NXP Producten

PSMN010-25YLC,115

NXP

MOSFET N-CH 25V 39A LFPAK

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 25V
• Current - Continuous Drain (Id) @ 25°C: 39A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
• Vgs(th) (Max) @ Id: 1.95V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 11nC @ 10V
• Input Capacitance (Ciss) (Max) @ Vds: 678pF @ 12V
• Vgs (Max): ±20V
• FET Feature: -
• Power Dissipation (Max): 30W (Tc)
• Rds On (Max) @ Id, Vgs: 10.6 mOhm @ 10A, 10V
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: LFPAK56, Power-SO8
• Package / Case: SC-100, SOT-669

package: SC-100, SOT-669

MRF8S26060HSR5

NXP

FET RF 65V 2.69GHZ

• Transistor Type: LDMOS
• Frequency: 2.69GHz
• Gain: 16.3dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 450mA
• Power - Output: 15.5W
• Voltage - Rated: 65V
• Package / Case: NI-400S-240
• Supplier Device Package: NI-400S-240

package: NI-400S-240

PZM4.7NB3,115

NXP

DIODE ZENER 4.7V 300MW SMT3

• Voltage - Zener (Nom) (Vz): 4.7V
• Tolerance: ±2%
• Power - Max: 300mW
• Impedance (Max) (Zzt): 80 Ohms
• Current - Reverse Leakage @ Vr: 3µA @ 1V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SMT3; MPAK

package: TO-236-3, SC-59, SOT-23-3

TEA1611T/N1,518

NXP

IC RESONANT CONV CTRLR 20SOIC

• Applications: Resonant Converter Controller
• Voltage - Input: -
• Voltage - Supply: 11 V ~ 13 V
• Current - Supply: 2.4mA
• Operating Temperature: -25°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SO

package: 20-SOIC (0.295", 7.50mm Width)

PTN3311D,118

NXP

IC XLATR HS SERIAL LOGIC 8SOIC

• Translator Type: Mixed Signal
• Channel Type: Unidirectional
• Number of Circuits: 1
• Channels per Circuit: 1
• Voltage - VCCA: -
• Voltage - VCCB: -
• Input Signal: PECL
• Output Signal: LVDS
• Output Type: Differential
• Data Rate: 800Mbps
• Operating Temperature: -40°C ~ 85°C (TA)
• Features: -
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

package: 8-SOIC (0.154", 3.90mm Width)

74ABT540D,623

NXP

IC BUFF INVERT 5.5V 20SOIC

• Logic Type: Buffer, Inverting
• Number of Elements: 1
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SO

package: 20-SOIC (0.295", 7.50mm Width)

GTL2034PW,118

NXP

IC GTL TO GTL BUFF 4BIT 14TSSOP

• Logic Type: Buffer, Non-Inverting
• Number of Elements: 4
• Number of Bits per Element: 1
• Input Type: -
• Output Type: Open Drain
• Current - Output High, Low: -, 40mA
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 14-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 14-TSSOP

package: 14-TSSOP (0.173", 4.40mm Width)

MPC8544AVTALFA

NXP

IC MPU MPC85XX 667MHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 667MHz
• Co-Processors/DSP: Signal Processing; SPE
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

package: 783-BBGA, FCBGA

MPC8560CPX667JC

NXP

IC MPU MPC85XX 667MHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 667MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DDR, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: -
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 784-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

package: 784-BBGA, FCBGA

BSC9132NXE7KNKB

NXP

IC MPU Q OR IQ 1.333GHZ 780FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.333GHz
• Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Boot Security, Cryptography, Random Number Generator
• Package / Case: 780-BFBGA, FCBGA
• Supplier Device Package: 780-FCBGA (23x23)

package: 780-BFBGA, FCBGA

MPC8313EZQAGDC

NXP

IC MPU MPC83XX 400MHZ 516BGA

• Core Processor: PowerPC e300c3
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: Security; SEC 2.2
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography
• Package / Case: 516-BBGA Exposed Pad
• Supplier Device Package: 516-TEPBGA (27x27)

package: 516-BBGA Exposed Pad

MPC5200CVR400B

NXP

IC MPU MPC52XX 400MHZ 272BGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (1)
• SATA: -
• USB: USB 1.1 (2)
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: -40°C ~ 85°C (TA)
• Security Features: -
• Package / Case: 272-BBGA
• Supplier Device Package: 272-PBGA (27x27)

package: 272-BBGA

LH7A404N0F000B3,55

NXP

IC MCU 32BIT ROMLESS 324LFBGA

• Core Processor: ARM9?
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, PS/2, SmartCard, SPI, SSI, SSP, UART/USART, USB
• Peripherals: AC'97, DMA, LCD, POR, PWM, WDT
• Number of I/O: 64
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 80K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 9x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 324-LFBGA
• Supplier Device Package: 324-LFBGA (17x17)

package: 324-LFBGA

MC9S12C128CFAE

NXP

IC MCU 16BIT 128KB FLASH 48LQFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number of I/O: 31
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

package: 48-LQFP

MKL14Z32VFM4

NXP

IC MCU 32BIT 32KB FLASH 32QFN

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
• Number of I/O: 28
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 9x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-QFN (5x5)

package: 32-VFQFN Exposed Pad

PCK2023DL,512

NXP

IC CLOCK GENERATOR SSOP56

• Type: Spread Spectrum Clock Generator
• PLL: Yes
• Input: Crystal
• Output: Clock
• Number of Circuits: 1
• Ratio - Input:Output: 1:22
• Differential - Input:Output: No/Yes
• Frequency - Max: 200MHz
• Divider/Multiplier: Yes/No
• Voltage - Supply: 3.135 V ~ 3.465 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 56-BSSOP (0.295", 7.50mm Width)
• Supplier Device Package: 56-SSOP

package: 56-BSSOP (0.295", 7.50mm Width)

MMA5248LWR2

NXP

ACCELEROMETER 480G PCM/SPI 16LGA

• Type: Digital
• Axis: X
• Acceleration Range: ±480g
• Sensitivity (LSB/g): 1
• Sensitivity (mV/g): -
• Bandwidth: -
• Output Type: PCM, SPI
• Voltage - Supply: 4.2 V ~ 17 V
• Features: Selectable Low Pass Filter
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-VFLGA
• Supplier Device Package: 16-LGA (3x3)

package: 16-VFLGA

MMA7368FLR1

NXP

ACCELEROMETER 1.5G 14LGA

• Type: -
• Axis: -
• Acceleration Range: -
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): -
• Bandwidth: -
• Output Type: -
• Voltage - Supply: -
• Features: -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 14-VFLGA
• Supplier Device Package: 14-LGA (3x5)

package: 14-VFLGA

MMA3201KEG

NXP

ACCELEROMETER 45G ANALOG 20SOIC

• Type: Analog
• Axis: X, Y
• Acceleration Range: ±45g
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): 50
• Bandwidth: 400Hz
• Output Type: Analog Voltage
• Voltage - Supply: 4.75 V ~ 5.25 V
• Features: -
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SOIC

package: 20-SOIC (0.295", 7.50mm Width)

OM27462CDK

NXP

DEV KIT FOR PN7360 PN7362 PN7462

• Type: Near Field Communication
• Frequency: -
• For Use With/Related Products: PN7360, PN7362, PN7462
• Supplied Contents: Board, Samples

package: -

MC33591FTAER2

NXP

IC RF RECEIVER 315 434MHZ 24LQFP

• Frequency: 315MHz, 434MHz
• Sensitivity: -105dBm
• Data Rate (Max): 11 kBaud
• Modulation or Protocol: FSK, OOK
• Applications: General Data Transfer
• Current - Receiving: 5.7mA
• Data Interface: PCB, Surface Mount
• Memory Size: -
• Antenna Connector: PCB, Surface Mount
• Features: -
• Voltage - Supply: 1.9 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 24-LQFP
• Supplier Device Package: 24-LQFP (4x4)

package: 24-LQFP

S912XDG256F1MAA

NXP

16-BIT MCU S12X CORE 256KB FLA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CANbus, I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 59
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 14K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 8x10b, 16x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 80-QFP
• Supplier Device Package: 80-QFP (14x14)

package: 80-QFP

MFS5600AMMA8ESR2

NXP

DUAL 36V AUTOMOTIVE DC-DC CONTRO

• Applications: -
• Current - Supply: 140µA
• Voltage - Supply: 2.7V ~ 36V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)

package: -

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MIMXRT1172DVMAA

NXP

IC MCU 32BIT EXT MEM 289MAPBGA

• Core Processor: ARM® Cortex®-M7
• Core Size: 32-Bit Single-Core
• Speed: 800MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
• Number of I/O: 13
• Program Memory Size: -
• Program Memory Type: External Program Memory
• EEPROM Size: -
• RAM Size: 2M x 8
• Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
• Data Converters: A/D 20x12b SAR; D/A 1x12b
• Oscillator Type: External, Internal
• Operating Temperature: 0°C ~ 95°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 289-LFBGA
• Supplier Device Package: 289-LFBGA (14x14)

package: -

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TJA1441ATK-0Z

NXP

IC TRANSCEIVER HALF 1/1 8HVSON

• Type: Transceiver
• Protocol: CANbus
• Number of Drivers/Receivers: 1/1
• Duplex: Half
• Receiver Hysteresis: 50 mV
• Data Rate: 5Mbps
• Voltage - Supply: 4.5V ~ 5.5V
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 8-VDFN Exposed Pad
• Supplier Device Package: 8-HVSON (3x3)

package: -

SAF7754EL-N208ZK

NXP

DIRANA3 SINGLE AM FM HIFI

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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FH32K144UFT0VLLT

NXP

S32K144 32-BIT MCU, ARM CORTEX-M

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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SPC5606BAMLQ6

NXP

NXP 32-BIT MCU, POWER ARCH CORE

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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