NXP Producten

BUK961R4-30E,118

NXP

MOSFET N-CH 30V 120A D2PAK

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 30V
• Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
• Vgs(th) (Max) @ Id: 2.1V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 113nC @ 5V
• Input Capacitance (Ciss) (Max) @ Vds: 16150pF @ 25V
• Vgs (Max): ±10V
• FET Feature: -
• Power Dissipation (Max): 357W (Tc)
• Rds On (Max) @ Id, Vgs: 1.4 mOhm @ 25A, 5V
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: D2PAK
• Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

package: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

MRF6S21190HR3

NXP

FET RF 68V 2.17GHZ NI880

• Transistor Type: LDMOS
• Frequency: 2.11GHz ~ 2.17GHz
• Gain: 16dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.6A
• Power - Output: 54W
• Voltage - Rated: 68V
• Package / Case: NI-880
• Supplier Device Package: NI-880

package: NI-880

MCZ33937AEK

NXP

IC PRE-DRIVER 3PH ENH 54-SOIC

• Motor Type - Stepper: -
• Motor Type - AC, DC: Brushless DC (BLDC)
• Function: Controller - Commutation, Direction Management
• Output Configuration: Pre-Driver - Half Bridge (3)
• Interface: SPI
• Technology: NMOS
• Step Resolution: -
• Applications: Automotive
• Current - Output: -
• Voltage - Supply: 6 V ~ 58 V
• Voltage - Load: -
• Operating Temperature: -40°C ~ 135°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 54-SOICW-EP

package: 54-SSOP (0.295", 7.50mm Width) Exposed Pad

GTL2002DP/DG,118

NXP

IC XLATR 2BIT BI-DIREC 8-TSSOP

• Translator Type: Voltage Level
• Channel Type: Bidirectional
• Number of Circuits: 1
• Channels per Circuit: 2
• Voltage - VCCA: 1V ~ 5.5V
• Voltage - VCCB: 1V ~ 5.5V
• Input Signal: -
• Output Signal: -
• Output Type: Open Drain
• Data Rate: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Features: Auto-Direction Sensing
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 8-TSSOP

package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

HEC4021BTT,118

NXP

IC PROGRAMMABLE ARRAY 16TSSOP

• Logic Type: Shift Register
• Output Type: Push-Pull
• Number of Elements: 1
• Number of Bits per Element: 8
• Function: Parallel or Serial to Serial
• Voltage - Supply: 3 V ~ 15 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

package: 16-TSSOP (0.173", 4.40mm Width)

74LVCH32373AEC/G:5

NXP

IC 32BIT TRANSP D LATCH 93LFBGA

• Logic Type: D-Type Transparent Latch
• Circuit: 8:8
• Output Type: Tri-State
• Voltage - Supply: 2.7 V ~ 3.6 V
• Independent Circuits: 4
• Delay Time - Propagation: 3ns
• Current - Output High, Low: 24mA, 24mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 96-LFBGA
• Supplier Device Package: 96-LFBGA (13.5x5.5)

package: 96-LFBGA

TDA19978AHV15C183:

NXP

IC HDMI INTERFACE 144HLQFP

• Applications: HDTV
• Interface: HDMI
• Voltage - Supply: 1.8V, 3.3V
• Package / Case: 144-LQFP Exposed Pad
• Supplier Device Package: 144-HLQFP (20x20)
• Mounting Type: Surface Mount

package: 144-LQFP Exposed Pad

MC145027DW

NXP

IC DECODER 5 ADDR 4 DATA 16-SOIC

• Type: Encoder, Decoder
• Applications: Remote Control
• Voltage - Supply, Analog: 4.5 V ~ 18 V
• Voltage - Supply, Digital: 4.5 V ~ 18 V
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SOG

package: 16-SOIC (0.295", 7.50mm Width)

CBTL06DP213EE,118

NXP

IC MUX 6CH DISPLAY PORT 48TFBGA

• Applications: DisplayPort, PCIe
• Multiplexer/Demultiplexer Circuit: 2:1, 4:1
• Switch Circuit: -
• Number of Channels: 6
• On-State Resistance (Max): 14 Ohm (Typ)
• Voltage - Supply, Single (V+): 3 V ~ 3.6 V
• Voltage - Supply, Dual (V±): -
• -3db Bandwidth: 11.1GHz
• Features: Bi-Directional
• Operating Temperature: -40°C ~ 105°C (TA)
• Package / Case: 48-TFBGA
• Supplier Device Package: 48-TFBGA (5x5)

package: 48-TFBGA

MCIMX356AVM4BR2

NXP

IC MPU I.MX35 400MHZ 400MAPBGA

• Core Processor: ARM1136JF-S
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: Multimedia; GPU, IPU, VFP
• RAM Controllers: LPDDR, DDR2
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, KPP, LCD
• Ethernet: 10/100 Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
• Operating Temperature: -40°C ~ 85°C (TA)
• Security Features: Secure Fusebox, Secure JTAG
• Package / Case: 400-LFBGA
• Supplier Device Package: 400-MAPBGA (17x17)

package: 400-LFBGA

MPC8544EVTAQG

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Signal Processing; SPE, Security; SEC
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

package: 783-BBGA, FCBGA

MPC8536EBVJAVLA

NXP

IC MPU MPC85XX 1.5GHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.5GHz
• Co-Processors/DSP: Security; SEC
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 (3)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

package: 783-BBGA, FCBGA

MCIMX515DVK8C

NXP

IC MPU I.MX51 800MHZ 529BGA

• Core Processor: ARM? Cortex?-A8
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Multimedia; NEON? SIMD
• RAM Controllers: LPDDR, DDR2
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100 Mbps (1)
• SATA: -
• USB: USB 2.0 (3), USB 2.0 + PHY (1)
• Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
• Operating Temperature: -20°C ~ 85°C (TC)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
• Package / Case: 529-LFBGA
• Supplier Device Package: 529-BGA Case 2017 (19x19)

package: 529-LFBGA

MCF5235CVF150

NXP

IC MCU 32BIT ROMLESS 256MAPBGA

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 150MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, SPI, UART/USART
• Peripherals: DMA, WDT
• Number of I/O: 113
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.4 V ~ 1.6 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 256-LBGA
• Supplier Device Package: 256-MAPBGA

package: 256-LBGA

MMA1201P

NXP

ACCELEROMETER 38G ANALOG 16DIP

• Type: Analog
• Axis: Z
• Acceleration Range: ±38g
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): 50
• Bandwidth: 400Hz
• Output Type: Analog Voltage
• Voltage - Supply: 4.75 V ~ 5.25 V
• Features: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

package: 16-DIP (0.300", 7.62mm)

OM5577

NXP

BOARD NFC CTLR PN7120A

• Type: Near Field Communication
• Frequency: -
• For Use With/Related Products: PN7120S
• Supplied Contents: 3 Boards

package: -

TEF6644HW/V101K

NXP

IC ONE-CHIP RADIO 64HTQFP

• Frequency: -
• Sensitivity: -
• Data Rate (Max): -
• Modulation or Protocol: AM, FM
• Applications: AM/FM Radio Receiver
• Current - Receiving: -
• Data Interface: PCB, Surface Mount
• Memory Size: -
• Antenna Connector: PCB, Surface Mount
• Features: -
• Voltage - Supply: -
• Operating Temperature: -
• Package / Case: 64-TQFP Exposed Pad
• Supplier Device Package: 64-HTQFP (10x10)

package: 64-TQFP Exposed Pad

TJA1102SHN/0Z

NXP

PHY ETHERNET

• Type: Transceiver
• Protocol: Ethernet
• Number of Drivers/Receivers: 2/2
• Duplex: -
• Receiver Hysteresis: -
• Data Rate: 100Mbps
• Voltage - Supply: 1.8V, 3.3V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-HVQFN (8x8)

package: 56-VFQFN Exposed Pad

S9S08SL8F1MTJ

NXP

8-BIT MCU S08 CORE 8KB FLASH

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 16
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

package: 20-TSSOP (0.173", 4.40mm Width)

S9S12GN32AVFTR

NXP

16-BIT32K FLASH2K RAM

• Core Processor: 12V1
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 40
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 48-TFQFN Exposed Pad
• Supplier Device Package: 48-QFN-EP (7x7)

package: 48-TFQFN Exposed Pad

MFS8633BMBA0ES

NXP

IC FS86 SYSTEM BASIS CHIP ASIL

• Applications: Camera
• Current - Supply: -
• Voltage - Supply: 4.5V ~ 36V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-QFN (7x7)

package: -

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S9S12VR64AAMLCR

NXP

IC MCU 16BIT 64KB FLASH 32LQFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 16
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
• Data Converters: A/D 2x10b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

package: -

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S9S12G128J0VLFR

NXP

IC MCU 16BIT 128KB FLASH 48LQFP

• Core Processor: S12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CANbus, IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 40
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

package: -

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MC10XS4200DFKR2

NXP

HIGH-SIDE SWITCH, 24V, DUAL 10MO

• Switch Type: General Purpose
• Number of Outputs: 2
• Ratio - Input:Output: 1:1
• Output Configuration: High Side
• Output Type: N-Channel
• Interface: SPI
• Voltage - Load: 8V ~ 36V
• Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
• Current - Output (Max): 6A
• Rds On (Typ): 10mOhm (Max)
• Input Type: CMOS
• Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
• Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 23-PowerQFN
• Supplier Device Package: 23-PQFN (12x12)

package: -

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PUMD3-ZL-165

NXP

PUMD3 - NPN/PNP RESISTOR-EQUIPPE

• Transistor Type: -
• Current - Collector (Ic) (Max): -
• Voltage - Collector Emitter Breakdown (Max): -
• Resistor - Base (R1) (Ohms): -
• Resistor - Emitter Base (R2) (Ohms): -
• DC Current Gain (hFE) (Min) @ Ic, Vce: -
• Vce Saturation (Max) @ Ib, Ic: -
• Current - Collector Cutoff (Max): -
• Frequency - Transition: -
• Power - Max: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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MPF5301AMDA0ES

NXP

IC REG BUCK ADJ 8A 24HWQFN

• Function: Step-Down
• Output Configuration: Positive
• Topology: Buck
• Output Type: Adjustable
• Number of Outputs: 1
• Voltage - Input (Min): 2.7V
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 0.5V
• Voltage - Output (Max): 1.2V
• Current - Output: 8A
• Frequency - Switching: 2MHz ~ 3MHz
• Synchronous Rectifier: No
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 24-PowerWFQFN
• Supplier Device Package: 24-HWQFN (4.5x3.5)

package: -

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LPC11U68JBD48K

NXP

IC MCU 32BIT 256KB FLASH 48LQFP

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit Single-Core
• Speed: 50MHz
• Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 34
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 36K x 8
• Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
• Data Converters: A/D 8x12b SAR
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

package: -

PCF2119RU-2-F2-026

NXP

IC LCD CTLR/DRIVER UNCASED

• Display Type: -
• Configuration: -
• Interface: -
• Digits or Characters: -
• Current - Supply: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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