Intel Producten

10AS022E3F29I1HG

Intel

IC SOC FPGA 288 I/O 780FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 220K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-FBGA (29x29)

package: 780-BBGA, FCBGA

10AS016E3F27E1HG

Intel

IC SOC FPGA 240 I/O 672FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 160K Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 672-BBGA, FCBGA
• Supplier Device Package: 672-FBGA (27x27)

package: 672-BBGA, FCBGA

EPF10K30EFC484-2X

Intel

IC FPGA 220 I/O 484FBGA

• Number of LABs/CLBs: 216
• Number of Logic Elements/Cells: 1728
• Total RAM Bits: 24576
• Number of I/O: 220
• Number of Gates: 119000
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 70°C (TA)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

package: 484-BBGA

EP1S25F1020C5

Intel

IC FPGA 706 I/O 1020FBGA

• Number of LABs/CLBs: 2566
• Number of Logic Elements/Cells: 25660
• Total RAM Bits: 1944576
• Number of I/O: 706
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1020-BBGA
• Supplier Device Package: 1020-FBGA (33x33)

package: 1020-BBGA

10CL016ZU484I8G

Intel

484-PIN UBGA

• Number of LABs/CLBs: 963
• Number of Logic Elements/Cells: 15408
• Total RAM Bits: 516096
• Number of I/O: 340
• Number of Gates: -
• Voltage - Supply: 1.2V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-UBGA
• Supplier Device Package: 484-UBGA (19x19)

package: 484-UBGA

EP1C12F324I7

Intel

IC FPGA 249 I/O 324FBGA

• Number of LABs/CLBs: 1206
• Number of Logic Elements/Cells: 12060
• Total RAM Bits: 239616
• Number of I/O: 249
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 324-BGA
• Supplier Device Package: 324-FBGA (19x19)

package: 324-BGA

5SEEBH40C3N

Intel

IC FPGA 696 I/O 1517HBGA

• Number of LABs/CLBs: 359250
• Number of Logic Elements/Cells: 952000
• Total RAM Bits: 65561600
• Number of I/O: 696
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-HBGA (45x45)

package: 1517-BBGA, FCBGA

5CEBA2F17A7N

Intel

IC FPGA 128 I/O 256FBGA

• Number of LABs/CLBs: 9434
• Number of Logic Elements/Cells: 25000
• Total RAM Bits: 2002944
• Number of I/O: 128
• Number of Gates: -
• Voltage - Supply: 1.07 V ~ 1.13 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FBGA (17x17)

package: 256-LBGA

10M02SCM153I7G

Intel

IC FPGA 112 I/O 153MBGA

• Number of LABs/CLBs: 125
• Number of Logic Elements/Cells: 2000
• Total RAM Bits: 110592
• Number of I/O: 112
• Number of Gates: -
• Voltage - Supply: 2.85 V ~ 3.465 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 153-VFBGA
• Supplier Device Package: 153-MBGA (8x8)

package: 153-VFBGA

EPM7064LC68-7MM

Intel

IC CPLD 64MC 7.5NS 68PLCC

• Programmable Type: EE PLD
• Delay Time tpd(1) Max: 7.5ns
• Voltage Supply - Internal: 4.75 V ~ 5.25 V
• Number of Logic Elements/Blocks: 4
• Number of Macrocells: 64
• Number of Gates: 1250
• Number of I/O: 52
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

EPM7256BUC169-7

Intel

IC CPLD 256MC 7.5NS 169UBGA

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 7.5ns
• Voltage Supply - Internal: 2.375 V ~ 2.625 V
• Number of Logic Elements/Blocks: 16
• Number of Macrocells: 256
• Number of Gates: 5000
• Number of I/O: 141
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 169-LFBGA
• Supplier Device Package: 169-UBGA (11x11)

package: 169-LFBGA

EPM7256BUC169-10N

Intel

IC CPLD 256MC 10NS 169UBGA

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 10.0ns
• Voltage Supply - Internal: 2.375 V ~ 2.625 V
• Number of Logic Elements/Blocks: 16
• Number of Macrocells: 256
• Number of Gates: 5000
• Number of I/O: 141
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 169-LFBGA
• Supplier Device Package: 169-UBGA (11x11)

package: 169-LFBGA

EPM1270M256C5N

Intel

IC CPLD 980MC 6.2NS 256MBGA

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 6.2ns
• Voltage Supply - Internal: 2.5V, 3.3V
• Number of Logic Elements/Blocks: 1270
• Number of Macrocells: 980
• Number of Gates: -
• Number of I/O: 212
• Operating Temperature: 0°C ~ 85°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 256-TFBGA
• Supplier Device Package: 256-MBGA (11x11)

package: 256-TFBGA

EPM570GT144I5

Intel

IC CPLD 440MC 5.4NS 144TQFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 5.4ns
• Voltage Supply - Internal: 1.71 V ~ 1.89 V
• Number of Logic Elements/Blocks: 570
• Number of Macrocells: 440
• Number of Gates: -
• Number of I/O: 116
• Operating Temperature: -40°C ~ 100°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

package: 144-LQFP

EP3SL70F484I4G

Intel

IC FPGA 296 I/O 484FBGA

• Number of LABs/CLBs: 2700
• Number of Logic Elements/Cells: 67500
• Total RAM Bits: 2699264
• Number of I/O: 296
• Number of Gates: -
• Voltage - Supply: 0.86V ~ 1.15V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BBGA, FCBGA
• Supplier Device Package: 484-FBGA (23x23)

package: 484-BBGA, FCBGA

EP2AGX65DF25I5G

Intel

IC FPGA 252 I/O 572FBGA

• Number of LABs/CLBs: 2530
• Number of Logic Elements/Cells: 60214
• Total RAM Bits: 5371904
• Number of I/O: 252
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 572-BGA, FCBGA
• Supplier Device Package: 572-FBGA, FC (25x25)

package: 572-BGA, FCBGA

AGFB027R24C2I1V

Intel

IC FPGA AGILEX-F 2340FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.7M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

package: -

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1SX280LN3F43I2LP

Intel

IC FPGA STRATIX 10 1760FBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 2800K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FBGA (42.5x42.5)

package: -

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1SX280LN3F43I3XG

Intel

IC FPGA STRATIX 10 1760FBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 2800K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FBGA (42.5x42.5)

package: -

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5SGXMA5K3F35C2LG

Intel

IC FPGA 432 I/O 1152FBGA

• Number of LABs/CLBs: 185000
• Number of Logic Elements/Cells: 490000
• Total RAM Bits: 46080000
• Number of I/O: 432
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

package: -

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EP4SGX530NF45I3G

Intel

IC FPGA 920 I/O 1932FCBGA

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: -
• Total RAM Bits: -
• Number of I/O: -
• Number of Gates: -
• Voltage - Supply: -
• Mounting Type: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

package: -

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5AGXFB7H6F35C6G

Intel

IC FPGA 544 I/O 1152FBGA

• Number of LABs/CLBs: 23786
• Number of Logic Elements/Cells: 504140
• Total RAM Bits: 2975744
• Number of I/O: 544
• Number of Gates: -
• Voltage - Supply: 1.07V ~ 1.13V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA, FC (35x35)

package: -

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5SGXEA5N3F40C2G

Intel

IC FPGA 600 I/O 1517FBGA

• Number of LABs/CLBs: 185000
• Number of Logic Elements/Cells: 490000
• Total RAM Bits: 46080000
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

package: -

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5SGXMA5K2F40I2LG

Intel

IC FPGA 696 I/O 1517FBGA

• Number of LABs/CLBs: 185000
• Number of Logic Elements/Cells: 490000
• Total RAM Bits: 46080000
• Number of I/O: 696
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

package: -

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5SGXMA5H3F35C2LG

Intel

IC FPGA 552 I/O 1152FBGA

• Number of LABs/CLBs: 185000
• Number of Logic Elements/Cells: 490000
• Total RAM Bits: 46080000
• Number of I/O: 552
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

package: -

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5SGXEB6R1F43C1G

Intel

IC FPGA 600 I/O 1760FBGA

• Number of LABs/CLBs: 225400
• Number of Logic Elements/Cells: 597000
• Total RAM Bits: 53248000
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FCBGA (42.5x42.5)

package: -

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KU82304-25

Intel

IC CONTROLLER 132QFP

• Type: Controller
• Applications: -
• Mounting Type: Surface Mount
• Package / Case: 132-QFP Bumpered
• Supplier Device Package: 132-QFP

package: -

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5962-8850106ZA

Intel

IC MPU I186 10MHZ

• Core Processor: 80C186
• Number of Cores/Bus Width: 1 Core, 16-Bit
• Speed: 10MHz
• Co-Processors/DSP: Math Engine; 80C187
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 5V
• Operating Temperature: -55°C ~ 125°C (TC)
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

package: -

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