Xilinx Inc. Producten

XC17S20XLVO8C

Xilinx Inc.

IC 3V PROM SER 200K 8-SOIC

• Programmable Type: OTP
• Memory Size: 200kb
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-TSOP

package: 8-SOIC (0.154", 3.90mm Width)

XCF16PFSG48C

Xilinx Inc.

IC PROM SRL 1.8V 16M 48CSBGA

• Programmable Type: In System Programmable
• Memory Size: 16Mb
• Voltage - Supply: 1.65 V ~ 2 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-TFBGA, CSPBGA
• Supplier Device Package: 48-CSP (8x9)

package: 48-TFBGA, CSPBGA

XC7Z020-1CLG484CES

Xilinx Inc.

IC SOC CORTEX-A9 ARTIX-7 484BGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 667MHz
• Primary Attributes: Artix?-7 FPGA, 85K Logic Cells
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-LFBGA, CSPBGA
• Supplier Device Package: 484-CSPBGA (19x19)

package: 484-LFBGA, CSPBGA

XCZU17EG-2FFVC1760E

Xilinx Inc.

IC FPGA 512 I/O 1760FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 926K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FCBGA (42.5x42.5)

package: 1760-BBGA, FCBGA

XCZU7EG-2FFVF1517E

Xilinx Inc.

IC FPGA 464 I/O 1517FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

package: 1517-BBGA, FCBGA

XC2V3000-4FGG676C

Xilinx Inc.

IC FPGA 484 I/O 676FBGA

• Number of LABs/CLBs: 3584
• Number of Logic Elements/Cells: -
• Total RAM Bits: 1769472
• Number of I/O: 484
• Number of Gates: 3000000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BGA
• Supplier Device Package: 676-FBGA (27x27)

package: 676-BGA

XCV50E-6FG256C

Xilinx Inc.

IC FPGA 176 I/O 256FBGA

• Number of LABs/CLBs: 384
• Number of Logic Elements/Cells: 1728
• Total RAM Bits: 65536
• Number of I/O: 176
• Number of Gates: 71693
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 256-BGA
• Supplier Device Package: 256-FBGA (17x17)

package: 256-BGA

XCV100E-6PQ240C

Xilinx Inc.

IC FPGA 158 I/O 240QFP

• Number of LABs/CLBs: 600
• Number of Logic Elements/Cells: 2700
• Total RAM Bits: 81920
• Number of I/O: 158
• Number of Gates: 128236
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 240-BFQFP
• Supplier Device Package: 240-PQFP (32x32)

package: 240-BFQFP

XC4013E-3HQ240I

Xilinx Inc.

IC FPGA 192 I/O 240HQFP

• Number of LABs/CLBs: 576
• Number of Logic Elements/Cells: 1368
• Total RAM Bits: 18432
• Number of I/O: 192
• Number of Gates: 13000
• Voltage - Supply: 4.5 V ~ 5.5 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 240-BFQFP Exposed Pad
• Supplier Device Package: 240-PQFP (32x32)

package: 240-BFQFP Exposed Pad

XC4010E-3PC84I

Xilinx Inc.

IC FPGA 61 I/O 84PLCC

• Number of LABs/CLBs: 400
• Number of Logic Elements/Cells: 950
• Total RAM Bits: 12800
• Number of I/O: 61
• Number of Gates: 10000
• Voltage - Supply: 4.5 V ~ 5.5 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 84-LCC (J-Lead)
• Supplier Device Package: 84-PLCC (29.31x29.31)

package: 84-LCC (J-Lead)

XQ7VX485T-L2RF1761E

Xilinx Inc.

IC FPGA VIRTEX-7 485K 1761BGA

• Number of LABs/CLBs: 37950
• Number of Logic Elements/Cells: 485760
• Total RAM Bits: 37969920
• Number of I/O: 700
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1761-FCBGA (42.5x42.5)

package: 1760-BBGA, FCBGA

XC7VX550T-3FFG1927E

Xilinx Inc.

IC FPGA 600 I/O 1927FCBGA

• Number of LABs/CLBs: 43300
• Number of Logic Elements/Cells: 554240
• Total RAM Bits: 43499520
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1924-BBGA, FCBGA
• Supplier Device Package: 1927-FCBGA (45x45)

package: 1924-BBGA, FCBGA

XC6VLX550T-2FFG1760E

Xilinx Inc.

IC FPGA 1200 I/O 1760FBGA

• Number of LABs/CLBs: 42960
• Number of Logic Elements/Cells: 549888
• Total RAM Bits: 23298048
• Number of I/O: 1200
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FCBGA (42.5x42.5)

package: 1760-BBGA, FCBGA

XC4VFX140-10FF1517I

Xilinx Inc.

IC FPGA 768 I/O 1517FCBGA

• Number of LABs/CLBs: 15792
• Number of Logic Elements/Cells: 142128
• Total RAM Bits: 10174464
• Number of I/O: 768
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

package: 1517-BBGA, FCBGA

XC5VFX130T-1FFG1738I

Xilinx Inc.

IC FPGA 840 I/O 1738FCBGA

• Number of LABs/CLBs: 10240
• Number of Logic Elements/Cells: 131072
• Total RAM Bits: 10985472
• Number of I/O: 840
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1738-BBGA, FCBGA
• Supplier Device Package: 1738-FCBGA (42.5x42.5)

package: 1738-BBGA, FCBGA

XC5VTX150T-1FF1759C

Xilinx Inc.

IC FPGA 680 I/O 1759FCBGA

• Number of LABs/CLBs: 11600
• Number of Logic Elements/Cells: 148480
• Total RAM Bits: 8404992
• Number of I/O: 680
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1759-FCBGA (42.5x42.5)

package: 1760-BBGA, FCBGA

XC5VFX100T-2FFG1136C

Xilinx Inc.

IC FPGA 640 I/O 1136FCBGA

• Number of LABs/CLBs: 8000
• Number of Logic Elements/Cells: 102400
• Total RAM Bits: 8404992
• Number of I/O: 640
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1136-BBGA, FCBGA
• Supplier Device Package: 1136-FCBGA (35x35)

package: 1136-BBGA, FCBGA

XC2VP50-5FF1517I

Xilinx Inc.

IC FPGA 852 I/O 1517FCBGA

• Number of LABs/CLBs: 5904
• Number of Logic Elements/Cells: 53136
• Total RAM Bits: 4276224
• Number of I/O: 852
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

package: 1517-BBGA, FCBGA

XC5VLX50T-2FFG665C

Xilinx Inc.

IC FPGA 360 I/O 665FCBGA

• Number of LABs/CLBs: 3600
• Number of Logic Elements/Cells: 46080
• Total RAM Bits: 2211840
• Number of I/O: 360
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 665-BBGA, FCBGA
• Supplier Device Package: 665-FCBGA (27x27)

package: 665-BBGA, FCBGA

XA6SLX75-3FGG484Q

Xilinx Inc.

IC FPGA 280 I/O 484FBGA

• Number of LABs/CLBs: 5831
• Number of Logic Elements/Cells: 74637
• Total RAM Bits: 3170304
• Number of I/O: 280
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

package: 484-BBGA

XC3S1500-4FG320C

Xilinx Inc.

IC FPGA 221 I/O 320FBGA

• Number of LABs/CLBs: 3328
• Number of Logic Elements/Cells: 29952
• Total RAM Bits: 589824
• Number of I/O: 221
• Number of Gates: 1500000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 320-BGA
• Supplier Device Package: 320-FBGA (19x19)

package: 320-BGA

XC3S1000-5FG320C

Xilinx Inc.

IC FPGA 221 I/O 320 FBGA

• Number of LABs/CLBs: 1920
• Number of Logic Elements/Cells: 17280
• Total RAM Bits: 442368
• Number of I/O: 221
• Number of Gates: 1000000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 320-BGA
• Supplier Device Package: 320-FBGA (19x19)

package: 320-BGA

XC3S400-5TQ144C

Xilinx Inc.

IC FPGA 97 I/O 144TQFP

• Number of LABs/CLBs: 896
• Number of Logic Elements/Cells: 8064
• Total RAM Bits: 294912
• Number of I/O: 97
• Number of Gates: 400000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

package: 144-LQFP

XCR3256XL-7TQ144C

Xilinx Inc.

IC CPLD 256MC 7NS 144TQFP

• Programmable Type: In System Programmable (min 1K program/erase cycles)
• Delay Time tpd(1) Max: 7.0ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 16
• Number of Macrocells: 256
• Number of Gates: 6000
• Number of I/O: 120
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

package: 144-LQFP

XC2C128-7TQ144I

Xilinx Inc.

IC CPLD 128MC 7NS 144QFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 7.0ns
• Voltage Supply - Internal: 1.7 V ~ 1.9 V
• Number of Logic Elements/Blocks: 8
• Number of Macrocells: 128
• Number of Gates: 3000
• Number of I/O: 100
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

package: 144-LQFP

XC9536XL-10VQ64I

Xilinx Inc.

IC CPLD 36MC 10NS 64VQFP

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 10.0ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 2
• Number of Macrocells: 36
• Number of Gates: 800
• Number of I/O: 36
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-TQFP
• Supplier Device Package: 64-VQFP (10x10)

package: 64-TQFP

XA7S50-2FGGA484I

Xilinx Inc.

XA7S50-2FGGA484I

• Number of LABs/CLBs: 4075
• Number of Logic Elements/Cells: 52160
• Total RAM Bits: 2764800
• Number of I/O: 250
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BBGA, FCBGA
• Supplier Device Package: 484-FCBGA (23x23)

package: 484-BBGA, FCBGA

XCKU095-2FFVA1156E

Xilinx Inc.

IC FPGA KINTEX-U 1156FCBGA

• Number of LABs/CLBs: 67200
• Number of Logic Elements/Cells: 1176000
• Total RAM Bits: 60518400
• Number of I/O: 520
• Number of Gates: -
• Voltage - Supply: 0.922 V ~ 0.979 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

package: 1156-BBGA, FCBGA