NXP Producten

PMN25EN,115

NXP

MOSFET N-CH 30V 6.2A 6TSOP

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 30V
• Current - Continuous Drain (Id) @ 25°C: 6.2A (Ta)
• Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
• Vgs(th) (Max) @ Id: 2.5V @ 250µA
• Gate Charge (Qg) (Max) @ Vgs: 11nC @ 10V
• Input Capacitance (Ciss) (Max) @ Vds: 492pF @ 15V
• Vgs (Max): ±20V
• FET Feature: -
• Power Dissipation (Max): 540mW (Ta), 6.25W (Tc)
• Rds On (Max) @ Id, Vgs: 23 mOhm @ 6.2A, 10V
• Operating Temperature: -55°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: 6-TSOP
• Package / Case: SC-74, SOT-457

package: SC-74, SOT-457

BSS83,235

NXP

MOSFET N-CH 10V 50MA SOT143

• Transistor Type: N-Channel
• Frequency: -
• Gain: -
• Voltage - Test: -
• Current Rating: 50mA
• Noise Figure: -
• Current - Test: -
• Power - Output: -
• Voltage - Rated: 10V
• Package / Case: TO-253-4, TO-253AA
• Supplier Device Package: SOT-143B

package: TO-253-4, TO-253AA

BC556A,112

NXP

TRANS PNP 65V 0.1A TO-92

• Transistor Type: PNP
• Current - Collector (Ic) (Max): 100mA
• Voltage - Collector Emitter Breakdown (Max): 65V
• Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
• Current - Collector Cutoff (Max): 15nA (ICBO)
• DC Current Gain (hFE) (Min) @ Ic, Vce: 125 @ 2mA, 5V
• Power - Max: 500mW
• Frequency - Transition: 100MHz
• Operating Temperature: 150°C (TJ)
• Mounting Type: Through Hole
• Package / Case: TO-226-3, TO-92-3 (TO-226AA)
• Supplier Device Package: TO-92-3

package: TO-226-3, TO-92-3 (TO-226AA)

BFU690F,115

NXP

TRANSISTOR NPN SOT343F

• Transistor Type: NPN
• Voltage - Collector Emitter Breakdown (Max): 5.5V
• Frequency - Transition: 18GHz
• Noise Figure (dB Typ @ f): 0.6dB ~ 0.7dG @ 1.5GHz ~ 2.4GHz
• Gain: 15.5dB ~ 18.5dB
• Power - Max: 230mW
• DC Current Gain (hFE) (Min) @ Ic, Vce: 90 @ 20mA, 2V
• Current - Collector (Ic) (Max): 100mA
• Operating Temperature: 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SOT-343F
• Supplier Device Package: 4-DFP

package: SOT-343F

BZX84-B5V6/LF1R

NXP

DIODE ZENER TO-236AB SOT23

• Voltage - Zener (Nom) (Vz): 5.6V
• Tolerance: ±2%
• Power - Max: 250mW
• Impedance (Max) (Zzt): 40 Ohms
• Current - Reverse Leakage @ Vr: 1µA @ 2V
• Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: TO-236AB (SOT23)

package: TO-236-3, SC-59, SOT-23-3

TLVH431AQDBVR,125

NXP

IC VREF SHUNT ADJ 5TSOP

• Reference Type: Shunt
• Output Type: Adjustable
• Voltage - Output (Min/Fixed): 1.24V
• Voltage - Output (Max): 18V
• Current - Output: 70mA
• Tolerance: ±1%
• Temperature Coefficient: -
• Noise - 0.1Hz to 10Hz: -
• Noise - 10Hz to 10kHz: -
• Voltage - Input: -
• Current - Supply: -
• Current - Cathode: 80µA
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: SC-74A, SOT-753
• Supplier Device Package: 5-TSOP

package: SC-74A, SOT-753

PCF1178CT,118

NXP

IC LCD CAR CLOCK 4DIGIT 28SOIC

• Display Type: LCD
• Configuration: 7 Segment
• Interface: -
• Digits or Characters: 4 Digits
• Current - Supply: 950µA
• Voltage - Supply: 3 V ~ 6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SO

package: 28-SOIC (0.295", 7.50mm Width)

NTB0102GD-Q100H

NXP

IC TXRX TRANSLATING 2BIT 8XSON

• Translator Type: Voltage Level
• Channel Type: Bidirectional
• Number of Circuits: 1
• Channels per Circuit: 2
• Voltage - VCCA: 1.2V ~ 3.6V
• Voltage - VCCB: 1.65V ~ 5.5V
• Input Signal: -
• Output Signal: -
• Output Type: Tri-State, Non-Inverted
• Data Rate: 100Mbps
• Operating Temperature: -40°C ~ 125°C (TA)
• Features: Auto-Direction Sensing
• Mounting Type: Surface Mount
• Package / Case: 8-XFDFN
• Supplier Device Package: 8-XSON, SOT996-2 (2x3)

package: 8-XFDFN

PTN3356BS/F1MP

NXP

IC DISPLAYPORT TO VGA 32HVQFN

• Applications: DisplayPort
• Interface: -
• Voltage - Supply: 2.8 V ~ 3.6 V
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)
• Mounting Type: Surface Mount

package: 32-VFQFN Exposed Pad

PCAL9554BBSHP

NXP

IC I/O EXPANDER 8BIT 16HVQFN

• Number of I/O: 8
• Interface: I2C, SMBus
• Interrupt Output: Yes
• Features: POR
• Output Type: Open Drain, Push-Pull
• Current - Output Source/Sink: 10mA, 25mA
• Clock Frequency: 400kHz
• Voltage - Supply: 1.65 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-VFQFN Exposed Pad
• Supplier Device Package: 16-HVQFN (3x3)

package: 16-VFQFN Exposed Pad

TJA1028TK/3V3/20,1

NXP

IC TXRX LIN SAE J2602 8HVSON

• Type: Transceiver
• Protocol: LIN
• Number of Drivers/Receivers: 1/1
• Duplex: Full
• Receiver Hysteresis: 200mV
• Data Rate: -
• Voltage - Supply: 5.5 V ~ 28 V
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 8-VDFN Exposed Pad
• Supplier Device Package: 8-HVSON (3x3)

package: 8-VDFN Exposed Pad

CBTL04083BBS,518

NXP

IC MUX/DEMUX 2:1 4CH 42HVQFN

• Applications: DisplayPort, PCIe, USB
• Multiplexer/Demultiplexer Circuit: 2:1
• Switch Circuit: -
• Number of Channels: 4
• On-State Resistance (Max): 6 Ohm (Typ)
• Voltage - Supply, Single (V+): 3 V ~ 3.6 V
• Voltage - Supply, Dual (V±): -
• -3db Bandwidth: 8GHz
• Features: Bi-Directional, SATA
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 42-VFQFN Exposed Pad
• Supplier Device Package: 42-HVQFN

package: 42-VFQFN Exposed Pad

MPC8377ECVRAGD

NXP

IC MPU MPC83XX 400MHZ 689TEBGA

• Core Processor: PowerPC e300c4s
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: Security; SEC 3.0
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 125°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 689-BBGA Exposed Pad
• Supplier Device Package: 689-TEPBGA II (31x31)

package: 689-BBGA Exposed Pad

MPC8323ECVRAFDC

NXP

IC MPU MPC83XX 333MHZ 516BGA

• Core Processor: PowerPC e300c2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 333MHz
• Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (3)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Cryptography
• Package / Case: 516-BBGA
• Supplier Device Package: 516-FPBGA (27x27)

package: 516-BBGA

MPC866PVR133A

NXP

IC MPU MPC8XX 133MHZ 357BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 133MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (4), 10/100 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

package: 357-BBGA

MC9328MX21VM

NXP

IC MPU I.MX21 266MHZ 289MAPBGA

• Core Processor: ARM926EJ-S
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 266MHz
• Co-Processors/DSP: -
• RAM Controllers: SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: Keypad, LCD
• Ethernet: -
• SATA: -
• USB: USB 1.x (2)
• Voltage - I/O: 1.8V, 3.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 289-LFBGA
• Supplier Device Package: -

package: 289-LFBGA

MVF62NN151CMK40

NXP

IC MCU 32BIT ROMLESS 364MAPBGA

• Core Processor: ARM? Cortex?-A5 + Cortex?-M4
• Core Size: 32-Bit Dual-Core
• Speed: 400MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG
• Peripherals: DMA, LVD, WDT
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 1.5MB
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D Dual x 12b, D/A Dual x 12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 364-LFBGA
• Supplier Device Package: 364-MAPBGA (17x17)

package: 364-LFBGA

MCF52110CAE66

NXP

IC MCU 32BIT 128KB FLASH 64LQFP

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 66MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number of I/O: 43
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

package: 64-LQFP

LPC43S50FET256,551

NXP

IC MCU 32BIT ROMLESS 256LBGA

• Core Processor: ARM? Cortex?-M4/M0
• Core Size: 32-Bit Dual-Core
• Speed: 204MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
• Number of I/O: 164
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 264K x 8
• Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 256-LBGA
• Supplier Device Package: 256-LBGA (17x17)

package: 256-LBGA

MC908GR60ACFAE

NXP

IC MCU 8BIT 60KB FLASH 48LQFP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI, SPI
• Peripherals: LVD, POR, PWM
• Number of I/O: 37
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 24x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

package: 48-LQFP

SA56004FD,112

NXP

SENSOR TEMPERATURE I2C/SMBUS 8SO

• Sensor Type: Digital, Local/Remote
• Sensing Temperature - Local: -40°C ~ 125°C
• Sensing Temperature - Remote: -40°C ~ 125°C
• Output Type: I2C/SMBus
• Voltage - Supply: 3 V ~ 5.5 V
• Resolution: 10 b
• Features: Output Switch, Programmable Limit
• Accuracy - Highest (Lowest): ±2°C (±3°C)
• Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

package: 8-SOIC (0.154", 3.90mm Width)

MPX12D

NXP

SENSOR DIFF PRESS 1.45PSI MAX

• Pressure Type: Differential
• Operating Pressure: 1.45 PSI (10 kPa)
• Output Type: Wheatstone Bridge
• Output: 0 mV ~ 55 mV (3V)
• Accuracy: ±5%
• Voltage - Supply: 3 V ~ 6 V
• Port Size: -
• Port Style: No Port
• Features: -
• Termination Style: PCB
• Maximum Pressure: 10.88 PSI (75 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 4-SIP Module
• Supplier Device Package: -

package: 4-SIP Module

TEF6613T/V1,518

NXP

IC CAR RADIO TUNER ANALOG 32SOIC

• Frequency: -
• Sensitivity: -
• Data Rate (Max): -
• Modulation or Protocol: AM, FM, RDS
• Applications: AM/FM Radio Receiver
• Current - Receiving: -
• Data Interface: PCB, Surface Mount
• Memory Size: -
• Antenna Connector: PCB, Surface Mount
• Features: -
• Voltage - Supply: 8.5V
• Operating Temperature: -
• Package / Case: 32-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 32-SO

package: 32-SOIC (0.295", 7.50mm Width)

S912XEG128BCAL

NXP

16-BIT MCU S12X CORE 128KB FLA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 91
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 12K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

package: 112-LQFP

S9S12GA48F0MLFR

NXP

16-BIT MCU S12 CORE 48KB FLASH

• Core Processor: 12V1
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CANbus, IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 40
• Program Memory Size: 48KB (48K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1.5K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
• Data Converters: A/D 12x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

package: 48-LQFP

MIMXRT106ADVL6BR

NXP

IC MCU 32BIT EXT MEM 196MAPBGA

• Core Processor: ARM® Cortex®-M7
• Core Size: 32-Bit Single-Core
• Speed: 600MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
• Number of I/O: 127
• Program Memory Size: -
• Program Memory Type: External Program Memory
• EEPROM Size: -
• RAM Size: 1M x 8
• Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
• Data Converters: A/D 20x12b
• Oscillator Type: External, Internal
• Operating Temperature: 0°C ~ 95°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 196-LFBGA
• Supplier Device Package: 196-MAPBGA (10x10)

package: -

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MHT1807T1

NXP

RF MOSFET

• Transistor Type: -
• Frequency: -
• Gain: -
• Voltage - Test: -
• Current Rating: -
• Noise Figure: -
• Current - Test: -
• Power - Output: -
• Voltage - Rated: -
• Package / Case: -
• Supplier Device Package: -

package: -

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A5G35S008NT6

NXP

RF MOSFET

• Transistor Type: -
• Frequency: -
• Gain: -
• Voltage - Test: -
• Current Rating: -
• Noise Figure: -
• Current - Test: -
• Power - Output: -
• Voltage - Rated: -
• Package / Case: -
• Supplier Device Package: -

package: -

Request a Quote