Xilinx Inc. Producten

XC17S50ASO20I

Xilinx Inc.

IC PROM SER 50000 I-TEMP 20-SOIC

• Programmable Type: OTP
• Memory Size: 500kb
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SOIC

package: 20-SOIC (0.295", 7.50mm Width)

XC18V01PCG20C0100

Xilinx Inc.

RE-PROGRAMMABLE 1MB PROM

• Programmable Type: In System Programmable
• Memory Size: 1Mb
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 20-LCC (J-Lead)
• Supplier Device Package: 20-PLCC (9x9)

package: 20-LCC (J-Lead)

XCZU7EV-2FFVC1156I

Xilinx Inc.

IC FPGA 360 I/O 1156FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

package: 1156-BBGA, FCBGA

XCZU7EV-1FBVB900I

Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 900-BBGA, FCBGA
• Supplier Device Package: 900-FCBGA (31x31)

package: 900-BBGA, FCBGA

XC7Z035-2FFG676I

Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 676BGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 800MHz
• Primary Attributes: Kintex?-7 FPGA, 275K Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

package: 676-BBGA, FCBGA

XC7Z030-2SBG485E

Xilinx Inc.

IC SOC CORTEX A-9 ZYNQ7 485BGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 800MHz
• Primary Attributes: Kintex?-7 FPGA, 125K Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 484-FBGA
• Supplier Device Package: 485-FBGA (19x19)

package: 484-FBGA

XC2V2000-4BFG957I

Xilinx Inc.

IC FPGA 624 I/O 957FCBGA

• Number of LABs/CLBs: 2688
• Number of Logic Elements/Cells: -
• Total RAM Bits: 1032192
• Number of I/O: 624
• Number of Gates: 2000000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 957-BBGA, FCBGA
• Supplier Device Package: 957-FCBGA (40x40)

package: 957-BBGA, FCBGA

XC2V1500-5BGG575I

Xilinx Inc.

IC FPGA 392 I/O 575MBGA

• Number of LABs/CLBs: 1920
• Number of Logic Elements/Cells: -
• Total RAM Bits: 884736
• Number of I/O: 392
• Number of Gates: 1500000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 575-BBGA
• Supplier Device Package: 575-BGA (31x31)

package: 575-BBGA

XCV600-5FG676C

Xilinx Inc.

IC FPGA 444 I/O 676FBGA

• Number of LABs/CLBs: 3456
• Number of Logic Elements/Cells: 15552
• Total RAM Bits: 98304
• Number of I/O: 444
• Number of Gates: 661111
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

package: 676-BBGA, FCBGA

XCV200E-7PQ240I

Xilinx Inc.

IC FPGA 158 I/O 240QFP

• Number of LABs/CLBs: 1176
• Number of Logic Elements/Cells: 5292
• Total RAM Bits: 114688
• Number of I/O: 158
• Number of Gates: 306393
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 240-BFQFP
• Supplier Device Package: 240-PQFP (32x32)

package: 240-BFQFP

XCV1600E-7FG1156I

Xilinx Inc.

IC FPGA 724 I/O 1156FBGA

• Number of LABs/CLBs: 7776
• Number of Logic Elements/Cells: 34992
• Total RAM Bits: 589824
• Number of I/O: 724
• Number of Gates: 2188742
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA
• Supplier Device Package: 1156-FBGA (35x35)

package: 1156-BBGA

XC4036XL-2HQ160C

Xilinx Inc.

IC FPGA 129 I/O 160HQFP

• Number of LABs/CLBs: 1296
• Number of Logic Elements/Cells: 3078
• Total RAM Bits: 41472
• Number of I/O: 129
• Number of Gates: 36000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 160-BQFP Exposed Pad
• Supplier Device Package: 160-PQFP (28x28)

package: 160-BQFP Exposed Pad

XC4025E-4HQ240C

Xilinx Inc.

IC FPGA 193 I/O 240HQFP

• Number of LABs/CLBs: 1024
• Number of Logic Elements/Cells: 2432
• Total RAM Bits: 32768
• Number of I/O: 193
• Number of Gates: 25000
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 240-BFQFP Exposed Pad
• Supplier Device Package: 240-PQFP (32x32)

package: 240-BFQFP Exposed Pad

XC5202-6PC84C

Xilinx Inc.

IC FPGA 65 I/O 84PLCC

• Number of LABs/CLBs: 64
• Number of Logic Elements/Cells: 256
• Total RAM Bits: -
• Number of I/O: 65
• Number of Gates: 3000
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 84-LCC (J-Lead)
• Supplier Device Package: 84-PLCC (29.31x29.31)

package: 84-LCC (J-Lead)

XCVU3P-L2FFVC1517E

Xilinx Inc.

XCVU3P-L2FFVC1517E

• Number of LABs/CLBs: 49260
• Number of Logic Elements/Cells: 862050
• Total RAM Bits: 118067200
• Number of I/O: 520
• Number of Gates: -
• Voltage - Supply: 0.698 V ~ 0.742 V
• Mounting Type: -
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

package: -

XC6VHX565T-2FFG1924E

Xilinx Inc.

IC FPGA 640 I/O 1924FCBGA

• Number of LABs/CLBs: 44280
• Number of Logic Elements/Cells: 566784
• Total RAM Bits: 33619968
• Number of I/O: 640
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1924-BBGA, FCBGA
• Supplier Device Package: 1924-FCBGA (45x45)

package: 1924-BBGA, FCBGA

XC2VP70-5FF1704C

Xilinx Inc.

IC FPGA 996 I/O 1704FCBGA

• Number of LABs/CLBs: 8272
• Number of Logic Elements/Cells: 74448
• Total RAM Bits: 6045696
• Number of I/O: 996
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1704-BBGA, FCBGA
• Supplier Device Package: 1704-CFCBGA (42.5x42.5)

package: 1704-BBGA, FCBGA

XC4VLX40-11FFG1148C

Xilinx Inc.

IC FPGA 640 I/O 1148FCBGA

• Number of LABs/CLBs: 4608
• Number of Logic Elements/Cells: 41472
• Total RAM Bits: 1769472
• Number of I/O: 640
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1148-BBGA, FCBGA
• Supplier Device Package: 1148-FCPBGA (35x35)

package: 1148-BBGA, FCBGA

XQ6SLX150-L1CS484I

Xilinx Inc.

IC FPGA SPARTAN 6 147K 484BGA

• Number of LABs/CLBs: 11519
• Number of Logic Elements/Cells: 147443
• Total RAM Bits: 4939776
• Number of I/O: 338
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-FBGA, CSPBGA
• Supplier Device Package: 484-CSPBGA (19x19)

package: 484-FBGA, CSPBGA

XC7K160T-1FB676C

Xilinx Inc.

IC FPGA 400 I/O 676FCBGA

• Number of LABs/CLBs: 12675
• Number of Logic Elements/Cells: 162240
• Total RAM Bits: 11980800
• Number of I/O: 400
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

package: 676-BBGA, FCBGA

XA3SD1800A-4CSG484I

Xilinx Inc.

IC FPGA 309 I/O 484CSBG

• Number of LABs/CLBs: 4160
• Number of Logic Elements/Cells: 37440
• Total RAM Bits: 1548288
• Number of I/O: 309
• Number of Gates: 1800000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-FBGA, CSPBGA
• Supplier Device Package: 484-CSPBGA (19x19)

package: 484-FBGA, CSPBGA

XC6SLX45-3FG484C

Xilinx Inc.

IC FPGA 316 I/O 484FBGA

• Number of LABs/CLBs: 3411
• Number of Logic Elements/Cells: 43661
• Total RAM Bits: 2138112
• Number of I/O: 316
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

package: 484-BBGA

XC3S50AN-5TQG144C

Xilinx Inc.

IC FPGA 108 I/O 144TQFP

• Number of LABs/CLBs: 176
• Number of Logic Elements/Cells: 1584
• Total RAM Bits: 55296
• Number of I/O: 108
• Number of Gates: 50000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

package: 144-LQFP

XCR3384XL-7PQG208C

Xilinx Inc.

IC CPLD 384MC 7NS 208QFP

• Programmable Type: In System Programmable (min 1K program/erase cycles)
• Delay Time tpd(1) Max: 7.0ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 24
• Number of Macrocells: 384
• Number of Gates: 9000
• Number of I/O: 172
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

package: 208-BFQFP

XC2C512-10PQ208C

Xilinx Inc.

IC CPLD 512MC 9.2NS 208QFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 9.2ns
• Voltage Supply - Internal: 1.7 V ~ 1.9 V
• Number of Logic Elements/Blocks: 32
• Number of Macrocells: 512
• Number of Gates: 12000
• Number of I/O: 173
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

package: 208-BFQFP

XC9536XL-5CS48C

Xilinx Inc.

IC CPLD 36MC 5NS 48CSP

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 5.0ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 2
• Number of Macrocells: 36
• Number of Gates: 800
• Number of I/O: 36
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-FBGA, CSPBGA
• Supplier Device Package: 48-CSBGA (7x7)

package: 48-FBGA, CSPBGA

XCVU11P-2FLGB2104E

Xilinx Inc.

IC FPGA VIRTEX-UP 2104FCBGA

• Number of LABs/CLBs: 162000
• Number of Logic Elements/Cells: 2835000
• Total RAM Bits: 396150400
• Number of I/O: 572
• Number of Gates: -
• Voltage - Supply: 0.825 V ~ 0.876 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2104-BBGA, FCBGA
• Supplier Device Package: 2104-FCBGA (47.5x47.5)

package: 2104-BBGA, FCBGA

XCVU5P-L2FLVC2104E

Xilinx Inc.

IC FPGA VIRTEX-UP 2104FCBGA

• Number of LABs/CLBs: 75072
• Number of Logic Elements/Cells: 1313763
• Total RAM Bits: 190976000
• Number of I/O: 416
• Number of Gates: -
• Voltage - Supply: 0.698 V ~ 0.876 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2104-BBGA, FCBGA
• Supplier Device Package: 2104-FCBGA (47.5x47.5)

package: 2104-BBGA, FCBGA