NXP Producten

BUK654R8-40C,127

NXP

MOSFET N-CH 40V 100A TO220AB

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 40V
• Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
• Vgs(th) (Max) @ Id: 2.8V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 88nC @ 10V
• Input Capacitance (Ciss) (Max) @ Vds: 5200pF @ 25V
• Vgs (Max): ±16V
• FET Feature: -
• Power Dissipation (Max): 158W (Tc)
• Rds On (Max) @ Id, Vgs: 4.8 mOhm @ 25A, 10V
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Supplier Device Package: TO-220AB
• Package / Case: TO-220-3

package: TO-220-3

MRF282SR1

NXP

FET RF 65V 2GHZ NI-200S

• Transistor Type: LDMOS
• Frequency: 2GHz
• Gain: 11.5dB
• Voltage - Test: 26V
• Current Rating: -
• Noise Figure: -
• Current - Test: 75mA
• Power - Output: 10W
• Voltage - Rated: 65V
• Package / Case: NI-200S
• Supplier Device Package: NI-200S

package: NI-200S

PZM10NB3,115

NXP

DIODE ZENER 10V 300MW SMT3

• Voltage - Zener (Nom) (Vz): 10V
• Tolerance: ±2%
• Power - Max: 300mW
• Impedance (Max) (Zzt): 10 Ohms
• Current - Reverse Leakage @ Vr: 200nA @ 7V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SMT3; MPAK

package: TO-236-3, SC-59, SOT-23-3

BUK119-50DL,127

NXP

MOSFET N-CH 50V 43A TO220AB

• Switch Type: General Purpose
• Number of Outputs: 1
• Ratio - Input:Output: 1:1
• Output Configuration: Low Side
• Output Type: N-Channel
• Interface: On/Off
• Voltage - Load: 50V (Max)
• Voltage - Supply (Vcc/Vdd): Not Required
• Current - Output (Max): 20A
• Rds On (Typ): 22 mOhm
• Input Type: Non-Inverting
• Features: -
• Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage
• Operating Temperature: 150°C (TJ)
• Package / Case: TO-220-3
• Supplier Device Package: TO-220AB

package: TO-220-3

74HC377N,652

NXP

IC D-TYPE POS TRG SNGL 20DIP

• Function: Standard
• Type: D-Type
• Output Type: Non-Inverted
• Number of Elements: 1
• Number of Bits per Element: 8
• Clock Frequency: 83MHz
• Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 5.2mA, 5.2mA
• Voltage - Supply: 2 V ~ 6 V
• Current - Quiescent (Iq): 8µA
• Input Capacitance: 3.5pF
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Through Hole
• Package / Case: 20-DIP (0.300", 7.62mm)

package: 20-DIP (0.300", 7.62mm)

74ALVCH16832DGG:11

NXP

IC ADDRESS REGISTER DVR 64TSSOP

• Logic Type: Address Driver
• Number of Elements: 1
• Number of Bits per Element: 1:4
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 24mA, 24mA
• Voltage - Supply: 2.3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-TFSOP (0.240", 6.10mm Width)
• Supplier Device Package: 64-TSSOP

package: 64-TFSOP (0.240", 6.10mm Width)

SC16C752BIB48,157

NXP

IC UART DUAL W/FIFO 48-LQFP

• Features: -
• Number of Channels: 2, DUART
• FIFO's: 64 Byte
• Protocol: -
• Data Rate (Max): 5Mbps
• Voltage - Supply: 2.5V, 3.3V, 5V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: -
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

package: 48-LQFP

PC33CM0902WEF

NXP

DUAL CAN HS 14SOIC

• Applications: -
• Interface: -
• Voltage - Supply: -
• Package / Case: -
• Supplier Device Package: -
• Mounting Type: -

package: -

SAF7118EH/V1/G,557

NXP

IC VIDEO DECOD W/FILTER 156HBGA

• Type: Video Decoder
• Applications: Video
• Voltage - Supply, Analog: 3.1 V ~ 3.5 V
• Voltage - Supply, Digital: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Package / Case: 156-BGA Exposed Pad
• Supplier Device Package: 156-HBGA (15x15)

package: 156-BGA Exposed Pad

MPC8313ECZQAFF

NXP

IC MPU MPC83XX 333MHZ 516BGA

• Core Processor: PowerPC e300c3
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 333MHz
• Co-Processors/DSP: Security; SEC 2.2
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Cryptography
• Package / Case: 516-BBGA Exposed Pad
• Supplier Device Package: 516-TEPBGA (27x27)

package: 516-BBGA Exposed Pad

KMPC875CZT133

NXP

IC MPU MPC8XX 133MHZ 256BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 133MHz
• Co-Processors/DSP: Communications; CPM, Security; SEC
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1), 10/100 Mbps (2)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 100°C (TA)
• Security Features: Cryptography
• Package / Case: 256-BBGA
• Supplier Device Package: 256-PBGA (23x23)

package: 256-BBGA

KMPC8349EVVAJF

NXP

IC MPU MPC83XX 533MHZ 672TBGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 533MHz
• Co-Processors/DSP: Security; SEC
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 672-LBGA
• Supplier Device Package: 672-TBGA (35x35)

package: 672-LBGA

MC68340FE25E

NXP

IC MPU M683XX 25MHZ 144CQFP

• Core Processor: CPU32
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 25MHz
• Co-Processors/DSP: -
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 144-BCQFP
• Supplier Device Package: 144-CQFP (26.77x26.77)

package: 144-BCQFP

MCHRC705KJ1CPE

NXP

IC MCU 8BIT 1.2KB OTP 16DIP

• Core Processor: HC05
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: -
• Peripherals: POR, WDT
• Number of I/O: 10
• Program Memory Size: 1.2KB (1.2K x 8)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 64 x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

package: 16-DIP (0.300", 7.62mm)

MCF51AC128CVFUE

NXP

IC MCU 32BIT 128KB FLASH 64QFP

• Core Processor: Coldfire V1
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LVD, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 20x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-QFP
• Supplier Device Package: 64-QFP (14x14)

package: 64-QFP

MK21FN1M0AVMC12

NXP

IC MCU 32BIT 1MB FLASH 121MAPBGA

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CAN, I2C, IrDA, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 81
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 40x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 121-LFBGA
• Supplier Device Package: 121-MAPBGA (8x8)

package: 121-LFBGA

MC88915FN70

NXP

IC DRIVER CLK PLL 70MHZ 28-PLCC

• Type: Clock Driver, Fanout Distribution, Multiplexer
• PLL: Yes
• Input: TTL
• Output: CMOS, TTL
• Number of Circuits: 1
• Ratio - Input:Output: 3:8
• Differential - Input:Output: No/No
• Frequency - Max: 70MHz
• Divider/Multiplier: Yes/Yes
• Voltage - Supply: 4.75 V ~ 5.25 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 28-LCC (J-Lead)
• Supplier Device Package: 28-PLCC (12.45x12.45)

package: 28-LCC (J-Lead)

MPXV5050DP

NXP

SENSOR PRESSURE DUAL PORT 8-SOP

• Pressure Type: Differential
• Operating Pressure: 7.25 PSI (50 kPa)
• Output Type: Analog Voltage
• Output: 0.2 V ~ 4.7 V
• Accuracy: ±2.5%
• Voltage - Supply: 4.75 V ~ 5.25 V
• Port Size: Male - 0.13" (3.3mm) Tube, Dual
• Port Style: Barbed
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: 29.01 PSI (200 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-SMD Module
• Supplier Device Package: -

package: 8-SMD Module

BGA7210X

NXP

IC AMP RF MMIC VGA 32HVQFN

• Frequency: 700MHz ~ 3.8GHz
• P1dB: 23dBm
• Gain: 28dB
• Noise Figure: 6.5dB ~ 8dB
• RF Type: General Purpose
• Voltage - Supply: 4.75 V ~ 5.25 V
• Current - Supply: 195mA
• Test Frequency: 2.5GHz
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)

package: 32-VFQFN Exposed Pad

TEA1998TS/1X

NXP

FLYBACK SR

• Applications: Secondary-Side Controller, Synchronous Rectifier
• Voltage - Input: -
• Voltage - Supply: 60V
• Current - Supply: 250µA
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: SC-74, SOT-457
• Supplier Device Package: 6-TSOP

package: SC-74, SOT-457

SAF7754HN/N208ZMP

NXP

CAR RADIO TUNER & AUDIO DSP

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

T4161NXE7PQB

NXP

QORIQ 64B POWER 16X 1.5GHZ THR

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

package: -

S9S12G64AMLH

NXP

S12 CORE64K FLASH

• Core Processor: 12V1
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CANbus, IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

package: 64-LQFP

S9S12G128ACLFR

NXP

16BIT 128K FLASH

• Core Processor: 12V1
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CANbus, IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 40
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

package: 48-LQFP

T2080NXE8MQB

NXP

IC SOC 64BIT 8X1.2GHZ 896FCBGA

• Core Processor: PowerPC e6500
• Number of Cores/Bus Width: 4 Core, 64-Bit
• Speed: 1.2GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
• Package / Case: 896-BFBGA, FCBGA
• Supplier Device Package: 896-FCPBGA (25x25)

package: 896-BFBGA, FCBGA

SAF7751HV-N208W-JK

NXP

CAR DISP

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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MC35FS6517NAE

NXP

SYSTEM BASIS CHIP, DCDC 1.5A VCO

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: 1V ~ 5V
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-HLQFP (7x7)

package: -

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FS32K144HFT0VMHR

NXP

IC MCU 32B 512KB FLASH 100MAPBGA

• Core Processor: ARM® Cortex®-M4F
• Core Size: 32-Bit Single-Core
• Speed: 80MHz
• Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 89
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
• Data Converters: A/D 16x12b SAR; D/A1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-LFBGA
• Supplier Device Package: 100-MAPBGA (11x11)

package: -

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