NXP Producten

MRF9135LR5

NXP

FET RF 65V 880MHZ NI-780

• Transistor Type: LDMOS
• Frequency: 880MHz
• Gain: 17.8dB
• Voltage - Test: 26V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.1A
• Power - Output: 25W
• Voltage - Rated: 65V
• Package / Case: NI-780
• Supplier Device Package: NI-780

package: NI-780

BB189,115

NXP

DIODE UHF VAR CAP 32V SOD523

• Capacitance @ Vr, F: 2.18pF @ 25V, 1MHz
• Capacitance Ratio: 6.3
• Capacitance Ratio Condition: C2/C25
• Voltage - Peak Reverse (Max): 32V
• Diode Type: Single
• Q @ Vr, F: -
• Operating Temperature: -55°C ~ 125°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SC-79, SOD-523
• Supplier Device Package: SOD-523

package: SC-79, SOD-523

BAS116T,115

NXP

DIODE GEN PURP 75V 215MA SC75

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 75V
• Current - Average Rectified (Io): 215mA (DC)
• Voltage - Forward (Vf) (Max) @ If: 1.25V @ 150mA
• Speed: Standard Recovery >500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 3µs
• Current - Reverse Leakage @ Vr: 5nA @ 75V
• Capacitance @ Vr, F: 2pF @ 0V, 1MHz
• Mounting Type: Surface Mount
• Package / Case: SC-75, SOT-416
• Supplier Device Package: SC-75
• Operating Temperature - Junction: 150°C (Max)

package: SC-75, SOT-416

MC34910G5AC

NXP

IC SYSTEM BASIS CHIP LIN 32-LQFP

• Applications: System Basis Chip
• Current - Supply: 4.5mA
• Voltage - Supply: 5.5 V ~ 27 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

package: 32-LQFP

ASL1006PTKJ

NXP

LED DRIVER

• Type: -
• Topology: -
• Internal Switch(s): -
• Number of Outputs: -
• Voltage - Supply (Min): -
• Voltage - Supply (Max): -
• Voltage - Output: -
• Current - Output / Channel: -
• Frequency: -
• Dimming: -
• Applications: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

ASL2416SHNY

NXP

IC LED BUCK DVR 2CH 32HVQFN

• Type: -
• Topology: -
• Internal Switch(s): -
• Number of Outputs: -
• Voltage - Supply (Min): -
• Voltage - Supply (Max): -
• Voltage - Output: -
• Current - Output / Channel: -
• Frequency: -
• Dimming: -
• Applications: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

74ALVCH16601DGG:11

NXP

IC UNIV BUS TXRX 18BIT 56TSSOP

• Logic Type: Universal Bus Transceiver
• Number of Circuits: 18-Bit
• Current - Output High, Low: 24mA, 24mA
• Voltage - Supply: 2.3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 56-TFSOP (0.240", 6.10mm Width)
• Supplier Device Package: 56-TSSOP

package: 56-TFSOP (0.240", 6.10mm Width)

74ABT652APW,118

NXP

IC TRANSCVR 8BIT N-INV 24TSSOP

• Logic Type: Transceiver, Non-Inverting
• Number of Elements: 1
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 24-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 24-TSSOP

package: 24-TSSOP (0.173", 4.40mm Width)

TDA9886HN/V4,118

NXP

IC IF-PLL I2C-BUS DEMOD 32HVQFN

• Type: Demodulator
• Applications: TV
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)

package: 32-VFQFN Exposed Pad

PCA9504ADGG,112

NXP

IC GLUE CHIP 4 DUAL 56TSSOP

• Applications: PC's, PDA's
• Interface: I2C
• Voltage - Supply: 3 V ~ 5.25 V
• Package / Case: 56-TFSOP (0.240", 6.10mm Width)
• Supplier Device Package: 56-TSSOP
• Mounting Type: Surface Mount

package: 56-TFSOP (0.240", 6.10mm Width)

PCA9539PW,118

NXP

IC I/O EXPANDER I2C 16B 24TSSOP

• Number of I/O: 16
• Interface: I2C, SMBus
• Interrupt Output: Yes
• Features: POR
• Output Type: Push-Pull
• Current - Output Source/Sink: 10mA, 25mA
• Clock Frequency: 400kHz
• Voltage - Supply: 2.3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 24-TSSOP

package: 24-TSSOP (0.173", 4.40mm Width)

MC145483SD

NXP

IC CODEC-FILTER PCM 3V 20-SSOP

• Type: PCM, Filter
• Data Interface: PCM Audio Interface
• Resolution (Bits): 13 b
• Number of ADCs / DACs: 1 / 1
• Sigma Delta: No
• S/N Ratio, ADCs / DACs (db) Typ: -
• Dynamic Range, ADCs / DACs (db) Typ: -
• Voltage - Supply, Analog: -
• Voltage - Supply, Digital: 2.7 V ~ 5.25 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 20-SSOP

package: 20-SSOP (0.209", 5.30mm Width)

MC68340CAB16E

NXP

IC MPU M683XX 16MHZ 144QFP

• Core Processor: CPU32
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 16MHz
• Co-Processors/DSP: -
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: -40°C ~ 85°C (TA)
• Security Features: -
• Package / Case: 144-BQFP
• Supplier Device Package: 144-QFP (28x28)

package: 144-BQFP

MPC8241LVR166D

NXP

IC MPU MPC82XX 166MHZ 357BGA

• Core Processor: PowerPC 603e
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 166MHz
• Co-Processors/DSP: -
• RAM Controllers: SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

package: 357-BBGA

SCF5249VM140

NXP

IC MCU 32BIT ROMLESS 160MAPBGA

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 140MHz
• Connectivity: I2C, IDE, Memory Card, SPI, UART/USART
• Peripherals: DMA, I2S, POR, Serial Audio, WDT
• Number of I/O: 47
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 96K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 4x12b
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 160-BGA
• Supplier Device Package: 160-MAPBGA (15x15)

package: 160-BGA

S9S08DZ60F2MLHR

NXP

IC MCU 8BIT 60KB FLASH 64LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: CAN, I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 53
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 24x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

package: 64-LQFP

MKL16Z32VFM4

NXP

IC MCU 32BIT 32KB FLASH 32QFN

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 28
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D - 16bit, D/A - 12bit
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-QFN (5x5)

package: 32-VFQFN Exposed Pad

MK51DX256CLL10

NXP

IC MCU 32BIT 256KB FLASH 100LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
• Number of I/O: 59
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 35x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

package: 100-LQFP

MMDS25254HT1

NXP

IC MOD RF ALIGNMENT 2G 32QFN

• Function: Advanced Doherty Alignment Module
• Frequency: 2.3GHz ~ 2.7GHz
• RF Type: General Purpose
• Secondary Attributes: -
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-QFN (6x6)

package: 32-VFQFN Exposed Pad

13192DSK-BDM-A0E

NXP

KIT DEV STARTER

• Type: Transceiver; 802.15.4 (ZigBee?)
• Frequency: 2.4GHz
• For Use With/Related Products: MC13191, MC13192
• Supplied Contents: Board

package: -

TDA1597/V1,112

NXP

IC IF AMP/DEMOD 18-DIP

• Function: Demodulator, Amplifier
• LO Frequency: -
• RF Frequency: -
• P1dB: -
• Gain: -
• Noise Figure: -
• Current - Supply: 26mA
• Voltage - Supply: 7.5 V ~ 12 V
• Package / Case: 18-DIP (0.300", 7.62mm)
• Supplier Device Package: 18-DIP

package: 18-DIP (0.300", 7.62mm)

MC35FS4503NAER2

NXP

FS4500

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: -1.0 V ~ 40 V
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP (7x7)

package: 48-LQFP Exposed Pad

SPC5777CSK3MMO4R

NXP

POWER ARCH CORES, 8MB FLASH, 300

• Core Processor: e200z7
• Core Size: 32-Bit Tri-Core
• Speed: 300MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, PSI5, SENT, SPI
• Peripherals: DMA, LVD, POR, Zipwire
• Number of I/O: -
• Program Memory Size: 8MB (8M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512K x 8
• Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
• Data Converters: A/D 10x16b Sigma-Delta, eQADC
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 516-BGA
• Supplier Device Package: 516-MAPBGA (27x27)

package: -

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MC33FS8415GJES

NXP

SAFETY POWER MANAGEMENT IC, QFN5

• Applications: System Basis Chip
• Current - Supply: 15mA
• Voltage - Supply: 60V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-HVQFN (8x8)

package: -

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MIMX8DL1AVNFZBAR

NXP

I.MX 8DUALXLITE A1 PRODUCTION PN

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: 388-LFBGA
• Supplier Device Package: 388-LBGA (15x15)

package: -

Request a Quote

MFS2613AMDA4AD

NXP

SAFETY SYSTEM BASIS CHIP WITH LO

• Applications: -
• Current - Supply: -
• Voltage - Supply: 3.2V ~ 40V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP-EP (7x7)

package: -

PCA85133U-2DB-Q1-0

NXP

IC LCD DRIVER UNIV UNCASED

• Display Type: -
• Configuration: -
• Interface: -
• Digits or Characters: -
• Current - Supply: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

Request a Quote

TJA1128FTK-1Z

NXP

LIN MINI SYSTEM BASIS CHIP WITH

• Applications: System Basis Chip
• Interface: SPI
• Voltage - Supply: 3V ~ 28V
• Package / Case: 14-VDFN Exposed Pad
• Supplier Device Package: 14-HVSON (3x4.5)
• Mounting Type: Surface Mount

package: -