TE Connectivity’s Deutsch 369 connector series. A high-reliability, lightweight, compact and cost-efficient interconnect solution, the 369 Series interconnects withstand vibration, are fully sealed and suit aerospace and other harsh-environment applications.
Analog Devices’ ADA4350 is an analog front end for photodetectors or other sensors whose output produces a current proportional to the sensed parameter or voltage input applications where the system requires the user to select between very precise gain levels to maximize the dynamic range.
The STM32F7 series of high-performance MCUs with ARM Cortex-M7 core takes advantage of STMicroelectronics’ ART Accelerator as well as an L1 cache to deliver the maximum theoretical performance of the Cortex-M7, says the company.
The Texas Instruments (TI) ONET1130EP is an integrated modulator driver and limiting amplifier designed to operate from 1Gbps to 11.7Gbps. Optical and electrical loopback are included and a two-wire serial interface allows digital control of the features.
Analog Devices’ AD9684 14-Bit 500MSPS LVDS dual analog-to-digital converters (ADCs). The devices feature an on-chip buffer and a sample-and-hold circuit designed for low power, small size, and ease-of-use.
Schurter has announced its PSE HI switches can now be delivered with raised symbols, letters and numbers in addition to various colours, or legend inscriptions.
IXYS X-Class power MOSFETs. The high-power density n-channel enhancement-mode MOSFETs are easy to mount and have a low RDS(ON) and QG with a low package inductance.
Cypress Semiconductor has introduced a new 1Mb nonvolatile static random access memory (nvSRAM) with a Quad serial peripheral interface (SPI). The Quad SPI interface enables the new nvSRAM to exceed the data throughput of larger parallel interface devices with a smaller footprint.
The high-efficiency STMicroelectronics L99LD01 constant-current LED driver is aimed at applications such as automotive day time running lights and LED headlamps.
Texas Instruments (TI) has introduced the industry’s first 20A and 30A synchronous DC-DC buck converters with frequency synchronization for low-noise and reduced EMI/EMC and a PMBus interface for adaptive voltage scaling (AVS).
Avago Technologies’ industrial-grade high-temperature (-40C to 115C), AEDT-981x three-channel optical incremental encoder modules. They offer a built-in interpolator circuit and enable high resolution in a compact module for motion-control applications.
Toshiba has unveiled its new generation of BiCS FLASH, a three-dimensional (3D) stacked cell structure flash memory – a structure stacking Flash memory cells vertically on a silicon substrate to realise significant density improvements over planar NAND Flash memory, where cells are formed on the silicon substrate.
Electronic devices are becoming ever more compact and densely packed with components, with this comes an increase in the possibility of malfunctions influencing circuit operation due to ion migration. In response, Murata has developed a water-repellent monolithic ceramic capacitor by applying an innovative surface treatment.
APEM’s new NVG-compatible LED indicators are compliant with MIL-STD-3009 and are rated for NVIS indication in cockpits and for external lighting.
New from Texas Instruments, the AMC1304 is a precision, delta-sigma (ΔΣ) modulator with the output separated from the input circuitry by a capacitive double isolation barrier that is highly resistant to magnetic interference.
The recently expanded BergStak connector product range is offering 0.5mm mezzanine connectors available in 3mm to 6mm stack height options in 0.5mm increments.
Freescale’s PF3000 power management integrated circuit (PMIC) features a configurable architecture that supports numerous outputs with various current ratings.
Microsemi announced availability of the smallest radio module it has ever produced. Measuring just 5.5mm x 4.5mm x 1.5mm, the ZL70323 is optimized for implantable medical devices such as pacemakers, cardiac defibrillators and neurostimulators.
