Epson Electronics America Inc-Semiconductor Div Producten

S1F81150F0A2000

Epson Electronics America Inc-Semiconductor Div

IC REG HEX BUCK/LINEAR 16TSSOP

• Topology: Step-Down (Buck) (5), Linear (LDO) (1)
• Function: Any Function
• Number of Outputs: 6
• Frequency - Switching: -
• Voltage/Current - Output 1: Controller
• Voltage/Current - Output 2: Controller
• Voltage/Current - Output 3: Controller
• w/LED Driver: No
• w/Supervisor: No
• w/Sequencer: No
• Voltage - Supply: 2.9 V ~ 4.5 V
• Operating Temperature: -
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-QFP (7x7)

package: 48-LQFP

S1D15711D00B000

Epson Electronics America Inc-Semiconductor Div

IC DRIVER LCD

• Type: Display Driver
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Chip

package: Die

S1R72005F00A100

Epson Electronics America Inc-Semiconductor Div

IC CTRLR/PHY USB OTG 64-QFP

• Protocol: -
• Function: -
• Interface: -
• Standards: -
• Voltage - Supply: -
• Current - Supply: -
• Operating Temperature: -
• Package / Case: 64-QFP
• Supplier Device Package: -

package: 64-QFP

S1R72U16B08E200

Epson Electronics America Inc-Semiconductor Div

IC CONTROLLER USB 81BGA

• Protocol: USB
• Function: Host Controller
• Interface: USB
• Standards: USB 2.0
• Voltage - Supply: 1.8V, 3.3V
• Current - Supply: 65mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 81-TFBGA
• Supplier Device Package: 81-FBGA (8x8)

package: 81-TFBGA

S1R72V27B05H100

Epson Electronics America Inc-Semiconductor Div

IC CONTROLLER USB 81BGA

• Protocol: USB
• Function: Host Controller
• Interface: USB
• Standards: USB 2.0
• Voltage - Supply: 1.8V, 3.3V
• Current - Supply: 40.2mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 60-TFBGA
• Supplier Device Package: 60-FBGA (5x5)

package: 60-TFBGA

S1R72V27B08H100

Epson Electronics America Inc-Semiconductor Div

IC CONTROLLER USB 60BGA

• Protocol: USB
• Function: Host Controller
• Interface: USB
• Standards: USB 2.0
• Voltage - Supply: 1.8V, 3.3V
• Current - Supply: 40.2mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 81-TFBGA
• Supplier Device Package: 81-FBGA (8x8)

package: 81-TFBGA

S1R72V17B00A200

Epson Electronics America Inc-Semiconductor Div

IC CONTROLLER USB 60BGA

• Protocol: USB
• Function: Host Controller
• Interface: USB
• Standards: USB 2.0
• Voltage - Supply: 1.8V, 3.3V
• Current - Supply: 39.3mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 60-TFBGA
• Supplier Device Package: 60-FBGA (5x5)

package: 60-TFBGA

S1C17702F101100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 128KB FLASH 176QFP

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 8.2MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: LCD, PWM, WDT
• Number of I/O: 28
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 12K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 176-LQFP
• Supplier Device Package: -

package: 176-LQFP

S1C17704B402100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 64KB FLASH 161VFBGA

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 8.2MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: LCD, PWM, WDT
• Number of I/O: 28
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 161-VFBGA
• Supplier Device Package: 161-VFBGA (7x7)

package: 161-VFBGA

S1C17W23F101100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 96KB FLASH 128TQFP

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 4.2MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: LCD, PWM, RFC, WDT
• Number of I/O: 41
• Program Memory Size: 96KB (96K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.2 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 128-TQFP
• Supplier Device Package: 128-TQFP (14x14)

package: 128-TQFP

S1C17F57D00E200

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 32KB FLASH DIE

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 4.2MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: PWM, WDT
• Number of I/O: 29
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: Die
• Supplier Device Package: -

package: Die

S1C31W74B201000

Epson Electronics America Inc-Semiconductor Div

32-BIT SNGL CHIP MICROCONTROLLER

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 21MHz
• Connectivity: I2C, IrDA, QSPI, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
• Number of I/O: 71
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 181-VFBGA
• Supplier Device Package: 181-VFBGA (8x8)

package: 181-VFBGA

S1C17W14F102100-90

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 48KB FLASH 4KB

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

S1C17W14F102100

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 48KB FLASH 4KB

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

S1C17W18F103100

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 128KB FLASH 8K

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

S1C17W15F005100

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 64KB FLASH 4KB

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

S1C17W03F102100-490

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ16KB FLASH 2KB

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

S1C17M13F101100-250

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 16.8MHZ16KB FLASH 2K

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

S1D13A04B00B200-240

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER BUILT-IN 160KB SR

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 121-TFBGA
• Supplier Device Package: 121-PFBGA (10x10)

package: 121-TFBGA

S1D13A04F00A100-90

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER BUILT-IN 160KB SR

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 128-TQFP
• Supplier Device Package: 128-TQFP15 (14x14)

package: 128-TQFP

S1D13L02F00A100-36

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER BUILT-IN 1024KB S

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 208-LQFP
• Supplier Device Package: 208-QFP22 (28x28)

package: 208-LQFP

S1D13746F01A600-90

Epson Electronics America Inc-Semiconductor Div

TV OUT CONTROLLER; 312KB SRAM+ A

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 128-LQFP
• Supplier Device Package: 128-QFP15 (14x14)

package: 128-LQFP

S1D13781F00A100-90

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER BUILT-IN 384KB SR

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Supplier Device Package: 100-QFP15 (14x14)

package: 100-LQFP

S1D13746B01B600-416

Epson Electronics America Inc-Semiconductor Div

TV OUT CONTROLLER; 312KB SRAM+ A

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 160-TFBGA
• Supplier Device Package: 100-PFBGA (7x7)

package: 160-TFBGA

S1D13U11F00A100

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER UP TO 16MB EXTERN

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Supplier Device Package: 144-QFP20 (20x20)

package: 144-LQFP

S1D13L01F00A100-90

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER BUILT-IN 384KB SR

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 128-LQFP
• Supplier Device Package: 128-QFP15 (14x14)

package: 128-LQFP

S1D13A04F00A100

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 128TQFP

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 128-TQFP
• Supplier Device Package: 128-TQFP (14x14)

package: 128-TQFP

S1C17M22F001100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 16KB FLASH 48TQFP12

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 21MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
• Number of I/O: 39
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 8x12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 48-TQFP
• Supplier Device Package: 48-TQFP12 (7x7)

package: -

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