NXP Producten

BAP64-05W,115

NXP

DIODE PIN 100V 100MA SOT323

• Diode Type: PIN - 1 Pair Common Cathode
• Voltage - Peak Reverse (Max): 100V
• Current - Max: 100mA
• Capacitance @ Vr, F: 0.35pF @ 20V, 1MHz
• Resistance @ If, F: 1.35 Ohm @ 100mA, 100MHz
• Power Dissipation (Max): 240mW
• Operating Temperature: -65°C ~ 150°C (TJ)
• Package / Case: SC-70, SOT-323
• Supplier Device Package: SOT-323-3

package: SC-70, SOT-323

MC34VR5100A1EP

NXP

IC REG 9OUT BUCK/LDO 48QFN

• Topology: Step-Down (Buck) (3), Linear (LDO) (6)
• Function: Communications Processors
• Number of Outputs: 9
• Frequency - Switching: -
• Voltage/Current - Output 1: 1.8V/3.3V/0.7 V ~ 1.425 V, 3.8A
• Voltage/Current - Output 2: 1.5 V ~ 1.85 V/2.5 V ~ 3.3 V, 1.25A
• Voltage/Current - Output 3: 0.9 V ~ 1.65 V, 1.5A
• w/LED Driver: No
• w/Supervisor: No
• w/Sequencer: No
• Voltage - Supply: 2.8 V ~ 4.5 V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-QFN (7x7)

package: 48-VFQFN Exposed Pad

74LVT00D,118

NXP

IC GATE NAND 4CH 2-INP 14-SO

• Logic Type: NAND Gate
• Number of Circuits: 4
• Number of Inputs: 2
• Features: -
• Voltage - Supply: 2.7 V ~ 3.6 V
• Current - Quiescent (Max): -
• Current - Output High, Low: 20mA, 32mA
• Logic Level - Low: 0.8V
• Logic Level - High: 2V
• Max Propagation Delay @ V, Max CL: 2.7ns @ 3.3V, 50pF
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Supplier Device Package: 14-SO
• Package / Case: 14-SOIC (0.154", 3.90mm Width)

package: 14-SOIC (0.154", 3.90mm Width)

KMPC8313EVRAFFB

NXP

IC MPU MPC83XX 333MHZ 516BGA

• Core Processor: PowerPC e300c3
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 333MHz
• Co-Processors/DSP: Security; SEC 2.2
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography
• Package / Case: 516-BBGA Exposed Pad
• Supplier Device Package: 516-TEPBGA (27x27)

package: 516-BBGA Exposed Pad

KMPC8360VVALFHA

NXP

IC MPU MPC83XX 667MHZ 740TBGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 667MHz
• Co-Processors/DSP: Communications; QUICC Engine
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 740-LBGA
• Supplier Device Package: 740-TBGA (37.5x37.5)

package: 740-LBGA

KMPC8358EZUAGDG

NXP

IC MPU MPC83XX 400MHZ 740TBGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 740-LBGA
• Supplier Device Package: 740-TBGA (37.5x37.5)

package: 740-LBGA

B4420NSE7QQMD

NXP

BASEBAND PROC PILOT REV 1.0

• Core Processor: PowerPC e6500
• Number of Cores/Bus Width: 2 Core, 64-Bit
• Speed: 1.6GHz
• Co-Processors/DSP: Signal Processing; SC3900FP FVP - Dual
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 1/2.5 Gbps (4)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
• Package / Case: 1020-BBGA, FCBGA
• Supplier Device Package: 1020-FCPBGA (33x33)

package: 1020-BBGA, FCBGA

MCIMX6X4AVM08AB

NXP

IC MPU I.MX6SX 800MHZ 400MAPBGA

• Core Processor: ARM? Cortex?-A9, ARM? Cortex?-M4
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 200MHz, 800MHz
• Co-Processors/DSP: Multimedia; NEON? MPE
• RAM Controllers: LPDDR2, LVDDR3, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD, LVDS
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
• Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
• Operating Temperature: -40°C ~ 125°C (TJ)
• Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
• Package / Case: 400-LFBGA
• Supplier Device Package: 400-MAPBGA (14x14)

package: 400-LFBGA

MCIMX27VOP4A

NXP

IC MPU I.MX27 400MHZ 404MAPBGA

• Core Processor: ARM926EJ-S
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: Security; SAHARAH2
• RAM Controllers: DDR
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100 Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (3)
• Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V
• Operating Temperature: -20°C ~ 85°C (TA)
• Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
• Package / Case: 404-LFBGA
• Supplier Device Package: -

package: 404-LFBGA

S912ZVML12F2MKHR

NXP

IC MCU 16BIT 128KB FLASH 64LQFP

• Core Processor: S12Z
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CAN, LIN, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 42
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 9x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP Exposed Pad
• Supplier Device Package: 64-LQFP EP (10x10)

package: 64-LQFP Exposed Pad

MCF52234CVM60J

NXP

IC MCU 32BIT 256KB FLASH 121BGA

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 60MHz
• Connectivity: CAN, Ethernet, I2C, SPI, UART/USART
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number of I/O: 80
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 121-LBGA
• Supplier Device Package: 121-MAPBGA (12x12)

package: 121-LBGA

LPC2460FET208,551

NXP

IC MCU 32BIT ROMLESS 208TFBGA

• Core Processor: ARM7?
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Number of I/O: 160
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 96K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 208-TFBGA
• Supplier Device Package: 208-TFBGA (15x15)

package: 208-TFBGA

MC9S08AW60MPUE

NXP

IC MCU 8BIT 60KB FLASH 64LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

package: 64-LQFP

PCF8563T/F4,112

NXP

IC RTC CLK/CALENDAR I2C 8-SOIC

• Type: Clock/Calendar
• Features: Alarm, Leap Year, Watchdog Timer
• Memory Size: -
• Time Format: HH:MM:SS (24 hr)
• Date Format: YY-MM-DD-dd
• Interface: I2C, 2-Wire Serial
• Voltage - Supply: 1.8 V ~ 5.5 V
• Voltage - Supply, Battery: -
• Current - Timekeeping (Max): 0.6µA ~ 0.75µA @ 2V ~ 5V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

package: 8-SOIC (0.154", 3.90mm Width)

MPC9230FA

NXP

IC PECL CLOCK LV 800MHZ 32-LQFP

• Type: Clock/Frequency Synthesizer, Clock Generator, Multiplexer
• PLL: Yes with Bypass
• Input: Crystal
• Output: LVPECL
• Number of Circuits: 1
• Ratio - Input:Output: 1:1
• Differential - Input:Output: No/Yes
• Frequency - Max: 750MHz
• Divider/Multiplier: Yes/No
• Voltage - Supply: 3.135 V ~ 3.465 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

package: 32-LQFP

MC100ES6226FA

NXP

IC CLK BUFFER 1:9 3GHZ 32LQFP

• Type: Fanout Buffer (Distribution), Divider
• Number of Circuits: 1
• Ratio - Input:Output: 1:9
• Differential - Input:Output: Yes/Yes
• Input: LVPECL
• Output: LVCMOS, LVPECL
• Frequency - Max: 3GHz
• Voltage - Supply: 2.375 V ~ 3.465 V
• Operating Temperature: 0°C ~ 110°C
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

package: 32-LQFP

SL3S4021FHKH

NXP

IC U-CODE RF FE DUAL DIFF 8XQFN

• Type: RFID Transponder
• Frequency: 860MHz ~ 960MHz
• Standards: ISO 18000-6
• Interface: I2C
• Voltage - Supply: 1.8 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-XFQFN Exposed Pad
• Supplier Device Package: 8-XQFN (1.6x1.6)

package: 8-XFQFN Exposed Pad

MC13191FCR2

NXP

IC RF TXRX ISM>1GHZ 32-VFQFN

• Type: TxRx Only
• RF Family/Standard: General ISM > 1GHZ
• Protocol: -
• Modulation: DSSS, O-QPSK
• Frequency: 2.4GHz
• Data Rate (Max): 250kbps
• Power - Output: 4dBm
• Sensitivity: -92dBm
• Memory Size: -
• Serial Interfaces: SPI
• GPIO: 7
• Voltage - Supply: 2 V ~ 3.4 V
• Current - Receiving: 37mA
• Current - Transmitting: 30mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 32-VFQFN Exposed Pad

package: 32-VFQFN Exposed Pad

MMG2401NR2

NXP

IC RF POWER AMP WLAN 12-QFN

• Frequency: 2.4GHz ~ 2.5GHz
• P1dB: -
• Gain: 26.5dB
• Noise Figure: -
• RF Type: 802.11g
• Voltage - Supply: 3.3V
• Current - Supply: 210mA
• Test Frequency: -
• Package / Case: 12-VFQFN Exposed Pad
• Supplier Device Package: 12-QFN (3x3)

package: 12-VFQFN Exposed Pad

BGA7204,115

NXP

RF AMP 2.75GHZ VGA 32HVQFN

• Frequency: 400MHz ~ 2.75GHz
• P1dB: 20.5dBm
• Gain: 16.5dB ~ 18.5dB
• Noise Figure: 7dB
• RF Type: General Purpose
• Voltage - Supply: 4.75 V ~ 5.25 V
• Current - Supply: 115mA
• Test Frequency: 2.1GHz
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)

package: 32-VFQFN Exposed Pad

TJF1052IT/2Y

NXP

DGTL ISOLATOR 2.5KV 2CH CAN 16SO

• Technology: Capacitive Coupling
• Type: CAN
• Isolated Power: No
• Number of Channels: 2
• Inputs - Side 1/Side 2: 1/1
• Channel Type: Unidirectional
• Voltage - Isolation: 2500Vrms
• Common Mode Transient Immunity (Min): 20kV/µs
• Data Rate: 2Mbps
• Propagation Delay tpLH / tpHL (Max): -
• Pulse Width Distortion (Max): -
• Rise / Fall Time (Typ): -
• Voltage - Supply: 3 V ~ 5.25 V
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SO

package: 16-SOIC (0.295", 7.50mm Width)

MK28FN2M0ACAU15R

NXP

150MHZ ARM CORTEX-M4F

• Core Processor: ARM® Cortex®-M4
• Core Size: 32-Bit
• Speed: 150MHz
• Connectivity: EBI/EMI, I²C, QSPI, SDHC, SPI, UART/USART, USB
• Peripherals: DMA, I²S, PWM, WDT
• Number of I/O: 120
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1M x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 16b SAR, D/A 2x6b, 1x12b
• Oscillator Type: Internal/External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

S912XDG128F2VAL

NXP

16-BIT MCU S12X CORE 128KB FLA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CANbus, I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 91
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 12K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 8x10b, 16x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

package: 112-LQFP

UJA1131HW/5V0/S90Y

NXP

IC SBCS CAN HIGH SPEED 48HTQFP

• Applications: -
• Current - Supply: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

FS32K146HRT0MLQT

NXP

IC MCU 32BIT 1MB FLASH 144LQFP

• Core Processor: ARM® Cortex®-M4F
• Core Size: 32-Bit Single-Core
• Speed: 80MHz
• Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 128
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
• Data Converters: A/D 24x12b SAR; D/A1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

package: -

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FB32K146HFT0VLQT

NXP

S32K146, M4F, FLASH 1M, RAM 128K

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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S912ZVMAL1F0WLFR

NXP

VMA16, 16K FLASH, 1K RAM, 48LQFP

• Core Processor: S12Z
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 31
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 128 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 3.5V ~ 20V
• Data Converters: A/D 7x12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

package: -

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FS32K144HFT0VLFR

NXP

S32K144 32-BIT MCU, ARM CORTEX-M

• Core Processor: ARM® Cortex®-M4F
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
• Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
• Number of I/O: 89
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
• Data Converters: A/D 16x12b SAR; D/A 1x8b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

package: -

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