NXP Producten

PMD9002D,115

NXP

IC MOSFET DRIVER 6TSOP

• Transistor Type: 2 NPN (Totem Pole)
• Applications: MOSFET Driver
• Voltage - Rated: 50V NPN, 45V NPN
• Current Rating: 100mA NPN, 100mA NPN
• Mounting Type: Surface Mount
• Package / Case: SC-74, SOT-457
• Supplier Device Package: 6-TSOP

package: SC-74, SOT-457

BF1109WR,115

NXP

MOSFET N-CH 11V 30MA CMPAK-4

• Transistor Type: N-Channel Dual Gate
• Frequency: 800MHz
• Gain: 20dB
• Voltage - Test: 9V
• Current Rating: 30mA
• Noise Figure: 1.5dB
• Current - Test: -
• Power - Output: -
• Voltage - Rated: 11V
• Package / Case: SC-82A, SOT-343
• Supplier Device Package: CMPAK-4

package: SC-82A, SOT-343

74HC151N,652

NXP

IC MUX 8-INPUT 16-DIP

• Type: Multiplexer
• Circuit: 1 x 8:1
• Independent Circuits: 1
• Current - Output High, Low: 5.2mA, 5.2mA
• Voltage Supply Source: Single Supply
• Voltage - Supply: 2 V ~ 6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

package: 16-DIP (0.300", 7.62mm)

74ALVCH16832DGG,11

NXP

IC ADDRESS REGISTER DVR 64TSSOP

• Logic Type: Address Driver
• Number of Elements: 1
• Number of Bits per Element: 1:4
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 24mA, 24mA
• Voltage - Supply: 2.3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-TFSOP (0.240", 6.10mm Width)
• Supplier Device Package: 64-TSSOP

package: 64-TFSOP (0.240", 6.10mm Width)

SE5234N,112

NXP

IC OPAMP GP 2.5MHZ RRO 14DIP

• Amplifier Type: General Purpose
• Number of Circuits: 4
• Output Type: Rail-to-Rail
• Slew Rate: 0.8 V/µs
• Gain Bandwidth Product: -
• -3db Bandwidth: 2.5MHz
• Current - Input Bias: 90nA
• Voltage - Input Offset: 200µV
• Current - Supply: 2.8mA
• Current - Output / Channel: 12mA
• Voltage - Supply, Single/Dual (±): 2 V ~ 5.5 V, ±1 V ~ 2.75 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 14-DIP (0.300", 7.62mm)
• Supplier Device Package: 14-DIP

package: 14-DIP (0.300", 7.62mm)

TDA8566TH/N2C,118

NXP

IC AMP AUDIO PWR 55W STER 20HSOP

• Type: Class B
• Output Type: 2-Channel (Stereo)
• Max Output Power x Channels @ Load: 55W x 2 @ 2 Ohm
• Voltage - Supply: 6 V ~ 18 V
• Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: 20-HSOP
• Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad

package: 20-SOIC (0.433", 11.00mm Width) Exposed Pad

MC145028DWR2

NXP

IC DECODER 9 ADDR 16-SOIC

• Type: Encoder, Decoder
• Applications: Remote Control
• Voltage - Supply, Analog: 4.5 V ~ 18 V
• Voltage - Supply, Digital: 4.5 V ~ 18 V
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SOG

package: 16-SOIC (0.295", 7.50mm Width)

MPC8560PXAQFB

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DDR, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: -
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 784-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

package: 784-BBGA, FCBGA

MPC823VR81B2T

NXP

IC MPU MPC8XX 81MHZ 256BGA

• Core Processor: PowerPC
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 81MHz
• Co-Processors/DSP: Communications; RISC CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: LCD, Video
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 256-BBGA
• Supplier Device Package: 256-PBGA (23x23)

package: 256-BBGA

MC68HC000RC10

NXP

IC MPU M680X0 10MHZ 68PGA

• Core Processor: EC000
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 10MHz
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 68-BCPGA
• Supplier Device Package: 68-PGA (27x27)

package: 68-BCPGA

P3041NSN7MMC

NXP

IC MPU Q OR IQ 1.2GHZ 1295FCBGA

• Core Processor: PowerPC e500mc
• Number of Cores/Bus Width: 4 Core, 32-Bit
• Speed: 1.2GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (5), 10 Gbps (1)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 1295-BBGA, FCBGA
• Supplier Device Package: 1295-FCPBGA (37.5x37.5)

package: 1295-BBGA, FCBGA

P2020NSN2HHC

NXP

IC MPU Q OR IQ 1.2GHZ 689TEBGA

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.2GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (3)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 125°C (TA)
• Security Features: -
• Package / Case: 689-BBGA Exposed Pad
• Supplier Device Package: 689-TEPBGA II (31x31)

package: 689-BBGA Exposed Pad

MCIMX6S6AVM08AC

NXP

IC MPU I.MX6S 800MHZ 624MAPBGA

• Core Processor: ARM? Cortex?-A9
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Multimedia; NEON? SIMD
• RAM Controllers: LPDDR2, LVDDR3, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100/1000 Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (4)
• Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
• Operating Temperature: -40°C ~ 125°C (TJ)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
• Package / Case: 624-LFBGA
• Supplier Device Package: 624-MAPBGA (21x21)

package: 624-LFBGA

MK12DN512VLK5R

NXP

IC MCU 32BIT 512KB FLASH 80LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 60
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 24x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 80-LQFP
• Supplier Device Package: 80-LQFP (12x12)

package: 80-LQFP

LPC1518JBD100E

NXP

IC MCU 32BIT 128KB FLASH 100LQFP

• Core Processor: ARM? Cortex?-M3
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: CAN, I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 76
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 20K x 8
• Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
• Data Converters: A/D 24x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

package: 100-LQFP

MCF5207CVM166

NXP

IC MCU 32BIT ROMLESS 144MAPBGA

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 166.67MHz
• Connectivity: EBI/EMI, I2C, SPI, UART/USART
• Peripherals: DMA, WDT
• Number of I/O: 30
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.4 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 144-LBGA
• Supplier Device Package: 144-MAPBGA (13x13)

package: 144-LBGA

MC88LV915TEI

NXP

IC PLL CLOCK DRIVER 28-PLCC

• Type: Clock Driver, Fanout Distribution, Multiplexer
• PLL: Yes
• Input: TTL
• Output: CMOS, TTL
• Number of Circuits: 1
• Ratio - Input:Output: 3:8
• Differential - Input:Output: No/No
• Frequency - Max: 100MHz
• Divider/Multiplier: Yes/Yes
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 28-LCC (J-Lead)
• Supplier Device Package: 28-PLCC (12.45x12.45)

package: 28-LCC (J-Lead)

MMA6813BKWR2

NXP

ACCELEROMETER 50G SPI 16QFN

• Type: Digital
• Axis: X, Y
• Acceleration Range: ±50g
• Sensitivity (LSB/g): 9.766
• Sensitivity (mV/g): -
• Bandwidth: -
• Output Type: SPI
• Voltage - Supply: 3.135 V ~ 5.25 V
• Features: -
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 16-QFN Exposed Pad
• Supplier Device Package: 16-QFN (6x6)

package: 16-QFN Exposed Pad

HTSFCH4801EV/DH,11

NXP

IC HITAG-S 2048BIT FCP

• Type: RFID Transponder
• Frequency: 100kHz ~ 150kHz
• Standards: ISO 14223, ISO 11784, ISO 11785, ISO 18000-2
• Interface: -
• Voltage - Supply: -
• Operating Temperature: -25°C ~ 85°C
• Package / Case: 2-FlipChip
• Supplier Device Package: FCP2

package: 2-FlipChip

HTSMOH5602EVJ

NXP

IC HITAG-S 256BIT MOA2 PLLMC

• Type: RFID Transponder
• Frequency: 100kHz ~ 150kHz
• Standards: ISO 14223, ISO 11784, ISO 11785, ISO 18000-2
• Interface: -
• Voltage - Supply: -
• Operating Temperature: -25°C ~ 85°C
• Package / Case: MOA4, Smart Card Module
• Supplier Device Package: PLLMC

package: MOA4, Smart Card Module

ASC3112HVY

NXP

IC RF TXRX+MCU AISG 144-LQFP

• Type: TxRx + MCU
• RF Family/Standard: AISG
• Protocol: -
• Modulation: OOK
• Frequency: 2.176GHz, 4.352GHz, 6.528GHz
• Data Rate (Max): 38.4kbps
• Power - Output: 10dBm
• Sensitivity: -
• Memory Size: 256kB Flash, 16kB SRAM
• Serial Interfaces: I2C, SPI, UART
• GPIO: 44
• Voltage - Supply: 1.8 V ~ 3.3 V
• Current - Receiving: -
• Current - Transmitting: -
• Operating Temperature: -
• Package / Case: 144-LQFP

package: 144-LQFP

MC33596FCAE

NXP

IC UHF RECEIVER PLL TUNED 32-QFN

• Frequency: 304, 315, 426, 434, 868, 915MHz
• Sensitivity: -104dBm
• Data Rate (Max): 22.4 kBaud
• Modulation or Protocol: FSK, OOK
• Applications: General Data Transfer
• Current - Receiving: 10.3mA
• Data Interface: PCB, Surface Mount
• Memory Size: -
• Antenna Connector: PCB, Surface Mount
• Features: -
• Voltage - Supply: 2.7 V ~ 3.6 V, 4.5 V ~ 5.5 V
• Operating Temperature: -20°C ~ 85°C
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-QFN Exposed Pad (5x5)

package: 32-VFQFN Exposed Pad

MM912G634DC2AP

NXP

IC MCU 48KB LS/HS SWITCH 48LQFP

• Applications: Automotive
• Core Processor: S12
• Program Memory Type: FLASH (48 kB)
• Controller Series: HCS12
• RAM Size: 2K x 8
• Interface: LIN, SCI
• Number of I/O: 9
• Voltage - Supply: 2.25 V ~ 5.5 V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

package: 48-LQFP

MC33FS4501NAE

NXP

SYSTEM BASIS CHIP LINEAR 0.5A V

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: -1.0 V ~ 40 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP (7x7)

package: 48-LQFP Exposed Pad

SFR4310E1MAE40

NXP

COMMUNICATION CONTROLLER 40MHZ

• Applications: -
• Interface: -
• Voltage - Supply: -
• Package / Case: -
• Supplier Device Package: -
• Mounting Type: -

package: -

LS1043A-RGW-B

NXP

RESIDENTIAL GATEWAY REFERENCE DE

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

package: -

S912XEQ384BCALR

NXP

16-BIT MCU S12X CORE 384KB FLA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 91
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 24K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

package: 112-LQFP

MPF7100BVBA2ESR2

NXP

POWER MANAGEMENT IC, I.MX 8XL WI

• Applications: i.MX Processors
• Current - Supply: 10µA
• Voltage - Supply: 2.5V ~ 5.5V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-HVQFN (7x7)

package: -

Request a Quote