Xilinx Inc. Producten

XCZU5EV-3FBVB900E

Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 900-BBGA, FCBGA
• Supplier Device Package: 900-FCBGA (31x31)

package: 900-BBGA, FCBGA

XCZU9CG-2FFVB1156E

Xilinx Inc.

IC FPGA 328 I/O 1156FCBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 533MHz, 1.3GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 599K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

package: 1156-BBGA, FCBGA

XC2V1000-5FF896I

Xilinx Inc.

IC FPGA 432 I/O 896FCBGA

• Number of LABs/CLBs: 1280
• Number of Logic Elements/Cells: -
• Total RAM Bits: 737280
• Number of I/O: 432
• Number of Gates: 1000000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 896-BBGA, FCBGA
• Supplier Device Package: 896-FCBGA (31x31)

package: 896-BBGA, FCBGA

XC2V3000-4FG676I

Xilinx Inc.

IC FPGA 484 I/O 676FBGA

• Number of LABs/CLBs: 3584
• Number of Logic Elements/Cells: -
• Total RAM Bits: 1769472
• Number of I/O: 484
• Number of Gates: 3000000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

package: 676-BBGA, FCBGA

XC2V1000-4FFG896C

Xilinx Inc.

IC FPGA 432 I/O 896FCBGA

• Number of LABs/CLBs: 1280
• Number of Logic Elements/Cells: -
• Total RAM Bits: 737280
• Number of I/O: 432
• Number of Gates: 1000000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 896-BBGA, FCBGA
• Supplier Device Package: 896-FCBGA (31x31)

package: 896-BBGA, FCBGA

XC4062XL-3HQ240C

Xilinx Inc.

IC FPGA 193 I/O 240HQFP

• Number of LABs/CLBs: 2304
• Number of Logic Elements/Cells: 5472
• Total RAM Bits: 73728
• Number of I/O: 193
• Number of Gates: 62000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 240-BFQFP Exposed Pad
• Supplier Device Package: 240-PQFP (32x32)

package: 240-BFQFP Exposed Pad

XC4010E-4PC84I

Xilinx Inc.

IC FPGA 61 I/O 84PLCC

• Number of LABs/CLBs: 400
• Number of Logic Elements/Cells: 950
• Total RAM Bits: 12800
• Number of I/O: 61
• Number of Gates: 10000
• Voltage - Supply: 4.5 V ~ 5.5 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 84-LCC (J-Lead)
• Supplier Device Package: 84-PLCC (29.31x29.31)

package: 84-LCC (J-Lead)

XC4008E-3PQ160I

Xilinx Inc.

IC FPGA 129 I/O 160QFP

• Number of LABs/CLBs: 324
• Number of Logic Elements/Cells: 770
• Total RAM Bits: 10368
• Number of I/O: 129
• Number of Gates: 8000
• Voltage - Supply: 4.5 V ~ 5.5 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 160-BQFP
• Supplier Device Package: 160-PQFP (28x28)

package: 160-BQFP

XC4005E-3PQ100I

Xilinx Inc.

IC FPGA 77 I/O 100QFP

• Number of LABs/CLBs: 196
• Number of Logic Elements/Cells: 466
• Total RAM Bits: 6272
• Number of I/O: 77
• Number of Gates: 5000
• Voltage - Supply: 4.5 V ~ 5.5 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 100-BQFP
• Supplier Device Package: 100-PQFP (14x20)

package: 100-BQFP

XC4003E-2PG120I

Xilinx Inc.

IC FPGA 80 I/O 120CPGA

• Number of LABs/CLBs: 100
• Number of Logic Elements/Cells: 238
• Total RAM Bits: 3200
• Number of I/O: 80
• Number of Gates: 3000
• Voltage - Supply: 4.5 V ~ 5.5 V
• Mounting Type: Through Hole
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 120-BCPGA
• Supplier Device Package: 120-CPGA (34.55x34.55)

package: 120-BCPGA

XC4003E-2PC84C

Xilinx Inc.

IC FPGA 61 I/O 84PLCC

• Number of LABs/CLBs: 100
• Number of Logic Elements/Cells: 238
• Total RAM Bits: 3200
• Number of I/O: 61
• Number of Gates: 3000
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 84-LCC (J-Lead)
• Supplier Device Package: 84-PLCC (29.31x29.31)

package: 84-LCC (J-Lead)

XC7VH870T-1FLG1932C

Xilinx Inc.

IC FPGA 300 I/O 1932FCBGA

• Number of LABs/CLBs: 68450
• Number of Logic Elements/Cells: 876160
• Total RAM Bits: 51978240
• Number of I/O: 300
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: -
• Supplier Device Package: 1932-FCBGA (45x45)

package: -

XQ5VFX100T-1EF1136I

Xilinx Inc.

IC FPGA VIRTEX 5 100K 1136FFGBGA

• Number of LABs/CLBs: 8000
• Number of Logic Elements/Cells: 102400
• Total RAM Bits: 8404992
• Number of I/O: 640
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1136-BBGA, FCBGA
• Supplier Device Package: 1136-FCBGA (35x35)

package: 1136-BBGA, FCBGA

XC5VFX100T-1FF1136I

Xilinx Inc.

IC FPGA 640 I/O 1136FCBGA

• Number of LABs/CLBs: 8000
• Number of Logic Elements/Cells: 102400
• Total RAM Bits: 8404992
• Number of I/O: 640
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1136-BBGA, FCBGA
• Supplier Device Package: 1136-FCBGA (35x35)

package: 1136-BBGA, FCBGA

XC2VP30-7FGG676C

Xilinx Inc.

IC FPGA 416 I/O 676FBGA

• Number of LABs/CLBs: 3424
• Number of Logic Elements/Cells: 30816
• Total RAM Bits: 2506752
• Number of I/O: 416
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BGA
• Supplier Device Package: 676-FBGA (27x27)

package: 676-BGA

XC5VLX30-3FFG324C

Xilinx Inc.

IC FPGA 220 I/O 324FBGA

• Number of LABs/CLBs: 2400
• Number of Logic Elements/Cells: 30720
• Total RAM Bits: 1179648
• Number of I/O: 220
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 324-BBGA, FCBGA
• Supplier Device Package: 324-FCBGA (19x19)

package: 324-BBGA, FCBGA

XC6SLX150-L1FGG484I

Xilinx Inc.

IC FPGA 338 I/O 484FBGA

• Number of LABs/CLBs: 11519
• Number of Logic Elements/Cells: 147443
• Total RAM Bits: 4939776
• Number of I/O: 338
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

package: 484-BBGA

XC6SLX150-2FGG676C

Xilinx Inc.

IC FPGA 498 I/O 676FBGA

• Number of LABs/CLBs: 11519
• Number of Logic Elements/Cells: 147443
• Total RAM Bits: 4939776
• Number of I/O: 498
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BGA
• Supplier Device Package: 676-FBGA (27x27)

package: 676-BGA

XC6SLX75-2FGG676I

Xilinx Inc.

IC FPGA 408 I/O 676FBGA

• Number of LABs/CLBs: 5831
• Number of Logic Elements/Cells: 74637
• Total RAM Bits: 3170304
• Number of I/O: 408
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 676-BGA
• Supplier Device Package: 676-FBGA (27x27)

package: 676-BGA

XC3S1400A-4FG484I

Xilinx Inc.

IC FPGA 375 I/O 484FBGA

• Number of LABs/CLBs: 2816
• Number of Logic Elements/Cells: 25344
• Total RAM Bits: 589824
• Number of I/O: 375
• Number of Gates: 1400000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

package: 484-BBGA

XC7A35T-1CSG325I

Xilinx Inc.

IC FPGA 150 I/O 325CSBGA

• Number of LABs/CLBs: 2600
• Number of Logic Elements/Cells: 33208
• Total RAM Bits: 1843200
• Number of I/O: 150
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 324-LFBGA, CSPBGA
• Supplier Device Package: 325-CSBGA (15x15)

package: 324-LFBGA, CSPBGA

XC7A12T-L1CPG236I

Xilinx Inc.

IC FPGA ARTIX7 106 I/O CPBGA

• Number of LABs/CLBs: 1000
• Number of Logic Elements/Cells: 12800
• Total RAM Bits: 737280
• Number of I/O: 106
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 238-LFBGA, CSPBGA
• Supplier Device Package: 236-CSBGA (10x10)

package: 238-LFBGA, CSPBGA

XC2S200-5PQ208C

Xilinx Inc.

IC FPGA 140 I/O 208QFP

• Number of LABs/CLBs: 1176
• Number of Logic Elements/Cells: 5292
• Total RAM Bits: 57344
• Number of I/O: 140
• Number of Gates: 200000
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

package: 208-BFQFP

XC3S500E-4CP132C

Xilinx Inc.

IC FPGA 92 I/O 132CSBGA

• Number of LABs/CLBs: 1164
• Number of Logic Elements/Cells: 10476
• Total RAM Bits: 368640
• Number of I/O: 92
• Number of Gates: 500000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 132-TFBGA, CSPBGA
• Supplier Device Package: 132-CSPBGA (8x8)

package: 132-TFBGA, CSPBGA

XCR3256XL-10FTG256I

Xilinx Inc.

IC CPLD 256MC 9NS 256BGA

• Programmable Type: In System Programmable (min 1K program/erase cycles)
• Delay Time tpd(1) Max: 9.1ns
• Voltage Supply - Internal: 2.7 V ~ 3.6 V
• Number of Logic Elements/Blocks: 16
• Number of Macrocells: 256
• Number of Gates: 6000
• Number of I/O: 164
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FTBGA (17x17)

package: 256-LBGA

XCR3064XL-10CP56I

Xilinx Inc.

IC CPLD 64MC 9.1NS 56CSP

• Programmable Type: In System Programmable (min 1K program/erase cycles)
• Delay Time tpd(1) Max: 9.1ns
• Voltage Supply - Internal: 2.7 V ~ 3.6 V
• Number of Logic Elements/Blocks: 4
• Number of Macrocells: 64
• Number of Gates: 1500
• Number of I/O: 48
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 56-LFBGA, CSPBGA
• Supplier Device Package: 56-CSBGA (6x6)

package: 56-LFBGA, CSPBGA

XCVU11P-L2FLGB2104E

Xilinx Inc.

IC FPGA VIRTEX-UP 2104FCBGA

• Number of LABs/CLBs: 162000
• Number of Logic Elements/Cells: 2835000
• Total RAM Bits: 396150400
• Number of I/O: 572
• Number of Gates: -
• Voltage - Supply: 0.698 V ~ 0.876 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2104-BBGA, FCBGA
• Supplier Device Package: 2104-FCBGA (47.5x47.5)

package: 2104-BBGA, FCBGA

XCDAISY-CN1509

Xilinx Inc.

XCDAISY-CN1509

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: -
• Total RAM Bits: -
• Number of I/O: -
• Number of Gates: -
• Voltage - Supply: -
• Mounting Type: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

package: -