NXP Producten

BUK961R5-30E,118

NXP

MOSFET N-CH 30V 120A D2PAK

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 30V
• Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
• Vgs(th) (Max) @ Id: 2.1V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 93.4nC @ 5V
• Input Capacitance (Ciss) (Max) @ Vds: 14500pF @ 25V
• Vgs (Max): ±10V
• FET Feature: -
• Power Dissipation (Max): 324W (Tc)
• Rds On (Max) @ Id, Vgs: 1.3 mOhm @ 25A, 10V
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: D2PAK
• Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

package: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

BFU530XRVL

NXP

TRANS RF NPN 12V 40MA SOT-143R

• Transistor Type: NPN
• Voltage - Collector Emitter Breakdown (Max): 12V
• Frequency - Transition: 11GHz
• Noise Figure (dB Typ @ f): 1.1dB @ 1.8GHz
• Gain: 16.5dB
• Power - Max: 450mW
• DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 10mA, 8V
• Current - Collector (Ic) (Max): 40mA
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SOT-143R
• Supplier Device Package: SOT-143R

package: SOT-143R

BZX84-A7V5/LF1R

NXP

DIODE ZENER TO-236AB SOT23

• Voltage - Zener (Nom) (Vz): 7.5V
• Tolerance: ±1%
• Power - Max: 250mW
• Impedance (Max) (Zzt): 15 Ohms
• Current - Reverse Leakage @ Vr: 700nA @ 5V
• Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: TO-236AB (SOT23)

package: TO-236-3, SC-59, SOT-23-3

PZM8.2NB3,115

NXP

DIODE ZENER 8.2V 300MW SMT3

• Voltage - Zener (Nom) (Vz): 8.2V
• Tolerance: ±2%
• Power - Max: 300mW
• Impedance (Max) (Zzt): 10 Ohms
• Current - Reverse Leakage @ Vr: 700nA @ 5V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SMT3; MPAK

package: TO-236-3, SC-59, SOT-23-3

74LVC841AD,118

NXP

IC 10BIT TRANSP LATCH 24SOIC

• Logic Type: D-Type Transparent Latch
• Circuit: 10:10
• Output Type: Tri-State
• Voltage - Supply: 2.7 V ~ 3.6 V
• Independent Circuits: 1
• Delay Time - Propagation: 1.5ns
• Current - Output High, Low: 24mA, 24mA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 24-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 24-SO

package: 24-SOIC (0.295", 7.50mm Width)

74LV174DB,118

NXP

IC D-TYPE POS TRG SNGL 16SSOP

• Function: Master Reset
• Type: D-Type
• Output Type: Non-Inverted
• Number of Elements: 1
• Number of Bits per Element: 6
• Clock Frequency: 100MHz
• Max Propagation Delay @ V, Max CL: 21ns @ 5V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 12mA, 12mA
• Voltage - Supply: 1 V ~ 5.5 V
• Current - Quiescent (Iq): 160µA
• Input Capacitance: 3.5pF
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-SSOP (0.209", 5.30mm Width)

package: 16-SSOP (0.209", 5.30mm Width)

74LVC244APW/AUJ

NXP

IC BUFFER/DVR 3-ST OCT 20TSSOP

• Logic Type: Buffer, Non-Inverting
• Number of Elements: 2
• Number of Bits per Element: 4
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 24mA, 24mA
• Voltage - Supply: 1.2 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

package: 20-TSSOP (0.173", 4.40mm Width)

TDA1562Q/N3C,112

NXP

IC AMP AUDIO PWR 70W MONO 17SIL

• Type: Class B, Class H
• Output Type: 1-Channel (Mono)
• Max Output Power x Channels @ Load: 70W x 1 @ 4 Ohm
• Voltage - Supply: 8 V ~ 18 V
• Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Through Hole
• Operating Temperature: -
• Supplier Device Package: DBS17P
• Package / Case: 17-SIP Formed Leads

package: 17-SIP Formed Leads

PCA9701D,118

NXP

IC SPI GPI 16-BIT 24-SOIC

• Number of I/O: 16 (Input Only)
• Interface: SPI Serial
• Interrupt Output: Yes
• Features: -
• Output Type: Push-Pull
• Current - Output Source/Sink: -
• Clock Frequency: 5MHz
• Voltage - Supply: 2.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 24-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 24-SO

package: 24-SOIC (0.295", 7.50mm Width)

MPC8266AVVPJDC

NXP

IC MPU MPC82XX 300MHZ 408TBGA

• Core Processor: PowerPC G2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 300MHz
• Co-Processors/DSP: Communications; RISC CPM
• RAM Controllers: DRAM, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (3)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 480-LBGA
• Supplier Device Package: 408-TBGA (37.5x37.5)

package: 480-LBGA

P1025NSE5BFB

NXP

IC MPU Q OR IQ 667MHZ 561TEBGA1

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 667MHz
• Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 3.3
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (3)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 125°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 561-FBGA
• Supplier Device Package: 561-TEPBGA1 (23x23)

package: 561-FBGA

MCIMX537CVV8CR2

NXP

IC MPU I.MX53 800MHZ 529TEBGA-2

• Core Processor: ARM? Cortex?-A8
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Multimedia; NEON? SIMD
• RAM Controllers: LPDDR2, DDR2, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100 Mbps (1)
• SATA: SATA 1.5Gbps (1)
• USB: USB 2.0 (2), USB 2.0 + PHY (2)
• Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
• Operating Temperature: -40°C ~ 85°C (TA)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
• Package / Case: 529-FBGA
• Supplier Device Package: 529-TEPBGA-2 (19x19)

package: 529-FBGA

MPC8306SVMABDCA

NXP

IC MPU MPC83XX 133MHZ 369BGA

• Core Processor: PowerPC e300c3
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 133MHz
• Co-Processors/DSP: Communications; QUICC Engine
• RAM Controllers: DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (3)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 1.8V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 369-LFBGA
• Supplier Device Package: 369-PBGA (19x19)

package: 369-LFBGA

MK20DX256VMB7

NXP

IC MCU 32BIT 256KB FLASH 81BGA

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 81-LBGA
• Supplier Device Package: 81-MAPBGA (10x10)

package: 81-LBGA

PC9S08AC128CLKE

NXP

IC MCU 8BIT 128KB FLASH 80LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 69
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 80-LQFP
• Supplier Device Package: 80-LQFP (14x14)

package: 80-LQFP

P89LPC9351FA,529

NXP

IC MCU 8BIT 8KB FLASH 28PLCC

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 18MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
• Number of I/O: 26
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 768 x 8
• Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
• Data Converters: A/D 8x8b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-LCC (J-Lead)
• Supplier Device Package: 28-PLCC (11.51x11.51)

package: 28-LCC (J-Lead)

MC9S12XD256CAG

NXP

IC MCU 16BIT 256KB FLASH 144LQFP

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 119
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 14K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 24x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

package: 144-LQFP

MK30DN512ZVLQ10R

NXP

IC MCU 32BIT 512KB FLASH 144LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
• Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
• Number of I/O: 102
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 46x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

package: 144-LQFP

MCHC908GR8CFAE

NXP

IC MCU 8BIT 7.5KB FLASH 32LQFP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI, SPI
• Peripherals: LVD, POR, PWM
• Number of I/O: 21
• Program Memory Size: 7.5KB (7.5K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 384 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 6x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

package: 32-LQFP

MM908E624ACDWBR2

NXP

IC TRPL SWITCH MCU/LIN 54-SOIC

• Applications: Automotive Mirror Control
• Core Processor: HC08
• Program Memory Type: FLASH (16 kB)
• Controller Series: 908E
• RAM Size: 512 x 8
• Interface: SCI, SPI
• Number of I/O: 16
• Voltage - Supply: 5.5 V ~ 18 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 54-BSSOP (0.295", 7.50mm Width)
• Supplier Device Package: 54-SOIC

package: 54-BSSOP (0.295", 7.50mm Width)

PCKV857EV,151

NXP

IC CLK BUF DDR 190MHZ 1CIRC

• PLL: Yes
• Main Purpose: Memory, DDR, SDRAM
• Input: SSTL-2
• Output: SSTL-2
• Number of Circuits: 1
• Ratio - Input:Output: 1:10
• Differential - Input:Output: Yes/Yes
• Frequency - Max: 190MHz
• Voltage - Supply: 2.3 V ~ 2.7 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 56-VFBGA
• Supplier Device Package: 56-VFBGA (4.5x7)

package: 56-VFBGA

MMA6854KW

NXP

ACCELEROMETER 16QFN

• Type: -
• Axis: -
• Acceleration Range: -
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): -
• Bandwidth: -
• Output Type: -
• Voltage - Supply: -
• Features: -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 16-QFN Exposed Pad
• Supplier Device Package: 16-QFN-EP (6x6)

package: 16-QFN Exposed Pad

FS32K144HRT0VMHR

NXP

S32K144 100 MAPBGA

• Core Processor: ARM® Cortex®-M4F
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b, D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 100-LBGA
• Supplier Device Package: 100-MAPBGA (11x11)

package: 100-LBGA

S912ZVM16F1MKH

NXP

MAGNIV 16-BIT MCU S12Z CORE 16

• Core Processor: S12Z
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: SCI, SPI
• Peripherals: DMA, POR, WDT
• Number of I/O: 31
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 128 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
• Data Converters: A/D 9x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP Exposed Pad
• Supplier Device Package: 64-LQFP-EP (10x10)

package: 64-LQFP Exposed Pad

SJA1124AHG/0Z

NXP

IC TRANSCEIVER FULL 4/4 24DHVQFN

• Type: Transceiver
• Protocol: LIN
• Number of Drivers/Receivers: 4/4
• Duplex: Full
• Receiver Hysteresis: -
• Data Rate: 20kbps
• Voltage - Supply: 5V ~ 28V
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 24-VFQFN Exposed Pad
• Supplier Device Package: 24-DHVQFN (3.5x5.5)

package: 24-VFQFN Exposed Pad

LS1018ASN7KQA

NXP

IC MPU QORIQ LAYER 1GHZ 448FBGA

• Core Processor: ARM® Cortex®-A72
• Number of Cores/Bus Width: 1 Core, 64-Bit
• Speed: 1GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: 1Gbps (1), 2.5Gbps (5)
• SATA: SATA 6Gbps (1)
• USB: -
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 448-BFBGA
• Supplier Device Package: 448-FBGA (17x17)

package: -

Request a Quote

TFA8200HN-N1J

NXP

LOW POWER CLASS D AMP

• Type: -
• Output Type: -
• Max Output Power x Channels @ Load: -
• Voltage - Supply: -
• Features: -
• Mounting Type: -
• Operating Temperature: -
• Supplier Device Package: -
• Package / Case: -

package: -

Request a Quote

MC33GD3100BEK

NXP

GATE DRIVERS HV ISOLATED GATE DR

• Driven Configuration: Half-Bridge
• Channel Type: Single
• Number of Drivers: 1
• Gate Type: IGBT, N-Channel MOSFET
• Voltage - Supply: 5V
• Logic Voltage - VIL, VIH: -
• Current - Peak Output (Source, Sink): 15A, 15A
• Input Type: -
• High Side Voltage - Max (Bootstrap): -
• Rise / Fall Time (Typ): -
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 32-BSSOP (0.295", 7.50mm Width)
• Supplier Device Package: 32-SOIC

package: -

Request a Quote