NXP Producten

MRF8S9260HR3

NXP

FET RF 70V 960MHZ NI-880H

• Transistor Type: LDMOS
• Frequency: 960MHz
• Gain: 18.6dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.7A
• Power - Output: 75W
• Voltage - Rated: 70V
• Package / Case: NI-880
• Supplier Device Package: NI-880

package: NI-880

MRF6P9220HR3

NXP

FET RF 68V 880MHZ NI-860C3

• Transistor Type: LDMOS
• Frequency: 880MHz
• Gain: 20dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.6A
• Power - Output: 47W
• Voltage - Rated: 68V
• Package / Case: NI-860C3
• Supplier Device Package: NI-860C3

package: NI-860C3

BC337-16,112

NXP

TRANS NPN 45V 0.5A TO-92

• Transistor Type: NPN
• Current - Collector (Ic) (Max): 500mA
• Voltage - Collector Emitter Breakdown (Max): 45V
• Vce Saturation (Max) @ Ib, Ic: 700mV @ 50mA, 500mA
• Current - Collector Cutoff (Max): 100nA (ICBO)
• DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 100mA, 1V
• Power - Max: 625mW
• Frequency - Transition: 100MHz
• Operating Temperature: 150°C (TJ)
• Mounting Type: Through Hole
• Package / Case: TO-226-3, TO-92-3 (TO-226AA)
• Supplier Device Package: TO-92-3

package: TO-226-3, TO-92-3 (TO-226AA)

1N914B,113

NXP

DIODE GEN PURP 100V 200MA ALF2

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 100V
• Current - Average Rectified (Io): 200mA
• Voltage - Forward (Vf) (Max) @ If: 1V @ 100mA
• Speed: Small Signal =< 200mA (Io), Any Speed
• Reverse Recovery Time (trr): 4ns
• Current - Reverse Leakage @ Vr: 5µA @ 75V
• Capacitance @ Vr, F: 4pF @ 0V, 1MHz
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: ALF2
• Operating Temperature - Junction: 175°C (Max)

package: DO-204AH, DO-35, Axial

MC33814AER2

NXP

IC CTRL SMALL ENG 2CYL 48LQFP

• Applications: Small Engine
• Current - Supply: 10mA
• Voltage - Supply: 4.5 V ~ 36 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP-EP (7x7)

package: 48-LQFP Exposed Pad

BUK210-50Y,127

NXP

MOSFET N-CH 50V 9A SOT263B-01

• Switch Type: General Purpose
• Number of Outputs: 1
• Ratio - Input:Output: 1:1
• Output Configuration: High Side
• Output Type: N-Channel
• Interface: On/Off
• Voltage - Load: 5.5 V ~ 35 V
• Voltage - Supply (Vcc/Vdd): Not Required
• Current - Output (Max): 9A
• Rds On (Typ): 28 mOhm
• Input Type: Non-Inverting
• Features: Status Flag
• Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage
• Operating Temperature: 150°C (TJ)
• Package / Case: TO-220-5 Formed Leads
• Supplier Device Package: SOT263-01

package: TO-220-5 Formed Leads

MCZ33937EKR2

NXP

IC PRE-DRIVER 3PHASE 54-SOIC

• Motor Type - Stepper: -
• Motor Type - AC, DC: Brushless DC (BLDC)
• Function: Controller - Commutation, Direction Management
• Output Configuration: Pre-Driver - Half Bridge (3)
• Interface: SPI
• Technology: NMOS
• Step Resolution: -
• Applications: Automotive
• Current - Output: -
• Voltage - Supply: 6 V ~ 58 V
• Voltage - Load: -
• Operating Temperature: -40°C ~ 135°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 54-SOICW-EP

package: 54-SSOP (0.295", 7.50mm Width) Exposed Pad

TZA3047BVH/C1,551

NXP

IC LASER DRIVER 1.25GBPS 32-HBCC

• Type: Laser Diode Driver (Fiber Optic)
• Data Rate: 1.25Gbps
• Number of Channels: 1
• Voltage - Supply: 3.14 V ~ 3.47 V
• Current - Supply: 40mA
• Current - Modulation: 100mA
• Current - Bias: 100mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 32-HBCC
• Supplier Device Package: 32-HBCC (5x5)
• Mounting Type: Surface Mount

package: 32-HBCC

74HCT594N,112

NXP

IC 8BIT SHIFT REGISTER 16DIP

• Logic Type: Shift Register
• Output Type: Push-Pull
• Number of Elements: 1
• Number of Bits per Element: 8
• Function: Serial to Parallel, Serial
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

package: 16-DIP (0.300", 7.62mm)

TDA9981BHL/8/C1,55

NXP

IC HDMI TX 81MHZ 80-LQFP

• Type: Transmitter
• Applications: Recorders, Set-Top Boxes
• Mounting Type: Surface Mount
• Package / Case: 80-LQFP
• Supplier Device Package: 80-LQFP (12x12)

package: 80-LQFP

MCZ33884EG

NXP

IC MULTIPLE CONTACT MON 24-SOIC

• Applications: Switch Monitoring
• Interface: SPI
• Voltage - Supply: 7 V ~ 26 V
• Package / Case: 24-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 24-SOIC
• Mounting Type: Surface Mount

package: 24-SOIC (0.295", 7.50mm Width)

PCA9547PW,112

NXP

IC MUX 8CH I2C BUS 24-TSSOP

• Applications: Translating Multiplexer
• Interface: I2C, SMBus
• Voltage - Supply: 2.3 V ~ 3.6 V, 4.5 V ~ 5.5 V
• Package / Case: 24-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 24-TSSOP
• Mounting Type: Surface Mount

package: 24-TSSOP (0.173", 4.40mm Width)

SJA1000/N1,112

NXP

IC STAND-ALONE CAN CTRLR 28-DIP

• Protocol: CAN
• Function: Controller
• Interface: Parallel
• Standards: CAN 2.0
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Supply: 15mA
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 28-DIP (0.600", 15.24mm)
• Supplier Device Package: 28-DIP

package: 28-DIP (0.600", 15.24mm)

MPC8270CVVUPEA

NXP

IC MPU MPC82XX 450MHZ 408TBGA

• Core Processor: PowerPC G2_LE
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 450MHz
• Co-Processors/DSP: Communications; RISC CPM
• RAM Controllers: DRAM, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (3)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 480-LBGA
• Supplier Device Package: 408-TBGA (37.5x37.5)

package: 480-LBGA

MC9S12GC96VPBER

NXP

IC MCU 16BIT 96KB FLASH 52LQFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number of I/O: 35
• Program Memory Size: 96KB (96K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 52-LQFP
• Supplier Device Package: 52-LQFP (10x10)

package: 52-LQFP

MC9S08RE16CFDE

NXP

IC MCU 8BIT 16KB FLASH 48QFN

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 39
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-QFN-EP (7x7)

package: 48-VFQFN Exposed Pad

MC9S08RG32CFGE

NXP

IC MCU 8BIT 32KB FLASH 44LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 39
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-LQFP
• Supplier Device Package: 44-LQFP (10x10)

package: 44-LQFP

MC68HC908JL8CSPE

NXP

IC MCU 8BIT 8KB FLASH 32SDIP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI
• Peripherals: LED, LVD, POR, PWM
• Number of I/O: 26
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 13x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 32-SDIP (0.400", 10.16mm)
• Supplier Device Package: 32-SDIP

package: 32-SDIP (0.400", 10.16mm)

MC9S08PA60AVLH

NXP

IC MCU 8BIT 60KB FLASH 64LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 57
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

package: 64-LQFP

LPC1113FHN33/302K

NXP

IC MCU 32BIT 24KB FLASH 33HVQFN

• Core Processor: ARM? Cortex?-M0
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number of I/O: 28
• Program Memory Size: 24KB (24K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 32-VQFN Exposed Pad
• Supplier Device Package: -

package: 32-VQFN Exposed Pad

MM908E622ACDWB

NXP

IC QUAD HALF BRDG TRPL SW 54SOIC

• Applications: Automotive Mirror Control
• Core Processor: HC08
• Program Memory Type: FLASH (16 kB)
• Controller Series: 908E
• RAM Size: 512 x 8
• Interface: SCI, SPI
• Number of I/O: 12
• Voltage - Supply: 9 V ~ 16 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 54-SOICW-EP

package: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad

MSC8113TVT3600V

NXP

DSP TRI-CORE 431FCBGA

• Type: SC140 Core
• Interface: Ethernet, I2C, TDM, UART
• Clock Rate: 300MHz
• Non-Volatile Memory: External
• On-Chip RAM: 1.436MB
• Voltage - I/O: 3.30V
• Voltage - Core: 1.10V
• Operating Temperature: -40°C ~ 105°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 431-BFBGA, FCBGA
• Supplier Device Package: 431-FCPBGA (20x20)

package: 431-BFBGA, FCBGA

CSM56F801SLK

NXP

KIT LEARNING DSP 16BIT CSM56F801

• Type: -
• Frequency: -
• For Use With/Related Products: -
• Supplied Contents: -

package: -

SPC5605BK0VLU6R

NXP

NXP 32-BIT MCU POWER ARCH CORE

• Core Processor: e200z0h
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: CANbus, I²C, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 149
• Program Memory Size: 768KB (768K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 29x10b, 5x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 176-LQFP
• Supplier Device Package: 176-LQFP (24x24)

package: 176-LQFP

TFA9871BUK/N1Z

NXP

IC AUDIO AMP CLASS D WLCSP

• Type: -
• Output Type: -
• Max Output Power x Channels @ Load: -
• Voltage - Supply: -
• Features: -
• Mounting Type: -
• Operating Temperature: -
• Supplier Device Package: -
• Package / Case: -

package: -

MC34PF8100A0EPR2

NXP

POWER MANAGEMENT IC I.MX8 NON-PR

• Applications: High Performance i.MX 8, S32x Processor Based
• Current - Supply: -
• Voltage - Supply: 2.5V ~ 5.5V
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-HVQFN (8x8)

package: -

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LS1017AXE7NQA

NXP

IC MPU QORIQ 1.3GHZ 448FBGA

• Core Processor: ARM® Cortex®-A72
• Number of Cores/Bus Width: 1 Core, 64-Bit
• Speed: 1.3GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: 1Gbps (1), 2.5Gbps (5)
• SATA: SATA 6Gbps (1)
• USB: -
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 448-BFBGA
• Supplier Device Package: 448-FBGA (17x17)

package: -

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LPC5504JHI48EL

NXP

IC MCU 32BIT 128KB FLASH 48HVQFN

• Core Processor: ARM® Cortex®-M33
• Core Size: 32-Bit Single-Core
• Speed: 96MHz
• Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
• Number of I/O: 30
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 80K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
• Data Converters: A/D 7x16b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-HVQFN (7x7)

package: -

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