Pagina 8 - Nieuwste technologieën van Infineon Technologies | Heisener Electronics
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Nieuwste technologieën van Infineon Technologies

Archief 155
Pagina  8/9
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2022-02-06, The TOLL series offers improved robustness and extended life

Applications including e-scooters, e-forklifts and other LEVs, as well as power tools and battery management systems, necessitate high current rating, ruggedness and extended lifetime. Infineon Technologies AG answers these demands by providing more choices to power system designers to satisfy diverse design requirements and deliver maximum performance in the smallest space.

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2022-02-05, Single channel door drive IC series integrated electrical isolation

Infineon's growing portfolio of single-channel door drive ics now includes the new EiceDRIVER 1EDB single-channel door drive ICS family, providing 3kVrms (UL 1577) of current input-output isolation. The new series consists of four sections (1EDB6275F, 1EDB7275F, 1EDB8275F and 1EDB9275F) and is optimized for high/low side applications. All products offer independent and very low ohm (0.95 ohms) sources and (0.48 ohms)sink outputs for ease of design, providing the typical drive strength of 5.4a peak source and 9.8A peak sink

Technology Cover

2022-01-27, New traction inverter power module

Infineon Technologies has introduced a simple backpack with automotive performance 2B EDT2, a flexible, retractable half-bridge power module. Another unique feature of this module is the plug-and-play approach, which simplifies module integration.

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2022-01-21, The new compensation package based on 40nm technology provides superior contactless performance

Infineon Technologies AG has launched its SECORA Pay payment solution based on the latest 40nm technology platform. The plug and play solution draws on extensive expertise in contactless payment technology and uses its SOLID FLASH chip platform. Offers components including new applets and custom value-added products standard payment cards (SECORA Payment S), as well as multi-application cards (SECORA Payment X) and off-the-shelf solutions

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2022-01-19, First space-grade FPGA radiation-resistant NOR flash

To meet the growing demand for high reliability memory, Infineon Technologies has announced the industry's first high-density RadTol NOR flash product that conforms to the MIL-PRF-38535 QML-V process (QML-V equivalent). The 256Mb and 512Mb RadTol NOR Flash non-volatile memory provides superior, low-pin number, single-chip solutions for applications including FPGA configuration, image storage, microcontroller data, and startup code storage. The device can be programmed in the system via FPGA or standalone programmer and is offered in the same 36-lead ceramic flat package

Technology Cover

2022-01-15, Supports higher power USB PD 3.1 high voltage MCU

Infineon Technologies has launched the industry's first high-voltage MCU supporting USBPD 3.1. Ez-pd PMG1 (Power Delivery Microcontroller Gen1) is the company's first GENERATION USB PD MCU and supports higher Power capabilities as defined in the USB PD 3.1 specification. The series also integrates a market-proven USB PD stack to promote reliable performance and interoperability. Help consumers make their daily lives easier, safer and more environmentally friendly

Technology Cover

2022-01-14, The company jointly accelerates the technology development of GaN power devices

Infineon Technologies and Panasonic Have signed an agreement to jointly develop and produce their second generation (Gen2) GaN technology, providing higher efficiency and power density levels. The equipment will provide ease of use and improved cost performance targeting high and low power SMPS applications, renewable energy, motor drive applications and more.

Technology Cover

2022-01-12, The MCU family achieves PSA Level 2 certification for more secure iot devices

Infineon technologies has received Arm Platform Security Architecture (PSA) Level 2 certification for PSoC 64 MCU standard security devices. It is the first PSA level 1 processor of the Arm Cortex-M processor. Ideal for cloud-connected applications

Technology Cover

2022-01-05, The commitment to six new research projects and the expansion of quantum computing pairs

Infineon has strengthened its commitment to developing quantum computing technology in Germany and Europe. In addition to previously established programs and partnerships, the chipmaker is involved in six further research projects that are part of the German federal government's economic stimulus plan for future quantum technology, which aims to overcome obstacles in the application of quantum technology

Technology Cover

2021-12-18, The new CO2 sensor provides an innovative solution for accurate indoor air quality

Infineon Technologies now offer an innovative CO2 sensor that may be employed to monitor indoor air quality and decrease energy costs. Suitable applications include ventilation, air conditioning systems, portable room air monitoring devices and smart speakers.

Technology Cover

2021-11-07, Double high side door drive SPI protects the battery system

Infineon Technologies recently launched an intelligent door driver EiceDRIVER 2ED4820-EM with SPI interface

Technology Cover

2021-11-05, The hardware security module ensures that the vehicle communicates with everything

Infineon Technologies AG recently launched a plug and play security solution for v2x - sls37 v2x hardware security module (HSM). And obtained the common criteria EAL4 + certification, which is expected to become the mandatory certification of the European v2x system.

Technology Cover

2021-09-22, Infineon - First radiation-tolerant NOR Flash memory for space-grade FPGAs

Space-grade FPGAs need reliable, high-density non-volatile memories that include their boot configurations. To address the increasing demand for high-reliability memories, Infineon Technologies has announced the industry’s first high-density RadTol NOR Flash memory products qualified to MIL-PRF-38535’s QML-V flow (QML-V Equivalent).

Technology Cover

2021-06-30, Infineon - Highly flexible gate driver families with reinforced isolation

Infineon Technologies AG has extended its easy-to-design EiceDRIVER X3 Compact (1ED31xx) and the highly flexible EiceDRIVER X3 Enhanced Analog (1ED34xx) and Digital (1ED38xx) gate driver families.

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2021-06-26, Infineon - High-density SRAM simplifies on-system satellite image processing

Infineon Technologies has launched its next-generation 144Mb Quad Data Rate II+ (QDR-II+) SRAM that is certified to the DLA Qualified Manufacturers List Class V (QML-V).

Technology Cover

2021-06-24, Infineon - Power switch family for applications in the 30W to 500W power range

Infineon Technologies AG has added the new CoolGaN IPS family of integrated power stage (IPS) products to its wide portfolio of WBG power devices. The initial IPS portfolio comprises half-bridge and single-channel products aimed at low-to-medium power applications, including chargers and adapters and SMPS.

Technology Cover

2021-03-01, Infineon Technologies - Three phase gate driver offers superior robustness

Infineon Technologies widens its level-shift EiceDRIVER portfolio with a 1200V three-phase gate driver. It is founded on the company’s unique silicon-on-insulator (SOI) technology.

Technology Cover

2020-04-02, Infineon - Low-side gate drivers offer integrated over-current protection

Infineon 1ED44175N01B 25V Low-Side Gate Drivers provide integrated OCP, fault reporting, and facilitate functionality.