NXP Producten

MRF7S27130HSR5

NXP

FET RF 65V 2.7GHZ NI-780S

• Transistor Type: LDMOS
• Frequency: 2.7GHz
• Gain: 16.5dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.5A
• Power - Output: 23W
• Voltage - Rated: 65V
• Package / Case: NI-780S
• Supplier Device Package: NI-780S

package: NI-780S

BB145B,115

NXP

DIODE VAR CAP 6V SOD-523

• Capacitance @ Vr, F: 2.95pF @ 4V, 1MHz
• Capacitance Ratio: 2.2
• Capacitance Ratio Condition: C1/C4
• Voltage - Peak Reverse (Max): 6V
• Diode Type: Single
• Q @ Vr, F: -
• Operating Temperature: -55°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SC-79, SOD-523
• Supplier Device Package: SOD-523

package: SC-79, SOD-523

TDA3681ATH/N1C,512

NXP

IC VOLT REG W/SW & IGNIT 20-HSOP

• Applications: Ignition Buffer, Regulator
• Current - Supply: 110µA
• Voltage - Supply: 9.5 V ~ 18 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
• Supplier Device Package: 20-HSOP

package: 20-SOIC (0.433", 11.00mm Width) Exposed Pad

MCZ33742EG

NXP

IC SYSTEM BASIS CHIP CAN 28-SOIC

• Applications: Automotive
• Current - Supply: 42mA
• Voltage - Supply: 5.5 V ~ 18 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

package: 28-SOIC (0.295", 7.50mm Width)

TEA1713T/N1,518

NXP

IC CTLR RESONANT PFC 24SOIC

• Mode: Discontinuous Conduction (DCM)
• Frequency - Switching: 125kHz
• Current - Startup: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 24-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 24-SO

package: 24-SOIC (0.295", 7.50mm Width)

TEA1750T/N1,518

NXP

IC PFC CONTROLLER DCM16SOIC

• Output Isolation: Isolated
• Internal Switch(s): No
• Voltage - Breakdown: 650V
• Topology: Flyback
• Voltage - Start Up: 22V
• Voltage - Supply (Vcc/Vdd): 15 V ~ 38 V
• Duty Cycle: -
• Frequency - Switching: 125kHz
• Power (Watts): 250W
• Fault Protection: Current Limiting, Over Temperature, Over Voltage
• Control Features: -
• Operating Temperature: -40°C ~ 150°C (TJ)
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO
• Mounting Type: Surface Mount

package: 16-SOIC (0.154", 3.90mm Width)

74HC670D,652

NXP

IC 4X4 REGISTER FILE 3ST 16SOIC

• Logic Type: Register File
• Output Type: Tri-State
• Number of Elements: 1
• Number of Bits per Element: 4
• Function: Universal
• Voltage - Supply: 2 V ~ 6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO

package: 16-SOIC (0.154", 3.90mm Width)

74HCT163N,652

NXP

IC SYNC 4BIT BINARY COUNT 16-DIP

• Logic Type: Binary Counter
• Direction: Up
• Number of Elements: 1
• Number of Bits per Element: 4
• Reset: Synchronous
• Timing: Synchronous
• Count Rate: 45MHz
• Trigger Type: Positive Edge
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

package: 16-DIP (0.300", 7.62mm)

TDA18250BHN/C1K

NXP

IC TUNER CABLE/STB 32HVQFN

• Type: Tuner
• Applications: Set-Top Boxes
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)

package: 32-VFQFN Exposed Pad

TDA8566TH1/N2S,118

NXP

IC AMP AUDIO BTL CAR 55W 24HSOP

• Type: Class B
• Output Type: 2-Channel (Stereo)
• Max Output Power x Channels @ Load: 55W x 2 @ 2 Ohm
• Voltage - Supply: 6 V ~ 18 V
• Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: 24-HSOP
• Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad

package: 24-BSOP (0.433", 11.00mm Width) Exposed Pad

UJA1069TW24/3V3:51

NXP

IC LIN FAIL-SAFE 24-HTSSOP

• Applications: Automotive
• Interface: LIN (Local Interconnect Network)
• Voltage - Supply: 3.3V
• Package / Case: 24-TSSOP (0.173", 4.40mm Width) Exposed Pad
• Supplier Device Package: 24-HTSSOP
• Mounting Type: Surface Mount

package: 24-TSSOP (0.173", 4.40mm Width) Exposed Pad

MPC8535BVTANG

NXP

IC MPU MPC85XX 800MHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: SATA 3Gbps (1)
• USB: USB 2.0 (2)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

package: 783-BBGA, FCBGA

KMPC8270CVRMIBA

NXP

IC MPU MPC82XX 266MHZ 516BGA

• Core Processor: PowerPC G2_LE
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 266MHz
• Co-Processors/DSP: Communications; RISC CPM
• RAM Controllers: DRAM, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (3)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 516-BBGA
• Supplier Device Package: 516-FPBGA (27x27)

package: 516-BBGA

MCIMX6U7CVM08AB

NXP

IC MPU I.MX6DL 800MHZ 624MAPBGA

• Core Processor: ARM? Cortex?-A9
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Multimedia; NEON? SIMD
• RAM Controllers: LPDDR2, LVDDR3, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100/1000 Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (4)
• Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
• Package / Case: 624-LFBGA
• Supplier Device Package: 624-MAPBGA (21x21)

package: 624-LFBGA

MCIMX353DJQ5C

NXP

IC MPU I.MX35 532MHZ 400MAPBGA

• Core Processor: ARM1136JF-S
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 532MHz
• Co-Processors/DSP: Multimedia; GPU, IPU, VFP
• RAM Controllers: LPDDR, DDR2
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, KPP, LCD
• Ethernet: 10/100 Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
• Operating Temperature: -20°C ~ 70°C (TA)
• Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
• Package / Case: 400-LFBGA
• Supplier Device Package: 400-MAPBGA (17x17)

package: 400-LFBGA

MCHC908QY1MDWE

NXP

IC MCU 8BIT 1.5KB FLASH 16SOIC

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: -
• Peripherals: LVD, POR, PWM
• Number of I/O: 13
• Program Memory Size: 1.5KB (1.5K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SOIC

package: 16-SOIC (0.295", 7.50mm Width)

MC68HC908QY1CP

NXP

IC MCU 8BIT 1.5KB FLASH 16DIP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: -
• Peripherals: LVD, POR, PWM
• Number of I/O: 13
• Program Memory Size: 1.5KB (1.5K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

package: 16-DIP (0.300", 7.62mm)

LPC1768FET100,551

NXP

IC MCU 32BIT 512KB FLASH 100BGA

• Core Processor: ARM? Cortex?-M3
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
• Number of I/O: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
• Data Converters: A/D 8x12b, D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-TFBGA
• Supplier Device Package: 100-TFBGA (9x9)

package: 100-TFBGA

KMC8113TMP4800V

NXP

IC DSP 300/400MHZ 431FCBGA

• Type: SC140 Core
• Interface: Ethernet, I2C, TDM, UART
• Clock Rate: 400MHz
• Non-Volatile Memory: External
• On-Chip RAM: 1.436MB
• Voltage - I/O: 3.30V
• Voltage - Core: 1.10V
• Operating Temperature: -40°C ~ 105°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 431-BFBGA, FCBGA
• Supplier Device Package: 431-FCPBGA (20x20)

package: 431-BFBGA, FCBGA

TDA8763AM/3/C5,118

NXP

IC ADC 10BIT HS 28SSOP

• Number of Bits: 10
• Sampling Rate (Per Second): 30M
• Number of Inputs: 1
• Input Type: Single Ended
• Data Interface: Parallel
• Configuration: ADC
• Ratio - S/H:ADC: -
• Number of A/D Converters: 1
• Architecture: Sigma-Delta
• Reference Type: External
• Voltage - Supply, Analog: 5V
• Voltage - Supply, Digital: 5V
• Features: -
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 28-SSOP
• Mounting Type: -

package: 28-SSOP (0.209", 5.30mm Width)

IP4357CX17,135

NXP

IC ESD PROTECT HS MMC 17CSP

• Type: -
• Unidirectional Channels: -
• Bidirectional Channels: -
• Voltage - Reverse Standoff (Typ): -
• Voltage - Breakdown (Min): -
• Voltage - Clamping (Max) @ Ipp: -
• Current - Peak Pulse (10/1000µs): -
• Power - Peak Pulse: -
• Power Line Protection: -
• Applications: -
• Capacitance @ Frequency: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

MFRC63102HN,551

NXP

IC CONTACTLESS READER 32HVQFN

• Type: RFID Reader
• Frequency: 13.56MHz
• Standards: ISO 14443, MIFARE
• Interface: I2C, SPI, UART
• Voltage - Supply: 3 V ~ 5.5 V
• Operating Temperature: -25°C ~ 85°C
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)

package: 32-VFQFN Exposed Pad

TDA9899HL/V2,118

NXP

IC IF PROCESSOR MULTISTD 48-LQFP

• Function: IF Processor
• Frequency: -
• RF Type: ATV, DVB, FM
• Secondary Attributes: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

package: 48-LQFP

MC33FS4505KAE

NXP

SYSTEM BASIS CHIP, LINEAR 0.5A V

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: 1V ~ 5V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-HLQFP (7x7)

package: -

Request a Quote

SAF7772EL-200Z100K

NXP

SAF7772EL

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 364-LFBGA
• Supplier Device Package: 364-LFBGA (15x15)

package: -

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MVR5510AMBA4ESR2

NXP

IC PMIC VR5510 ASIL-B

• Applications: -
• Current - Supply: 15mA
• Voltage - Supply: 2.7V ~ 60V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-HVQFN (8x8)

package: -

Request a Quote

SAF4000EL-103Q23AK

NXP

IC

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

Request a Quote

MCIMX7U5DVK08SC

NXP

IC

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

package: -

Request a Quote