 425-TEPBGA I (19x19)

package: 425-FBGA

XPC850DSLCVR50BU

NXP

IC MPU MPC8XX 50MHZ 256BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 50MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 256-BBGA
• Supplier Device Package: 256-PBGA (23x23)

package: 256-BBGA

MPC8548EVJAUJD

NXP

IC MPU MPC85XX 1.333GHZ 783BGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.333GHz
• Co-Processors/DSP: Signal Processing; SPE, Security; SEC
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

package: 783-BBGA, FCBGA

MCF51MM256VMB

NXP

IC MCU 32BIT 256KB FLASH 81BGA

• Core Processor: Coldfire V1
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: CAN, EBI/EMI, I2C, SCI, SPI, USB OTG
• Peripherals: LVD, PWM, WDT
• Number of I/O: 48
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x16b, D/A 1x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 81-LBGA
• Supplier Device Package: 81-MAPBGA (10x10)

package: 81-LBGA

S912XEP768J5CAGR

NXP

IC MCU 16BIT 768KB FLASH 144LQFP

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 119
• Program Memory Size: 768KB (768K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 48K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 24x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

package: 144-LQFP

MC9RS08KA2CPC

NXP

IC MCU 8BIT 2KB FLASH 8DIP

• Core Processor: RS08
• Core Size: 8-Bit
• Speed: 10MHz
• Connectivity: -
• Peripherals: LVD, POR, WDT
• Number of I/O: 4
• Program Memory Size: 2KB (2K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 63 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-PDIP

package: 8-DIP (0.300", 7.62mm)

MCF5282CVM66

NXP

IC MCU 32BIT 512KB FLASH 256BGA

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 66MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, SPI, UART/USART
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number of I/O: 150
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 256-LBGA
• Supplier Device Package: 256-MAPBGA

package: 256-LBGA

MPXH6400AC6T1

NXP

SENSOR ABS PRESS 58PSI MAX

• Pressure Type: Absolute
• Operating Pressure: 2.9 PSI ~ 58.02 PSI (20 kPa ~ 400 kPa)
• Output Type: Analog Voltage
• Output: 0.2 V ~ 4.8 V
• Accuracy: ±1.5%
• Voltage - Supply: 4.64 V ~ 5.36 V
• Port Size: Male - 0.13" (3.3mm) Tube
• Port Style: Barbless
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: 232.06 PSI (1600 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-SSOP (0.335", 8.50mm Width), Top Port
• Supplier Device Package: 8-SSOP

package: 8-SSOP (0.335", 8.50mm Width), Top Port

MPX2300DT1

NXP

PRESSURE SENSE MED 4SIP CHIP PAK

• Pressure Type: Differential
• Operating Pressure: 5.8 PSI (40 kPa)
• Output Type: Wheatstone Bridge
• Output: 0 mV ~ 3.006 mV (6V)
• Accuracy: ±1.5%
• Voltage - Supply: 6 V ~ 10 V
• Port Size: -
• Port Style: No Port
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: 125 PSI (861.84 kPa)
• Operating Temperature: 15°C ~ 40°C
• Package / Case: 4-SIP Module
• Supplier Device Package: -

package: 4-SIP Module

MMA2612IKWR2

NXP

ACCELEROMETER DSI2.5 16QFN

• Type: Digital
• Axis: X
• Acceleration Range: ±125g
• Sensitivity (LSB/g): 4.096
• Sensitivity (mV/g): -
• Bandwidth: -
• Output Type: PCM
• Voltage - Supply: 6.3 V ~ 30 V
• Features: Selectable Low Pass Filter
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-QFN Exposed Pad
• Supplier Device Package: 16-QFN-EP (6x6)

package: 16-QFN Exposed Pad

SX1534KVWT1

NXP

ACCELEROMETER

• Type: -
• Axis: -
• Acceleration Range: -
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): -
• Bandwidth: -
• Output Type: -
• Voltage - Supply: -
• Features: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

TDA8035HN/C2/S1EL

NXP

HIGH INTEGRATED AND LOW POWER SM

• Applications: -
• Interface: Analog
• Voltage - Supply: 2.7 V ~ 5.5 V
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)
• Mounting Type: Surface Mount

package: 32-VFQFN Exposed Pad

MC33772BTA2AE

NXP

BCC6

• Function: Battery Cell Controller
• Battery Chemistry: Lithium-Ion
• Number of Cells: 3 ~ 6
• Fault Protection: Over/Under Voltage
• Interface: SPI
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: -
• Supplier Device Package: -

package: -

SPC5644CF0MLT1R

NXP

NXP 32-BIT MCU DUAL POWER ARCH

• Core Processor: e200z4d, e200z0h
• Core Size: 32-Bit Dual-Core
• Speed: 80MHz/120MHz
• Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 177
• Program Memory Size: 1.5MB (1.5M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 192K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 33x10b, 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 208-LQFP
• Supplier Device Package: 208-TQFP (28x28)

package: 208-LQFP

KC9S08AW60CFUE

NXP

NO DESCRIPTION

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

Request a Quote

MCXN546VNLT

NXP

IC MCX N54 150MHZ DUAL CORE NPU

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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A5000R2HQ1-Z016UZ

NXP

IC EDGE LOCK SEC AUTH 20HX2QFN

• Type: Edge Lock Secure Authenticator
• Applications: -
• Mounting Type: Surface Mount
• Package / Case: 20-XFQFN Exposed Pad
• Supplier Device Package: 20-HX2QFN (3x3)

package: -

MIMX8DX6CVLFZAC

NXP

MIMX8DX6CVLFZAC

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

package: -

Request a Quote