Epson Electronics America Inc-Semiconductor Div Producten

S1S65000F00A100

Epson Electronics America Inc-Semiconductor Div

IC WEB CAMERA 128-QFP

• Type: -
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

S1F75510M0A010B

Epson Electronics America Inc-Semiconductor Div

IC DC/DC CONV W/VOLT REG 24-SSOP

• Applications: Controller, TFT LCD
• Voltage - Input: 2.7 V ~ 3.6 V
• Number of Outputs: 4
• Voltage - Output: -10V, 5V, 15V
• Operating Temperature: -10°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 24-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 24-SSOP

package: 24-SSOP (0.209", 5.30mm Width)

S1F81100F0R2000

Epson Electronics America Inc-Semiconductor Div

IC REG CTRLR 48QFP

• Output Type: -
• Function: -
• Output Configuration: -
• Topology: -
• Number of Outputs: 4
• Output Phases: -
• Voltage - Supply (Vcc/Vdd): 2.8 V ~ 5.5 V
• Frequency - Switching: -
• Duty Cycle (Max): -
• Synchronous Rectifier: -
• Clock Sync: -
• Serial Interfaces: -
• Control Features: -
• Operating Temperature: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-QFP (7x7)

package: 48-LQFP

S1F78520M0A0100

Epson Electronics America Inc-Semiconductor Div

IC REG CHRG PUMP STEP-DN 24-SSOP

• Applications: -
• Current - Supply: 100µA
• Voltage - Supply: 3.6 V ~ 5.5 V
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 24-LSSOP (0.220", 5.60mm Width)
• Supplier Device Package: 24-SSOP

package: 24-LSSOP (0.220", 5.60mm Width)

S1D13515B00B100

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 256LBGA

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 256-LBGA
• Supplier Device Package: 256-PBGA (17x17)

package: 256-LBGA

S1D13A05F00A100

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 121FBGA

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 121-TFBGA
• Supplier Device Package: 121-PFBGA (10x10)

package: 121-TFBGA

S1D13T03F10A100

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC EPD CTRLR 64TQFP13

• Type: Graphic Controller
• Applications: EPD Panel
• Mounting Type: Surface Mount
• Package / Case: 64-TQFP
• Supplier Device Package: 64-TQFP (10x10)

package: 64-TQFP

S1D13L04F00A100

Epson Electronics America Inc-Semiconductor Div

IC LCD CONTROLLER 208-QFP

• Type: Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 208-LQFP
• Supplier Device Package: 208-QFP (28x28)

package: 208-LQFP

S1R72V17B00B200

Epson Electronics America Inc-Semiconductor Div

IC CONTROLLER USB 81BGA

• Protocol: USB
• Function: Host Controller
• Interface: USB
• Standards: USB 2.0
• Voltage - Supply: 1.8V, 3.3V
• Current - Supply: 39.3mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 81-TFBGA
• Supplier Device Package: 81-FBGA (8x8)

package: 81-TFBGA

S1C17705F101100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 512KB FLASH 240QFP

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 8.2MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: LCD, PWM, WDT
• Number of I/O: 35
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 12K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -25°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 240-BFQFP
• Supplier Device Package: -

package: 240-BFQFP

S1C17M01F201100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 32KB FLASH 64TQFP

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 16.3MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: AMRC, LCD, PWM, RFC, WDT
• Number of I/O: 19
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-TQFP
• Supplier Device Package: 64-TQFP (10x10)

package: 64-TQFP

S1V30120F01A100-160

Epson Electronics America Inc-Semiconductor Div

TEXT TO SPEECH IC

• Function: Voice Processor
• Applications: Signal Mixing
• Number of Channels: 1
• Interface: SPI
• Voltage - Supply: -
• Operating Temperature: -
• Specifications: -
• Package / Case: 64-TQFP
• Supplier Device Package: 64-TQFP13 (10x10)

package: 64-TQFP

S1C17W34F001100-40

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 128KB FLASH 12

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

S1C17W23F101100-90

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 96KB FLASH 8KB

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

S1C17W36F001100

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 384KB FLASH 16

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

S1C17W35F001100

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 256KB FLASH 12

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

S1C17W18F103100-119

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 128KB FLASH 8K

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

S1C17W13F003100-250

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 48KB FLASH 2KB

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

S2D13P04F00A100-90

Epson Electronics America Inc-Semiconductor Div

CAMERA INTERFACE CHIP WITH 4 CHA

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Supplier Device Package: 100-QFP15 (14x14)

package: 100-LQFP

S1D13515B00B100-84

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER UP TO 64MB EXTERN

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 256-LBGA
• Supplier Device Package: 256-PBGA1U (17x17)

package: 256-LBGA

S1D13748F00A100-60

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER BUILT-IN 1024KB S

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Supplier Device Package: 144-QFP20 (20x20)

package: 144-LQFP

S1D13743F00A200-60

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER BUILT-IN 464KB SR

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Supplier Device Package: 144-QFP20 (20x20)

package: 144-LQFP

S1D13715B00B200-240

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER BUILT-IN 320KB SR

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 160-TFBGA
• Supplier Device Package: 160-PFBGA (10x10)

package: 160-TFBGA

S1D13L04F00A100-36

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER UP TO 16MB EXTERN

• Type: Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 208-LQFP
• Supplier Device Package: 208-QFP22 (28x28)

package: 208-LQFP

S1C17M32F001100-160

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 64KB FLASH 64TQFP13

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 17.12MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, Voltage Detect, WDT
• Number of I/O: 53
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 3x12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 64-TQFP
• Supplier Device Package: 64-TQFP13 (10x10)

package: -

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S1C17M34F001100-160

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 64KB FLASH 64TQFP13

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 17.12MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, Voltage Detect, WDT
• Number of I/O: 51
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 6x12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 64-TQFP
• Supplier Device Package: 64-TQFP13 (10x10)

package: -

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S1C31D01F101000

Epson Electronics America Inc-Semiconductor Div

IC MCU 32BIT 256KB FLSH 80TQFP14

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit
• Speed: 21MHz
• Connectivity: I2C, IrDA, QSPI, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, Temp Sensor, Voltage Detect, WDT
• Number of I/O: 57
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 96K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 8x12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 80-TQFP
• Supplier Device Package: 80-TQFP14 (12x12)

package: -

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S1C17M21F001100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 16KB FLASH 32TQFP15

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 21MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
• Number of I/O: 23
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 6x12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-TQFP
• Supplier Device Package: 32-TQFP15 (7x7)

package: -

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