NXP Producten

MRF8P9040GNR1

NXP

FET RF 2CH 70V 960MHZ TO-270

• Transistor Type: LDMOS (Dual)
• Frequency: 960MHz
• Gain: 19.1dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 320mA
• Power - Output: 4W
• Voltage - Rated: 70V
• Package / Case: TO-270BB
• Supplier Device Package: TO-270 WB-4 Gull

package: TO-270BB

NX5P2553GVH

NXP

IC LOAD SWITCH SC74

• Switch Type: General Purpose
• Number of Outputs: 1
• Ratio - Input:Output: 1:1
• Output Configuration: High Side
• Output Type: N-Channel
• Interface: On/Off
• Voltage - Load: 2.5 V ~ 5.5 V
• Voltage - Supply (Vcc/Vdd): Not Required
• Current - Output (Max): 1.5A
• Rds On (Typ): 95 mOhm
• Input Type: Non-Inverting
• Features: Status Flag
• Fault Protection: Current Limiting (Adjustable), Over Temperature, UVLO
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: SC-74, SOT-457
• Supplier Device Package: 6-TSOP

package: SC-74, SOT-457

MC07XSF517EKR2

NXP

IC SWITCH 54SOIC T07D17

• Switch Type: General Purpose
• Number of Outputs: 6
• Ratio - Input:Output: 1:1
• Output Configuration: High Side
• Output Type: N-Channel
• Interface: SPI
• Voltage - Load: 7 V ~ 18 V
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Current - Output (Max): 5.5A, 11A
• Rds On (Typ): 7 mOhm, 17 mOhm
• Input Type: -
• Features: Internal PWM
• Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
• Operating Temperature: -40°C ~ 150°C (TJ)
• Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 54-SOIC

package: 54-SSOP (0.295", 7.50mm Width) Exposed Pad

MC33186DH2R2

NXP

IC MOTOR DRIVER PAR 20HSOP

• Output Configuration: Half Bridge (2)
• Applications: DC Motors, General Purpose, Solenoids
• Interface: Logic
• Load Type: Inductive
• Technology: Bi-CMOS
• Rds On (Typ): 150 mOhm
• Current - Output / Channel: 5A
• Current - Peak Output: -
• Voltage - Supply: 5 V ~ 28 V
• Voltage - Load: 5 V ~ 28 V
• Operating Temperature: -40°C ~ 150°C (TJ)
• Features: Status Flag
• Fault Protection: Current Limiting, Over Temperature, Over Voltage, Short Circuit, UVLO
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
• Supplier Device Package: 20-HSOP

package: 20-SOIC (0.433", 11.00mm Width) Exposed Pad

TDA8589AJ/N3,112

NXP

IC AMP AUDIO PWR 69W QUAD 37SIL

• Type: Class AB
• Output Type: 4-Channel (Quad)
• Max Output Power x Channels @ Load: 69W x 4 @ 2 Ohm
• Voltage - Supply: 8 V ~ 18 V
• Features: I2C, Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Through Hole
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: 37-DBS
• Package / Case: 37-SIP Formed Leads

package: 37-SIP Formed Leads

SC16C850IBS,128

NXP

IC UART SGL W/FIFO 32HVQFN

• Features: -
• Number of Channels: 1, UART
• FIFO's: 128 Byte
• Protocol: RS485
• Data Rate (Max): 5Mbps
• Voltage - Supply: 2.5 V ~ 3.3 V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: Yes
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)

package: 32-VFQFN Exposed Pad

MCZ33903CS3EKR2

NXP

IC SBC CAN HS 3.3V 32SOIC

• Applications: System Basis Chip
• Interface: CAN, LIN
• Voltage - Supply: 5.5 V ~ 28 V
• Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 32-SOIC EP
• Mounting Type: Surface Mount

package: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

TJA1021T/20/C,112

NXP

IC TXRX LIN 2.1/SAE J2602 8-SOIC

• Type: Transceiver
• Protocol: LIN
• Number of Drivers/Receivers: 1/1
• Duplex: Full
• Receiver Hysteresis: 175mV
• Data Rate: -
• Voltage - Supply: 5.5 V ~ 27 V
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

package: 8-SOIC (0.154", 3.90mm Width)

74HC4067N,652

NXP

IC MUX/DEMUX 1X16 24DIP

• Switch Circuit: -
• Multiplexer/Demultiplexer Circuit: 16:1
• Number of Circuits: 1
• On-State Resistance (Max): 120 Ohm
• Channel-to-Channel Matching (ΔRon): 6 Ohm
• Voltage - Supply, Single (V+): 2 V ~ 10 V
• Voltage - Supply, Dual (V±): -
• Switch Time (Ton, Toff) (Max): 45ns, 45ns
• -3db Bandwidth: 100MHz
• Charge Injection: -
• Channel Capacitance (CS(off), CD(off)): 3.5pF
• Current - Leakage (IS(off)) (Max): 100nA
• Crosstalk: -
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 24-DIP (0.600", 15.24mm)
• Supplier Device Package: 24-DIP

package: 24-DIP (0.600", 15.24mm)

MPC8536EAVTAVLA

NXP

IC MPU MPC85XX 1.5GHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.5GHz
• Co-Processors/DSP: Security; SEC
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 (3)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 90°C (TA)
• Security Features: Cryptography
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

package: 783-BBGA, FCBGA

P4080NSE7MMC

NXP

IC MPU Q OR IQ 1.5GHZ 1295FCBGA

• Core Processor: PowerPC e500mc
• Number of Cores/Bus Width: 8 Core, 32-Bit
• Speed: 1.5GHz
• Co-Processors/DSP: Security; SEC 4.0
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 1 Gbps (8), 10 Gbps (2)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
• Package / Case: 1295-BBGA, FCBGA
• Supplier Device Package: 1295-FCPBGA (37.5x37.5)

package: 1295-BBGA, FCBGA

SPC5644AF0MMG1R

NXP

IC MCU 32BIT 4MB FLASH 208MAPBGA

• Core Processor: e200z4
• Core Size: 32-Bit
• Speed: 150MHz
• Connectivity: CAN, EBI/EMI, LIN, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 120
• Program Memory Size: 4MB (4M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 192K x 8
• Voltage - Supply (Vcc/Vdd): 1.14 V ~ 1.32 V
• Data Converters: A/D 40x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 208-BGA
• Supplier Device Package: 208-MAPBGA (17x17)

package: 208-BGA

LPC3141FET180,551

NXP

IC MCU 32BIT ROMLESS 180TFBGA

• Core Processor: ARM9?
• Core Size: 16/32-Bit
• Speed: 270MHz
• Connectivity: EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG
• Peripherals: DMA, I2S, LCD, PWM, WDT
• Number of I/O: 20
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 192K x 8
• Voltage - Supply (Vcc/Vdd): 1.1 V ~ 3.6 V
• Data Converters: A/D 4x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 180-TFBGA
• Supplier Device Package: 180-TFBGA (12x12)

package: 180-TFBGA

MC9S08RD32CPE

NXP

IC MCU 8BIT 32KB FLASH 28DIP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 23
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-DIP (0.600", 15.24mm)
• Supplier Device Package: 28-PDIP

package: 28-DIP (0.600", 15.24mm)

MC9S08RD8FJE

NXP

IC MCU 8BIT 8KB FLASH 32LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 25
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

package: 32-LQFP

MC9S08AC8MFJE

NXP

IC MCU 8BIT 8KB FLASH 32LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 22
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 768 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

package: 32-LQFP

ICM7555CD,623

NXP

IC OSC SGL TIMER 500KHZ 8-SOIC

• Type: 555 Type, Timer/Oscillator (Single)
• Count: -
• Frequency: 500kHz
• Voltage - Supply: 3 V ~ 16 V
• Current - Supply: 180µA
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO
• Mounting Type: Surface Mount

package: 8-SOIC (0.154", 3.90mm Width)

SA56004DD,118

NXP

SENSOR TEMPERATURE I2C/SMBUS 8SO

• Sensor Type: Digital, Local/Remote
• Sensing Temperature - Local: -40°C ~ 125°C
• Sensing Temperature - Remote: -40°C ~ 125°C
• Output Type: I2C/SMBus
• Voltage - Supply: 3 V ~ 5.5 V
• Resolution: 10 b
• Features: Output Switch, Programmable Limit
• Accuracy - Highest (Lowest): ±2°C (±3°C)
• Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

package: 8-SOIC (0.154", 3.90mm Width)

HTSICC4801EW/C1,02

NXP

TRANSPONDER RFIC HITAG S UNCASED

• Type: RFID Transponder
• Frequency: 100kHz ~ 150kHz
• Standards: -
• Interface: -
• Voltage - Supply: 3.5V
• Operating Temperature: -25°C ~ 85°C
• Package / Case: -
• Supplier Device Package: -

package: -

PCF7939PA/C0BC1200

NXP

IC TRANSPONDER PLLMC

• Style: -
• Technology: -
• Frequency: -
• Memory Type: -
• Writable Memory: -
• Standards: -
• Operating Temperature: -
• Size / Dimension: -

package: -

MCIMX7D2DVK12SD

NXP

MPU I.MX 7D 1.2GHZ 12X12 MAPBGA

• Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.2GHz
• Co-Processors/DSP: Multimedia; NEON™ MPE
• RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: Keypad, LCD, MIPI
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
• Voltage - I/O: 1.8V, 3.3V
• Operating Temperature: 0°C ~ 85°C (TJ)
• Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
• Package / Case: 488-TFBGA
• Supplier Device Package: 488-FBGA (12x12)

package: 488-TFBGA

S912ZVMC64F2VKH

NXP

IC MCU 16BIT FLASH

• Core Processor: S12Z
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CANbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 31
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
• Data Converters: A/D 9x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP Exposed Pad
• Supplier Device Package: 64-LQFP-EP (10x10)

package: 64-LQFP Exposed Pad

SPC5646CF0VLU1

NXP

NXP 32-BIT MCU DUAL POWER ARCH

• Core Processor: e200z4d, e200z0h
• Core Size: 32-Bit Dual-Core
• Speed: 80MHz/120MHz
• Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 147
• Program Memory Size: 3MB (3M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 27x10b, 5x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 176-LQFP
• Supplier Device Package: 176-LQFP (24x24)

package: 176-LQFP

S912XEG128BVALR

NXP

16-BIT MCU S12X CORE 128KB FLA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 91
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 12K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

package: 112-LQFP

S9S12GN32BVTJR

NXP

16-BIT32K FLASH2K RAM

• Core Processor: 12V1
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 14
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

package: 20-TSSOP (0.173", 4.40mm Width)

S9S12G48J0MLH

NXP

IC MCU 16BIT 48KB FLASH 64LQFP

• Core Processor: S12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CANbus, IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 48KB (48K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1.5K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

package: -

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MPF7100BVMA4ES

NXP

PF7100 PMIC I.MX8DXP/DX

• Applications: i.MX Processors
• Current - Supply: 10µA
• Voltage - Supply: 2.5V ~ 5.5V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-HVQFN (7x7)

package: -

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MRFX600HR5

NXP

RF MOSFET LDMOS 65V NI780

• Transistor Type: LDMOS
• Frequency: 1.8MHz ~ 400MHz
• Gain: 26.4dB
• Voltage - Test: 65 V
• Current Rating: 10µA
• Noise Figure: -
• Current - Test: 100 mA
• Power - Output: 600W
• Voltage - Rated: 179 V
• Package / Case: NI-780-4
• Supplier Device Package: NI-780-4

package: -

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