NXP Producten

TEA1610T/N5,518

NXP

IC RESONANT CONVRTR CTRLR 16SOIC

• Applications: Resonant Converter Controller
• Voltage - Input: -
• Voltage - Supply: 0 V ~ 15 V
• Current - Supply: 2.4mA
• Operating Temperature: -25°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO

package: 16-SOIC (0.154", 3.90mm Width)

MWCT1000CFM

NXP

IC DSP SGL COIL 5W 5V STD 32QFN

• Applications: Wireless Power Transmitter
• Current - Supply: -
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-QFN (5x5)

package: 32-VFQFN Exposed Pad

MC17XS6400BEK

NXP

IC SWITCH HIGH SIDE 32SOIC

• Switch Type: General Purpose
• Number of Outputs: 4
• Ratio - Input:Output: 1:1
• Output Configuration: High Side
• Output Type: N-Channel
• Interface: SPI
• Voltage - Load: 7 V ~ 18 V
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Current - Output (Max): 5.5A
• Rds On (Typ): 17 mOhm
• Input Type: -
• Features: Slew Rate Controlled
• Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 32-SOIC EP

package: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

UBA2071ATS/N1,118

NXP

IC DVR HALF BRIDGE 24-SSOP

• Type: CCFL/EEFL Controller
• Frequency: 38kHz ~ 42kHz
• Voltage - Supply: 14V
• Current - Supply: 1.5mA
• Current - Output Source/Sink: -
• Dimming: Yes
• Operating Temperature: -25°C ~ 100°C
• Mounting Type: Surface Mount
• Package / Case: 24-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 24-SSOP

package: 24-SSOP (0.209", 5.30mm Width)

HEC4538BT,112

NXP

IC DUAL PREC MULTIVIB 16SOIC

• Logic Type: Monostable
• Independent Circuits: 2
• Schmitt Trigger Input: Yes
• Propagation Delay: 35ns
• Current - Output High, Low: -
• Voltage - Supply: 4.5 V ~ 15.5 V
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO

package: 16-SOIC (0.154", 3.90mm Width)

TDA8931T/N1,112

NXP

IC AMP/COMPARATOR 22W D 20SOIC

• Type: Class D
• Output Type: 1-Channel (Mono)
• Max Output Power x Channels @ Load: 22W x 1 @ 4 Ohm
• Voltage - Supply: 12 V ~ 35 V, ±6 V ~ 17.5 V
• Features: Depop, Short-Circuit and Thermal Protection
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: 20-SO
• Package / Case: 20-SOIC (0.295", 7.50mm Width)

package: 20-SOIC (0.295", 7.50mm Width)

PPC8306SVMADDCA

NXP

IC MPU MPC83XX 266MHZ 369BGA

• Core Processor: PowerPC e300c3
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 266MHz
• Co-Processors/DSP: Communications; QUICC Engine
• RAM Controllers: DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (3)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 1.8V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 369-LFBGA
• Supplier Device Package: 369-PBGA (19x19)

package: 369-LFBGA

MC68340PV25E

NXP

IC MPU M683XX 25MHZ 144LQFP

• Core Processor: CPU32
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 25MHz
• Co-Processors/DSP: -
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

package: 144-LQFP

PK40X256VMD100

NXP

IC MCU 32BIT 256KB FLASH 144BGA

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
• Number of I/O: 98
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 27x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 144-LBGA
• Supplier Device Package: 144-MAPBGA (13x13)

package: 144-LBGA

PCF51AC128ACFUE

NXP

IC MCU 32BIT 128KB FLASH 64QFP

• Core Processor: Coldfire V1
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: CAN, I2C, SCI, SPI
• Peripherals: LVD, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 20x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-QFP
• Supplier Device Package: 64-QFP (14x14)

package: 64-QFP

MC9S08DV60CLH

NXP

IC MCU 8BIT 60KB FLASH 64LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: CAN, I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 53
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 3K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

package: 64-LQFP

P89C58X2BA/00,512

NXP

IC MCU 8BIT 32KB FLASH 44PLCC

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 33MHz
• Connectivity: UART/USART
• Peripherals: POR
• Number of I/O: 32
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 44-LCC (J-Lead)
• Supplier Device Package: 44-PLCC (16.59x16.59)

package: 44-LCC (J-Lead)

SPC5747GBK1VMJ6

NXP

IC MCU 32BIT 4MB FLASH 256MAPBGA

• Core Processor: e200z2, e200z4, e200z4
• Core Size: 32-Bit Tri-Core
• Speed: 80MHz/160MHz
• Connectivity: CAN, Ethernet, I2C, LIN, SAI, SPI, USB, USB OTG
• Peripherals: DMA, LVD, POR, WDT
• Number of I/O: 178
• Program Memory Size: 4MB (4M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 768K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 80x10b, 64x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 256-LBGA
• Supplier Device Package: 256-MAPPBGA (17x17)

package: 256-LBGA

LPC54606J512BD208E

NXP

IC MCU 32BIT 512KB FLASH 208LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 180MHz
• Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Number of I/O: 171
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 200K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 12x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 208-LQFP
• Supplier Device Package: 208-LQFP (28x28)

package: 208-LQFP

MK10DX128VLK7

NXP

IC MCU 32BIT 128KB FLASH 80LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SPI, UART/USART
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 56
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 31x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 80-LQFP
• Supplier Device Package: 80-LQFP (12x12)

package: 80-LQFP

MC9S12C64CPBE

NXP

IC MCU 16BIT 64KB FLASH 52LQFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number of I/O: 35
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 52-LQFP
• Supplier Device Package: 52-LQFP (10x10)

package: 52-LQFP

MC13191FC

NXP

IC RF TXRX ISM>1GHZ 32-VFQFN

• Type: TxRx Only
• RF Family/Standard: General ISM > 1GHZ
• Protocol: -
• Modulation: DSSS, O-QPSK
• Frequency: 2.4GHz
• Data Rate (Max): 250kbps
• Power - Output: 4dBm
• Sensitivity: -92dBm
• Memory Size: -
• Serial Interfaces: SPI
• GPIO: 7
• Voltage - Supply: 2 V ~ 3.4 V
• Current - Receiving: 37mA
• Current - Transmitting: 30mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 32-VFQFN Exposed Pad

package: 32-VFQFN Exposed Pad

TEF6640HW/V101,557

NXP

IC ONE-CHIP RADIO 64HTQFP

• Frequency: -
• Sensitivity: -
• Data Rate (Max): -
• Modulation or Protocol: AM, FM
• Applications: AM/FM Radio Receiver
• Current - Receiving: -
• Data Interface: PCB, Surface Mount
• Memory Size: -
• Antenna Connector: PCB, Surface Mount
• Features: -
• Voltage - Supply: -
• Operating Temperature: -
• Package / Case: 64-TQFP Exposed Pad
• Supplier Device Package: 64-HTQFP (10x10)

package: 64-TQFP Exposed Pad

SPC5642AF2MVZ3

NXP

NXP 32-BIT MCU POWER ARCH CORE

• Core Processor: e200z4
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 151
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.25 V
• Data Converters: A/D 40x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 324-BBGA
• Supplier Device Package: 324-TEPBGA (23x23)

package: 324-BBGA

FS32K144MNT0CLLT

NXP

S32K144 32-BIT MCU ARM CORTEX-M

• Core Processor: ARM® Cortex®-M4F
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b, D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

package: 100-LQFP

MIMX8MM2DVTLZAA

NXP

IC MPU I.MX 8M MINI SOLO BGA

• Core Processor: ARM® Cortex®-A53
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.8GHz
• Co-Processors/DSP: ARM® Cortex®-M4
• RAM Controllers: DDR3L, DDR4, LPDDR4
• Graphics Acceleration: Yes
• Display & Interface Controllers: MIPI-DSI
• Ethernet: GbE
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 95°C (TJ)
• Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
• Package / Case: 486-LFBGA, FCBGA
• Supplier Device Package: 486-FCBGA (14x14)

package: 486-LFBGA, FCBGA

SC18IM704PWJ

NXP

IC UART TO I2C BRIDGE

• Protocol: I2C
• Function: Controller
• Interface: UART
• Standards: -
• Voltage - Supply: 1.71V ~ 3.6V
• Current - Supply: 4mA
• Operating Temperature: -40°C ~ 105°C (TA)
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

package: -

SAF4000EL-101Z23EY

NXP

SAF4000EL

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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MPF5030BMDA0ESR2

NXP

POWER MANAGEMENT IC, S32, NON-PR

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: 3.3V ~ 5.25V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 40-PowerVFQFN
• Supplier Device Package: 40-HVQFN (6x6)

package: -

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S912ZVL12ACLC

NXP

S12Z CPU, 128K FLASH

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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MIMX9351XVVXMAB

NXP

IC

• Architecture: -
• Core Processor: -
• Flash Size: -
• RAM Size: -
• Peripherals: -
• Connectivity: -
• Speed: -
• Primary Attributes: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

package: -

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LX2122RN82029B

NXP

IC MPU QORIQ LX 2GHZ 1150FBGA

• Core Processor: ARM® Cortex®-A72
• Number of Cores/Bus Width: 12 Core, 64-Bit
• Speed: 2GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR4, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: SATA 6Gbps (4)
• USB: USB 3.0 (1)
• Voltage - I/O: -
• Operating Temperature: 5°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 1150-FBGA
• Supplier Device Package: 1150-FBGA (23x23)

package: -

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S9S12ZVL32AMLC

NXP

S12Z CPU, 32K FLASH

• Core Processor: S12Z
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 19
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 128 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
• Data Converters: A/D 6x10b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

package: -

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