Xilinx Inc. Producten

XC1701SO20I

Xilinx Inc.

IC PROM SER I-TEMP 1K 20-SOIC

• Programmable Type: OTP
• Memory Size: 1Mb
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SOIC

package: 20-SOIC (0.295", 7.50mm Width)

XCZU6CG-1FFVB1156I

Xilinx Inc.

XCZU6CG-1FFVB1156I

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 533MHz, 1.3GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 469K+ Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

package: 1156-BBGA, FCBGA

XC7Z035-1FFG900I

Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 900BGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 667MHz
• Primary Attributes: Kintex?-7 FPGA, 275K Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 900-BBGA, FCBGA
• Supplier Device Package: 900-FCBGA (31x31)

package: 900-BBGA, FCBGA

XC7Z030-L2FBG676I

Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 676BGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 800MHz
• Primary Attributes: Kintex?-7 FPGA, 125K Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

package: 676-BBGA, FCBGA

XCZU2CG-1SBVA484E

Xilinx Inc.

IC FPGA 82 I/O 484FCBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 533MHz, 1.3GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 484-BBGA, FCBGA
• Supplier Device Package: 484-FCBGA (19x19)

package: 484-BBGA, FCBGA

XC2V500-5FGG256I

Xilinx Inc.

IC FPGA 172 I/O 256FBGA

• Number of LABs/CLBs: 768
• Number of Logic Elements/Cells: -
• Total RAM Bits: 589824
• Number of I/O: 172
• Number of Gates: 500000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 256-BGA
• Supplier Device Package: 256-FBGA (17x17)

package: 256-BGA

XCV1600E-7FG680C

Xilinx Inc.

IC FPGA 512 I/O 680FBGA

• Number of LABs/CLBs: 7776
• Number of Logic Elements/Cells: 34992
• Total RAM Bits: 589824
• Number of I/O: 512
• Number of Gates: 2188742
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 680-LBGA Exposed Pad
• Supplier Device Package: 680-FTEBGA (40x40)

package: 680-LBGA Exposed Pad

XCS30XL-5PQ208C

Xilinx Inc.

IC FPGA 169 I/O 208QFP

• Number of LABs/CLBs: 576
• Number of Logic Elements/Cells: 1368
• Total RAM Bits: 18432
• Number of I/O: 169
• Number of Gates: 30000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

package: 208-BFQFP

XCS30-4VQ100C

Xilinx Inc.

IC FPGA 77 I/O 100VQFP

• Number of LABs/CLBs: 576
• Number of Logic Elements/Cells: 1368
• Total RAM Bits: 18432
• Number of I/O: 77
• Number of Gates: 30000
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 100-TQFP
• Supplier Device Package: 100-VQFP (14x14)

package: 100-TQFP

XC4085XL-3BG432C

Xilinx Inc.

IC FPGA 352 I/O 432MBGA

• Number of LABs/CLBs: 3136
• Number of Logic Elements/Cells: 7448
• Total RAM Bits: 100352
• Number of I/O: 352
• Number of Gates: 85000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 432-LBGA, Metal
• Supplier Device Package: 432-MBGA (40x40)

package: 432-LBGA, Metal

XC4062XL-2HQ240I

Xilinx Inc.

IC FPGA 193 I/O 240HQFP

• Number of LABs/CLBs: 2304
• Number of Logic Elements/Cells: 5472
• Total RAM Bits: 73728
• Number of I/O: 193
• Number of Gates: 62000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 240-BFQFP Exposed Pad
• Supplier Device Package: 240-PQFP (32x32)

package: 240-BFQFP Exposed Pad

XC4028XL-09HQ160C

Xilinx Inc.

IC FPGA 129 I/O 160HQFP

• Number of LABs/CLBs: 1024
• Number of Logic Elements/Cells: 2432
• Total RAM Bits: 32768
• Number of I/O: 129
• Number of Gates: 28000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 160-BQFP Exposed Pad
• Supplier Device Package: 160-PQFP (28x28)

package: 160-BQFP Exposed Pad

XCVU9P-2FSGD2104E

Xilinx Inc.

XCVU9P-2FSGD2104E

• Number of LABs/CLBs: 147780
• Number of Logic Elements/Cells: 2586150
• Total RAM Bits: 354201600
• Number of I/O: 676
• Number of Gates: -
• Voltage - Supply: 0.825 V ~ 0.876 V
• Mounting Type: -
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

package: -

XC5VLX220-2FFG1760I

Xilinx Inc.

IC FPGA 800 I/O 1760FBGA

• Number of LABs/CLBs: 17280
• Number of Logic Elements/Cells: 221184
• Total RAM Bits: 7077888
• Number of I/O: 800
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FCBGA (42.5x42.5)

package: 1760-BBGA, FCBGA

XQ6VLX240T-1RF784M

Xilinx Inc.

IC FPGA VIRTEX 6 241K 784-BGA

• Number of LABs/CLBs: 18840
• Number of Logic Elements/Cells: 241152
• Total RAM Bits: 15335424
• Number of I/O: 400
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: -
• Operating Temperature: -55°C ~ 125°C (TJ)
• Package / Case: 784-BBGA, FCBGA
• Supplier Device Package: -

package: 784-BBGA, FCBGA

XC2VP50-7FFG1148C

Xilinx Inc.

IC FPGA 812 I/O 1148FBGA

• Number of LABs/CLBs: 5904
• Number of Logic Elements/Cells: 53136
• Total RAM Bits: 4276224
• Number of I/O: 812
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1148-BBGA, FCBGA
• Supplier Device Package: 1148-FCPBGA (35x35)

package: 1148-BBGA, FCBGA

XQ6VLX130T-1RF784M

Xilinx Inc.

IC FPGA VIRTEX 6 128K 784-BGA

• Number of LABs/CLBs: 10000
• Number of Logic Elements/Cells: 128000
• Total RAM Bits: 9732096
• Number of I/O: 400
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: -
• Operating Temperature: -55°C ~ 125°C (TJ)
• Package / Case: 784-BBGA, FCBGA
• Supplier Device Package: -

package: 784-BBGA, FCBGA

XCKU025-2FFVA1156E

Xilinx Inc.

IC FPGA 312 I/O 1156FCBGA

• Number of LABs/CLBs: 18180
• Number of Logic Elements/Cells: 318150
• Total RAM Bits: 13004800
• Number of I/O: 312
• Number of Gates: -
• Voltage - Supply: 0.922 V ~ 0.979 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

package: 1156-BBGA, FCBGA

XC2VP40-5FFG1148C

Xilinx Inc.

IC FPGA 804 I/O 1148FBGA

• Number of LABs/CLBs: 4848
• Number of Logic Elements/Cells: 43632
• Total RAM Bits: 3538944
• Number of I/O: 804
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1148-BBGA, FCBGA
• Supplier Device Package: 1148-FCPBGA (35x35)

package: 1148-BBGA, FCBGA

XC6VLX75T-2FFV484I

Xilinx Inc.

IC FPGA 240 I/O 484FCBGA

• Number of LABs/CLBs: 5820
• Number of Logic Elements/Cells: 74496
• Total RAM Bits: 5750784
• Number of I/O: 240
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BBGA, FCBGA
• Supplier Device Package: 484-FCBGA (23x23)

package: 484-BBGA, FCBGA

XC5VLX50-2FF324I

Xilinx Inc.

IC FPGA 220 I/O 324FBGA

• Number of LABs/CLBs: 3600
• Number of Logic Elements/Cells: 46080
• Total RAM Bits: 1769472
• Number of I/O: 220
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 324-BBGA, FCBGA
• Supplier Device Package: 324-FCBGA (19x19)

package: 324-BBGA, FCBGA

XC6SLX100-N3FG676I

Xilinx Inc.

IC FPGA 480 I/O 676FCBGA

• Number of LABs/CLBs: 7911
• Number of Logic Elements/Cells: 101261
• Total RAM Bits: 4939776
• Number of I/O: 480
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

package: 676-BBGA, FCBGA

XC7A75T-2CSG324I

Xilinx Inc.

IC FPGA ARTIX7 210 I/O 324CSBGA

• Number of LABs/CLBs: 5900
• Number of Logic Elements/Cells: 75520
• Total RAM Bits: 3870720
• Number of I/O: 210
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 324-LFBGA, CSPBGA
• Supplier Device Package: 324-CSPBGA (15x15)

package: 324-LFBGA, CSPBGA

XA6SLX45-2CSG484Q

Xilinx Inc.

IC FPGA 320 I/O 484BGA

• Number of LABs/CLBs: 3411
• Number of Logic Elements/Cells: 43661
• Total RAM Bits: 2138112
• Number of I/O: 320
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 484-FBGA, CSPBGA
• Supplier Device Package: 484-CSPBGA (19x19)

package: 484-FBGA, CSPBGA

XC6SLX45-N3FGG484C

Xilinx Inc.

IC FPGA 316 I/O 484FBGA

• Number of LABs/CLBs: 3411
• Number of Logic Elements/Cells: 43661
• Total RAM Bits: 2138112
• Number of I/O: 316
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

package: 484-BBGA

XC2S50-5PQ208I

Xilinx Inc.

IC FPGA 140 I/O 208QFP

• Number of LABs/CLBs: 384
• Number of Logic Elements/Cells: 1728
• Total RAM Bits: 32768
• Number of I/O: 140
• Number of Gates: 50000
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

package: 208-BFQFP

XC6SLX4-3CPG196C

Xilinx Inc.

IC FPGA 106 I/O 196CSBGA

• Number of LABs/CLBs: 300
• Number of Logic Elements/Cells: 3840
• Total RAM Bits: 221184
• Number of I/O: 106
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 196-TFBGA, CSBGA
• Supplier Device Package: 196-CSPBGA (8x8)

package: 196-TFBGA, CSBGA

XCR3032XL-5CSG48C

Xilinx Inc.

IC CPLD 32MC 4.5NS 48PLCC

• Programmable Type: In System Programmable (min 1K program/erase cycles)
• Delay Time tpd(1) Max: 4.5ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 2
• Number of Macrocells: 32
• Number of Gates: 750
• Number of I/O: 36
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-FBGA, CSPBGA
• Supplier Device Package: 48-CSBGA (7x7)

package: 48-FBGA, CSPBGA