Xilinx Inc. Producten

XC17S200AVO8C

Xilinx Inc.

IC PROM SER 200K 8-SOIC

• Programmable Type: OTP
• Memory Size: 2Mb
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-TSOP

package: 8-SOIC (0.154", 3.90mm Width)

XCZU17EG-2FFVD1760I

Xilinx Inc.

IC FPGA 308 I/O 1760FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 926K+ Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FCBGA (42.5x42.5)

package: 1760-BBGA, FCBGA

XCZU15EG-L1FFVC900I

Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 747K+ Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 900-BBGA, FCBGA
• Supplier Device Package: 900-FCBGA (31x31)

package: 900-BBGA, FCBGA

XC7K410T-2FF900C

Xilinx Inc.

IC FPGA 500 I/O 900FCBGA

• Number of LABs/CLBs: 31775
• Number of Logic Elements/Cells: 406720
• Total RAM Bits: 29306880
• Number of I/O: 500
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 900-BBGA, FCBGA
• Supplier Device Package: 900-FCBGA (31x31)

package: 900-BBGA, FCBGA

XC2V4000-5FF1152I

Xilinx Inc.

IC FPGA 824 I/O 1152FCBGA

• Number of LABs/CLBs: 5760
• Number of Logic Elements/Cells: -
• Total RAM Bits: 2211840
• Number of I/O: 824
• Number of Gates: 4000000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-CFCBGA (35x35)

package: 1152-BBGA, FCBGA

XC2V500-4FGG256I

Xilinx Inc.

IC FPGA 172 I/O 256FBGA

• Number of LABs/CLBs: 768
• Number of Logic Elements/Cells: -
• Total RAM Bits: 589824
• Number of I/O: 172
• Number of Gates: 500000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 256-BGA
• Supplier Device Package: 256-FBGA (17x17)

package: 256-BGA

XC3S1500L-4FGG676C

Xilinx Inc.

IC FPGA 487 I/O 676FBGA

• Number of LABs/CLBs: 2816
• Number of Logic Elements/Cells: 29952
• Total RAM Bits: 589824
• Number of I/O: 487
• Number of Gates: 1500000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BGA
• Supplier Device Package: 676-FBGA (27x27)

package: 676-BGA

XCS40XL-4PQG208C

Xilinx Inc.

IC FPGA 169 I/O 208QFP

• Number of LABs/CLBs: 784
• Number of Logic Elements/Cells: 1862
• Total RAM Bits: 25088
• Number of I/O: 169
• Number of Gates: 40000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

package: 208-BFQFP

XCV600E-7BG432I

Xilinx Inc.

IC FPGA 316 I/O 432MBGA

• Number of LABs/CLBs: 3456
• Number of Logic Elements/Cells: 15552
• Total RAM Bits: 294912
• Number of I/O: 316
• Number of Gates: 985882
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 432-LBGA, Metal
• Supplier Device Package: 432-MBGA (40x40)

package: 432-LBGA, Metal

XCV400-5BG432C

Xilinx Inc.

IC FPGA 316 I/O 432MBGA

• Number of LABs/CLBs: 2400
• Number of Logic Elements/Cells: 10800
• Total RAM Bits: 81920
• Number of I/O: 316
• Number of Gates: 468252
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 432-LBGA, Metal
• Supplier Device Package: 432-MBGA (40x40)

package: 432-LBGA, Metal

XCV300-6FG456C

Xilinx Inc.

IC FPGA 312 I/O 456FBGA

• Number of LABs/CLBs: 1536
• Number of Logic Elements/Cells: 6912
• Total RAM Bits: 65536
• Number of I/O: 312
• Number of Gates: 322970
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 456-BBGA
• Supplier Device Package: 456-FBGA (23x23)

package: 456-BBGA

XCV200E-8PQ240C

Xilinx Inc.

IC FPGA 158 I/O 240QFP

• Number of LABs/CLBs: 1176
• Number of Logic Elements/Cells: 5292
• Total RAM Bits: 114688
• Number of I/O: 158
• Number of Gates: 306393
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 240-BFQFP
• Supplier Device Package: 240-PQFP (32x32)

package: 240-BFQFP

XCV200E-7FG256I

Xilinx Inc.

IC FPGA 176 I/O 256FBGA

• Number of LABs/CLBs: 1176
• Number of Logic Elements/Cells: 5292
• Total RAM Bits: 114688
• Number of I/O: 176
• Number of Gates: 306393
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 256-BGA
• Supplier Device Package: 256-FBGA (17x17)

package: 256-BGA

XCV1000E-7BG560C

Xilinx Inc.

IC FPGA 404 I/O 560MBGA

• Number of LABs/CLBs: 6144
• Number of Logic Elements/Cells: 27648
• Total RAM Bits: 393216
• Number of I/O: 404
• Number of Gates: 1569178
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 560-LBGA, Metal
• Supplier Device Package: 560-MBGA (42.5x42.5)

package: 560-LBGA, Metal

XC4036XL-09HQ240C

Xilinx Inc.

IC FPGA 193 I/O 240HQFP

• Number of LABs/CLBs: 1296
• Number of Logic Elements/Cells: 3078
• Total RAM Bits: 41472
• Number of I/O: 193
• Number of Gates: 36000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 240-BFQFP Exposed Pad
• Supplier Device Package: 240-PQFP (32x32)

package: 240-BFQFP Exposed Pad

XC7K480T-L2FFG1156E

Xilinx Inc.

IC FPGA 400 I/O 1156FCBGA

• Number of LABs/CLBs: 37325
• Number of Logic Elements/Cells: 477760
• Total RAM Bits: 35205120
• Number of I/O: 400
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

package: 1156-BBGA, FCBGA

XCKU025-1FFVA1156I

Xilinx Inc.

IC FPGA 312 I/O 1156FCBGA

• Number of LABs/CLBs: 18180
• Number of Logic Elements/Cells: 318150
• Total RAM Bits: 13004800
• Number of I/O: 312
• Number of Gates: -
• Voltage - Supply: 0.922 V ~ 0.979 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

package: 1156-BBGA, FCBGA

XC2VP20-6FF896I

Xilinx Inc.

IC FPGA 556 I/O 896FCBGA

• Number of LABs/CLBs: 2320
• Number of Logic Elements/Cells: 20880
• Total RAM Bits: 1622016
• Number of I/O: 556
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 896-BBGA, FCBGA
• Supplier Device Package: 896-FCBGA (31x31)

package: 896-BBGA, FCBGA

XC5VLX30T-1FFG665C

Xilinx Inc.

IC FPGA 360 I/O 665FCBGA

• Number of LABs/CLBs: 2400
• Number of Logic Elements/Cells: 30720
• Total RAM Bits: 1327104
• Number of I/O: 360
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 665-BBGA, FCBGA
• Supplier Device Package: 665-FCBGA (27x27)

package: 665-BBGA, FCBGA

XC4VFX12-11SF363I

Xilinx Inc.

IC FPGA 240 I/O 363FCBGA

• Number of LABs/CLBs: 1368
• Number of Logic Elements/Cells: 12312
• Total RAM Bits: 663552
• Number of I/O: 240
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 363-FBGA, FCBGA
• Supplier Device Package: 363-FCBGA (17x17)

package: 363-FBGA, FCBGA

XC7A75T-1CSG324I

Xilinx Inc.

IC FPGA ARTIX7 210 I/O 324CSBGA

• Number of LABs/CLBs: 5900
• Number of Logic Elements/Cells: 75520
• Total RAM Bits: 3870720
• Number of I/O: 210
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 324-LFBGA, CSPBGA
• Supplier Device Package: 324-CSPBGA (15x15)

package: 324-LFBGA, CSPBGA

XC7A75T-2FTG256C

Xilinx Inc.

IC FPGA ARTIX7 170 I/O 256FTBGA

• Number of LABs/CLBs: 5900
• Number of Logic Elements/Cells: 75520
• Total RAM Bits: 3870720
• Number of I/O: 170
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FTBGA (17x17)

package: 256-LBGA

XC3S100E-5TQ144C

Xilinx Inc.

IC FPGA 108 I/O 144TQFP

• Number of LABs/CLBs: 240
• Number of Logic Elements/Cells: 2160
• Total RAM Bits: 73728
• Number of I/O: 108
• Number of Gates: 100000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

package: 144-LQFP

XC2S100-5TQG144C

Xilinx Inc.

IC FPGA 92 I/O 144TQFP

• Number of LABs/CLBs: 600
• Number of Logic Elements/Cells: 2700
• Total RAM Bits: 40960
• Number of I/O: 92
• Number of Gates: 100000
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

package: 144-LQFP

XC6SLX100-3CSG484C

Xilinx Inc.

IC FPGA 338 I/O 484CSBGA

• Number of LABs/CLBs: 7911
• Number of Logic Elements/Cells: 101261
• Total RAM Bits: 4939776
• Number of I/O: 338
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-FBGA, CSPBGA
• Supplier Device Package: 484-CSPBGA (19x19)

package: 484-FBGA, CSPBGA

XC9572XL-5PCG44C

Xilinx Inc.

IC CPLD 72MC 5NS 44PLCC

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 5.0ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 4
• Number of Macrocells: 72
• Number of Gates: 1600
• Number of I/O: 34
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 44-LCC (J-Lead)
• Supplier Device Package: 44-PLCC (16.59x16.59)

package: 44-LCC (J-Lead)

XCR3256XL-7FT256C

Xilinx Inc.

IC CPLD 256MC 7NS 256CSP

• Programmable Type: In System Programmable (min 1K program/erase cycles)
• Delay Time tpd(1) Max: 7.0ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 16
• Number of Macrocells: 256
• Number of Gates: 6000
• Number of I/O: 164
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FTBGA (17x17)

package: 256-LBGA

XC95288XL-7PQG208I

Xilinx Inc.

IC CPLD 288MC 7.5NS 208QFP

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 7.5ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 16
• Number of Macrocells: 288
• Number of Gates: 6400
• Number of I/O: 168
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

package: 208-BFQFP