Xilinx Inc. Producten

XCMECH-FG456

Xilinx Inc.

FG456 MECHANICAL SAMPLE

• Type: Mechanical Sample
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

XCZU6EG-1FFVB1156I

Xilinx Inc.

IC FPGA 328 I/O 1156FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 469K+ Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

package: 1156-BBGA, FCBGA

XC7Z014S-2CLG400E

Xilinx Inc.

IC FPGA SOC 200I/O 400BGA

• Architecture: MCU, FPGA
• Core Processor: Single ARM? Cortex?-A9 MPCore? with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 766MHz
• Primary Attributes: Artix?-7 FPGA, 65K Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 400-LFBGA, CSPBGA
• Supplier Device Package: 400-CSPBGA (17x17)

package: 400-LFBGA, CSPBGA

XC2V250-6FGG256C

Xilinx Inc.

IC FPGA 172 I/O 256FBGA

• Number of LABs/CLBs: 384
• Number of Logic Elements/Cells: -
• Total RAM Bits: 442368
• Number of I/O: 172
• Number of Gates: 250000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 256-BGA
• Supplier Device Package: 256-FBGA (17x17)

package: 256-BGA

XC2V1000-6FGG456C

Xilinx Inc.

IC FPGA 324 I/O 456FBGA

• Number of LABs/CLBs: 1280
• Number of Logic Elements/Cells: -
• Total RAM Bits: 737280
• Number of I/O: 324
• Number of Gates: 1000000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 456-BBGA
• Supplier Device Package: 456-FBGA (23x23)

package: 456-BBGA

XC2S100E-6FTG256C

Xilinx Inc.

IC FPGA 182 I/O 256FTBGA

• Number of LABs/CLBs: 600
• Number of Logic Elements/Cells: 2700
• Total RAM Bits: 40960
• Number of I/O: 182
• Number of Gates: 100000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FTBGA (17x17)

package: 256-LBGA

XC4044XL-2BG352I

Xilinx Inc.

IC FPGA 289 I/O 352MBGA

• Number of LABs/CLBs: 1600
• Number of Logic Elements/Cells: 3800
• Total RAM Bits: 51200
• Number of I/O: 289
• Number of Gates: 44000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 352-LBGA, Metal
• Supplier Device Package: 352-MBGA (35x35)

package: 352-LBGA, Metal

XC4020E-3PG223C

Xilinx Inc.

IC FPGA 192 I/O 223CPGA

• Number of LABs/CLBs: 784
• Number of Logic Elements/Cells: 1862
• Total RAM Bits: 25088
• Number of I/O: 192
• Number of Gates: 20000
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Through Hole
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 223-BCPGA
• Supplier Device Package: 223-CPGA (47.25x47.25)

package: 223-BCPGA

XC4010E-2PQ160C

Xilinx Inc.

IC FPGA 129 I/O 160QFP

• Number of LABs/CLBs: 400
• Number of Logic Elements/Cells: 950
• Total RAM Bits: 12800
• Number of I/O: 129
• Number of Gates: 10000
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 160-BQFP
• Supplier Device Package: 160-PQFP (28x28)

package: 160-BQFP

XC4005XL-1VQ100I

Xilinx Inc.

IC FPGA 77 I/O 100VQFP

• Number of LABs/CLBs: 196
• Number of Logic Elements/Cells: 466
• Total RAM Bits: 6272
• Number of I/O: 77
• Number of Gates: 5000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 100-TQFP
• Supplier Device Package: 100-VQFP (14x14)

package: 100-TQFP

XC4005E-2TQ144C

Xilinx Inc.

IC FPGA 112 I/O 144TQFP

• Number of LABs/CLBs: 196
• Number of Logic Elements/Cells: 466
• Total RAM Bits: 6272
• Number of I/O: 112
• Number of Gates: 5000
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

package: 144-LQFP

XC7VX690T-1FFG1926C

Xilinx Inc.

IC FPGA 720 I/O 1926FCBGA

• Number of LABs/CLBs: 54150
• Number of Logic Elements/Cells: 693120
• Total RAM Bits: 54190080
• Number of I/O: 720
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1924-BBGA, FCBGA
• Supplier Device Package: 1926-FCBGA (45x45)

package: 1924-BBGA, FCBGA

XC6VHX380T-1FF1154I

Xilinx Inc.

IC FPGA 320 I/O 1156FCBGA

• Number of LABs/CLBs: 29880
• Number of Logic Elements/Cells: 382464
• Total RAM Bits: 28311552
• Number of I/O: 320
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

package: 1156-BBGA, FCBGA

XC6VLX240T-L1FF784I

Xilinx Inc.

IC FPGA 400 I/O 784FCBGA

• Number of LABs/CLBs: 18840
• Number of Logic Elements/Cells: 241152
• Total RAM Bits: 15335424
• Number of I/O: 400
• Number of Gates: -
• Voltage - Supply: 0.91 V ~ 0.97 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 784-BBGA, FCBGA
• Supplier Device Package: 784-FCBGA (29x29)

package: 784-BBGA, FCBGA

XC4VLX60-10FFG668I

Xilinx Inc.

IC FPGA 448 I/O 668FCBGA

• Number of LABs/CLBs: 6656
• Number of Logic Elements/Cells: 59904
• Total RAM Bits: 2949120
• Number of I/O: 448
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 668-BBGA, FCBGA
• Supplier Device Package: 668-FCBGA (27x27)

package: 668-BBGA, FCBGA

XC6SLX100T-3FGG900C

Xilinx Inc.

IC FPGA 498 I/O 900FBGA

• Number of LABs/CLBs: 7911
• Number of Logic Elements/Cells: 101261
• Total RAM Bits: 4939776
• Number of I/O: 498
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 900-BBGA
• Supplier Device Package: 900-FBGA (31x31)

package: 900-BBGA

XC6SLX150-N3FGG676C

Xilinx Inc.

IC FPGA 498 I/O 676FBGA

• Number of LABs/CLBs: 11519
• Number of Logic Elements/Cells: 147443
• Total RAM Bits: 4939776
• Number of I/O: 498
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BGA
• Supplier Device Package: 676-FBGA (27x27)

package: 676-BGA

XA7A50T-2CSG325I

Xilinx Inc.

IC FPGA 150 I/O 325BGA

• Number of LABs/CLBs: 4075
• Number of Logic Elements/Cells: 52160
• Total RAM Bits: 2764800
• Number of I/O: 150
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 324-LFBGA, CSPBGA
• Supplier Device Package: 325-CSBGA (15x15)

package: 324-LFBGA, CSPBGA

XC3S1000-4FG676C

Xilinx Inc.

IC FPGA 391 I/O 676FBGA

• Number of LABs/CLBs: 1920
• Number of Logic Elements/Cells: 17280
• Total RAM Bits: 442368
• Number of I/O: 391
• Number of Gates: 1000000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

package: 676-BBGA, FCBGA

XA7A35T-1CSG325Q

Xilinx Inc.

IC FPGA 150 I/O 325BGA

• Number of LABs/CLBs: 2600
• Number of Logic Elements/Cells: 33280
• Total RAM Bits: 1843200
• Number of I/O: 150
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 324-LFBGA, CSPBGA
• Supplier Device Package: 325-CSBGA (15x15)

package: 324-LFBGA, CSPBGA

XC6SLX25-L1FTG256I

Xilinx Inc.

IC FPGA 186 I/O 256FTBGA

• Number of LABs/CLBs: 1879
• Number of Logic Elements/Cells: 24051
• Total RAM Bits: 958464
• Number of I/O: 186
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FTBGA (17x17)

package: 256-LBGA

XC3S100E-5TQG144C

Xilinx Inc.

IC FPGA 108 I/O 144TQFP

• Number of LABs/CLBs: 240
• Number of Logic Elements/Cells: 2160
• Total RAM Bits: 73728
• Number of I/O: 108
• Number of Gates: 100000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

package: 144-LQFP

XC7A15T-1CPG236C

Xilinx Inc.

IC FPGA ARTIX7 106 I/O 236BGA

• Number of LABs/CLBs: 1300
• Number of Logic Elements/Cells: 16640
• Total RAM Bits: 921600
• Number of I/O: 106
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 238-LFBGA, CSPBGA
• Supplier Device Package: 236-CSBGA (10x10)

package: 238-LFBGA, CSPBGA

XC3S250E-4PQG208C

Xilinx Inc.

IC FPGA 158 I/O 208QFP

• Number of LABs/CLBs: 612
• Number of Logic Elements/Cells: 5508
• Total RAM Bits: 221184
• Number of I/O: 158
• Number of Gates: 250000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

package: 208-BFQFP

XC7A15T-1FTG256C

Xilinx Inc.

IC FPGA ARTIX7 170 I/O 256FTBGA

• Number of LABs/CLBs: 1300
• Number of Logic Elements/Cells: 16640
• Total RAM Bits: 921600
• Number of I/O: 170
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FTBGA (17x17)

package: 256-LBGA

XCR3512XL-12FT256I

Xilinx Inc.

IC CPLD 512MC 10.8NS 256BGA

• Programmable Type: In System Programmable (min 1K program/erase cycles)
• Delay Time tpd(1) Max: 10.8ns
• Voltage Supply - Internal: 2.7 V ~ 3.6 V
• Number of Logic Elements/Blocks: 32
• Number of Macrocells: 512
• Number of Gates: 12000
• Number of I/O: 212
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FTBGA (17x17)

package: 256-LBGA

XA2C64A-8VQG44Q

Xilinx Inc.

IC CPLD 64MC 6.7NS 44VQFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 6.7ns
• Voltage Supply - Internal: 1.7 V ~ 1.9 V
• Number of Logic Elements/Blocks: 4
• Number of Macrocells: 64
• Number of Gates: 1500
• Number of I/O: 33
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 44-TQFP
• Supplier Device Package: 44-VQFP (10x10)

package: 44-TQFP

XCVU11P-2FSGD2104E

Xilinx Inc.

XCVU11P-2FSGD2104E

• Number of LABs/CLBs: 162000
• Number of Logic Elements/Cells: 2835000
• Total RAM Bits: 396150400
• Number of I/O: 572
• Number of Gates: -
• Voltage - Supply: 0.825 V ~ 0.876 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2104-BBGA, FCBGA
• Supplier Device Package: 2104-FCBGA (47.5x47.5)

package: 2104-BBGA, FCBGA