Toshiba Electronic Components & Storage Devices Inc. has introduced the fast recovery diode 3000GXHH32 in a press-mounted package with a newly developed high speed diode chip. The product is suitable for dc power transmission system, industrial motor drive system use of power converters. Its absolute maximum voltage and current ratings are 4500V (reverse repeat peak voltage) and 3000A (dc forward current), respectively.
IAR Embedded Workbench for Arm 9.30 has fully supported Jihai Semiconductor APM32 series MCU chips, which are widely used in smart home, high-end consumer electronics, automotive electronics, industrial control, smart energy and other fields, escorting domestic chips
The Bluetooth Special Interest Group (SIG), the industry association responsible for developing Bluetooth technology, announced today that it has completed the development of a full set of specifications for the next generation of Bluetooth audio, Low Energy Audio (LE Audio). Low-power audio improves wireless audio performance, adds support for hearing aids, and introduces Auracast broadcast audio, a new Bluetooth feature that will allow us to better connect with others and the world around us.
Stmicroelectronics has introduced the third generation Bluetooth System chip (SoC), which adds Bluetooth directional technology for location tracking and real-time positioning. The new product uses Bluetooth-specific technology, including Angle of arrival (AoA) and Angle of departure (AoD) calculated from signals captured by the antenna array.
Vishay Intertechnology, Inc., introduces a new aEC-Q101 certified reflective light sensor for automotive, smart home, industrial and office equipment -- VCNT2025X01, It packs infrared transmitters, silicon phototransistor detectors and solar blocking filters in a small surface mount package of 2.5 mm x 2.0 mm x 0.6 mm with a lower thickness than the previous generation solution, improving performance, CTR and operating temperature.
Ams Osram, the world's leading optical solutions provider, announced a partnership with Teknique, a leading imaging technology and machine vision solutions provider, to help customers quickly bring 2D/3D camera systems to market by combining Amos Osram's advanced sensor and transmitter components with Teknique's SoM product family.
Arwin has released another new addition to the Datamate line of 2mm Pitch High Reliability (HI-REL) connectors, the Datamate Pin Perforated Reflow Welding (PIHR) products have been carefully designed to provide designers with reliable solutions well suited for automated assembly
The new Tektronix 2 series mixed signal oscilloscopes are on sale by Avnet's global distributor of electronic components and solutions. The new generation 2 Series MSO delivers significant improvements in test measurement performance, versatility and portability, enabling engineers to smoothly detect and resolve problems both in the lab and in the test field.
Bourns, the world's leading manufacturer of electronic components, has announced three new lines of POWrFuse high-power fuses. The POWrFuse PF-G (63 A), PF-J and PF-H (Ind) families are designed to meet the requirements of UL 248-14, while the PF-G (90 A) is designed to meet the requirements of UL 248-14 and UL 248-1 standards.
Atmel Corporation has released the Atmel maXTouch mXT112E controller optimized for 2.8 to 3.5 inch touch screens for the fast-growing consumer markets of feature phones, digital cameras, GLOBAL Positioning Systems (GPS), game consoles and other high-volume products.
LG Innotek (representative of JeongCheoldong) announced that it has successfully developed the world's leading high-level Radar module for the automotive interior. With this development, LG Innotek has taken a lead in the global radar module market.
Microchip announced the launch of a gauge pressure sensor NSPGS5 series. CMOS mixed signal conditioning chip is used internally to amplify, calibrate and compensate the output of the MEMS core, which can convert pressure signals from -10kpa to +10kPa into analog signals and digital I2C signals with a customized output range of 0~5V.
Inertial Labs, a leading developer of inertial navigation and measurement units, announces the availability of compact, self-contained strapdown industrial (Kernel-100 series) and tactical (Kernel-200 series) inertial measurement units (IMUs): Kernel-110, 120, 210, 220, using the three-axis MEMS accelerometer and the three-axis MEMS gyroscope to measure the linear acceleration and the angular rate, respectively.
Nexperia, a specialist in high-throughput production of basic semiconductor devices, announces a new series of 20 V and 30 V MOSFETs DFN0603 in an ultra-small DFN package.
Diodes continues to strengthen its PORTFOLIO of USB Power Delivery (PD) solutions with the introduction of two new high-performance USB PD3.0 Sink controller ics. AP33771 and AP33772 receiver controllers are designed for home appliances and wireless power tools, and can be coordinated through USB-C to reach the appropriate voltage potential. The operating voltage range of both controllers is 3.3V to 24V.
The Momo Modoo patch uses Nordic's nRF52833 SoC to monitor fetal heart rate and dynamics during the first trimester of pregnancy
The new Bourns® POWrFuse line of high-power fuses is designed to meet UL 248-13 standards,Suitable for high power, high breaking current and high rated current applications
Renesas Electronics Corporation is changing how designers construct sensor-connected IoT applications with various new solutions aimed at faster design cycles, improved accuracy, and lower system costs.
