NXP Producten

MRF9060NR1

NXP

FET RF 65V 945MHZ TO270-2

• Transistor Type: LDMOS
• Frequency: 945MHz
• Gain: 18dB
• Voltage - Test: 26V
• Current Rating: -
• Noise Figure: -
• Current - Test: 450mA
• Power - Output: 60W
• Voltage - Rated: 65V
• Package / Case: TO-270AA
• Supplier Device Package: TO-270-2

package: TO-270AA

BLS3135-65,114

NXP

TRANSISTOR RF POWER SOT422A

• Transistor Type: NPN
• Voltage - Collector Emitter Breakdown (Max): 75V
• Frequency - Transition: 3.5GHz
• Noise Figure (dB Typ @ f): -
• Gain: 7dB
• Power - Max: 200W
• DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 2A, 5V
• Current - Collector (Ic) (Max): 8A
• Operating Temperature: 200°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SOT-422A
• Supplier Device Package: CDFM2

package: SOT-422A

PZM2.4NBA,115

NXP

DIODE ZENER 2.4V 220MW SMT3

• Voltage - Zener (Nom) (Vz): 2.4V
• Tolerance: ±6%
• Power - Max: 220mW
• Impedance (Max) (Zzt): 100 Ohms
• Current - Reverse Leakage @ Vr: 50µA @ 1V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SMT3; MPAK

package: TO-236-3, SC-59, SOT-23-3

TEA1762T/N2/DG,118

NXP

IC CTLR SMPS SW 14SOIC

• Applications: Secondary-Side Controller
• Voltage - Input: -
• Voltage - Supply: 8.6 V ~ 38 V
• Current - Supply: 1mA
• Operating Temperature: -20°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SO

package: 14-SOIC (0.154", 3.90mm Width)

PCA9846PWJ

NXP

IC BUS SWITCH 4CH 16TSSOP

• Type: Bus Switch
• Circuit: 2 x 4:1
• Independent Circuits: 1
• Current - Output High, Low: -
• Voltage Supply Source: Dual Supply
• Voltage - Supply: 0.8 V ~ 3.6 V, 1.65 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

package: 16-TSSOP (0.173", 4.40mm Width)

74HCT563D,652

NXP

IC OCT D TRANSP LATCH INV 20SOIC

• Logic Type: D-Type Transparent Latch
• Circuit: 8:8
• Output Type: Tri-State
• Voltage - Supply: 4.5 V ~ 5.5 V
• Independent Circuits: 1
• Delay Time - Propagation: 18ns
• Current - Output High, Low: -
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SO

package: 20-SOIC (0.295", 7.50mm Width)

HEF4585BT,652

NXP

IC COMPARATOR MAGNITUDE 16SOIC

• Type: Magnitude Comparator
• Number of Bits: 4
• Output: Active High
• Output Function: A<B, A=B, A>B
• Voltage - Supply: 3 V ~ 15 V
• Current - Output High, Low: 3mA, 3mA
• Max Propagation Delay @ V, Max CL: 90ns @ 15V, 50pF
• Current - Quiescent (Iq): 80µA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Mounting Type: Surface Mount

package: 16-SOIC (0.154", 3.90mm Width)

74ABT646APW,112

NXP

IC TRANSCVR 8BIT N-INV 24TSSOP

• Logic Type: Transceiver, Non-Inverting
• Number of Elements: 1
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 24-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 24-TSSOP

package: 24-TSSOP (0.173", 4.40mm Width)

TDF8599TD/N2,512

NXP

IC AMP AUDIO PWR 85W D 36HSOP

• Type: Class D
• Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
• Max Output Power x Channels @ Load: 85W x 1 @ 1 Ohm; 70W x 2 @ 2 Ohm
• Voltage - Supply: 8 V ~ 18 V
• Features: Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: 36-HSOP
• Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad

package: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad

TDA8559T/N1,518

NXP

IC AMP AUDIO .14W MONO AB 16SOIC

• Type: Class AB
• Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
• Max Output Power x Channels @ Load: 140mW x 1 @ 25 Ohm; 35mW x 2 @ 32 Ohm
• Voltage - Supply: 1.9 V ~ 30 V
• Features: Depop, Differential Inputs, Mute, Short-Circuit Protection, Standby
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: 16-SO
• Package / Case: 16-SOIC (0.154", 3.90mm Width)

package: 16-SOIC (0.154", 3.90mm Width)

SC28L202A1DGG/G,11

NXP

IC UART DUAL W/FIFO 56-TSSOP

• Features: Configurable GPIO, Internal Oscillator, Timer/Counter
• Number of Channels: 1, UART
• FIFO's: 256 Byte
• Protocol: RS485
• Data Rate (Max): 3.125Mbps
• Voltage - Supply: 3.3V, 5V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: -
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Surface Mount
• Package / Case: 56-TFSOP (0.240", 6.10mm Width)
• Supplier Device Package: 56-TSSOP

package: 56-TFSOP (0.240", 6.10mm Width)

MCZ33903CP3EK

NXP

IC SBC CAN HS 3.3V 32SOIC

• Applications: System Basis Chip
• Interface: CAN
• Voltage - Supply: 5.5 V ~ 28 V
• Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 32-SOIC EP
• Mounting Type: Surface Mount

package: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

74HCT4051D/AUJ

NXP

IC MUX/DEMUX 8X1 16SOIC

• Switch Circuit: -
• Multiplexer/Demultiplexer Circuit: 8:1
• Number of Circuits: 1
• On-State Resistance (Max): 120 Ohm
• Channel-to-Channel Matching (ΔRon): 6 Ohm
• Voltage - Supply, Single (V+): 4.5 V ~ 5.5 V
• Voltage - Supply, Dual (V±): ±1 V ~ 5 V
• Switch Time (Ton, Toff) (Max): 39ns, 32ns
• -3db Bandwidth: 180MHz
• Charge Injection: -
• Channel Capacitance (CS(off), CD(off)): 3.5pF
• Current - Leakage (IS(off)) (Max): 400nA
• Crosstalk: -
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO

package: 16-SOIC (0.154", 3.90mm Width)

KMPC860DTZQ80D4

NXP

IC MPU MPC8XX 80MHZ 357BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 80MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (2), 10/100 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

package: 357-BBGA

KMPC8250AVRIHBC

NXP

IC MPU MPC82XX 200MHZ 516BGA

• Core Processor: PowerPC G2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 200MHz
• Co-Processors/DSP: Communications; RISC CPM
• RAM Controllers: DRAM, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (3)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 516-BBGA
• Supplier Device Package: 516-FPBGA (27x27)

package: 516-BBGA

MC9S12DJ64VPVE

NXP

IC MCU 16BIT 64KB FLASH 112LQFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, I2C, SCI, SPI
• Peripherals: PWM, WDT
• Number of I/O: 91
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

package: 112-LQFP

P89LV51RD2FA,512

NXP

IC MCU 8BIT 64KB FLASH 44PLCC

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 33MHz
• Connectivity: SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 32
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-LCC (J-Lead)
• Supplier Device Package: 44-PLCC (16.59x16.59)

package: 44-LCC (J-Lead)

MKL27Z64VLH4

NXP

IC MCU 32BIT 64KB FLASH 64LQFP

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I2C, FlexIO, SPI, UART/USART, USB
• Peripherals: DMA, I2S, PWM, WDT
• Number of I/O: 51
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 17x16b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

package: 64-LQFP

MC9S08DV32AMLH

NXP

IC MCU 8BIT 32KB FLASH 64LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: CAN, I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 53
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

package: 64-LQFP

MC9S08AW60CPUE

NXP

IC MCU 8BIT 60KB FLASH 64LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

package: 64-LQFP

MPC9653AAC

NXP

IC PLL CLK GENERATOR 1:8 32-LQFP

• Type: Clock Generator, Fanout Distribution, Multiplexer, Zero Delay Buffer
• PLL: Yes with Bypass
• Input: LVCMOS, LVPECL
• Output: LVCMOS
• Number of Circuits: 1
• Ratio - Input:Output: 1:8
• Differential - Input:Output: Yes/No
• Frequency - Max: 125MHz
• Divider/Multiplier: Yes/No
• Voltage - Supply: 3.135 V ~ 3.465 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

package: 32-LQFP

FXTH870511DT1

NXP

IC SENSOR MULTICHIP XZAXIS 24QFN

• Sensor Type: Tire Pressure Monitoring (TPMS)
• Output Type: RF
• Operating Temperature: -

package: -

BGA2001,115

NXP

MMIC AMPLIFIER SOT-343R

• Frequency: 1.8GHz
• P1dB: -
• Gain: 22dB
• Noise Figure: 1.3dB
• RF Type: Cellular, DECT, PHS, SATV
• Voltage - Supply: 4.5V
• Current - Supply: 3mA ~ 6mA
• Test Frequency: 900MHz
• Package / Case: SC-82A, SOT-343
• Supplier Device Package: CMPAK-4

package: SC-82A, SOT-343

BGA7027,115

NXP

MMIC AMPLIFIER SOT89

• Frequency: 400MHz ~ 2.7GHz
• P1dB: 26dBm
• Gain: 11dB
• Noise Figure: 3.9dB
• RF Type: General Purpose
• Voltage - Supply: 5V
• Current - Supply: 165mA
• Test Frequency: 2.14GHz
• Package / Case: TO-243AA
• Supplier Device Package: SOT-89-3

package: TO-243AA

BGU8M1X

NXP

IC AMP LNA 5V 2500MHZ

• Frequency: 1.805GHz ~ 2.17GHz
• P1dB: -
• Gain: 13.5dB
• Noise Figure: 0.8dB
• RF Type: LTE, WiMax
• Voltage - Supply: 1.5 V ~ 3.1 V
• Current - Supply: 5mA
• Test Frequency: 1.842GHz
• Package / Case: 6-XFDFN
• Supplier Device Package: 6-XSON, SOT1232 (1.1x0.7)

package: 6-XFDFN

FS32K144UIT0VLHT

NXP

IC MCU 32BIT FLASH 64LQFP

• Core Processor: ARM® Cortex®-M4F
• Core Size: 32-Bit
• Speed: 112MHz
• Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
• Data Converters: A/D 16x12b; D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

package: 64-LQFP

MPF5023AMBA0ES

NXP

POWER MANAGEMENT IC, PRE-PROG, 3

• Applications: High Performance i.MX 8, S32x Processor Based
• Current - Supply: 10µA
• Voltage - Supply: 2.5V ~ 5.5V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 40-VFQFN Exposed Pad
• Supplier Device Package: 40-HVQFN (6x6)

package: -

MC33FS8430G4ESR2

NXP

SYSTEM BASIS CHIP FS8430

• Applications: -
• Current - Supply: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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