Intel Producten

10AS057K1F40I1SG

Intel

IC SOC FPGA 696 I/O 1517FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 570K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

package: 1517-BBGA, FCBGA

5CSEBA4U23I7LN

Intel

672-PIN UBGA

• Architecture: -
• Core Processor: -
• Flash Size: -
• RAM Size: -
• Peripherals: -
• Connectivity: -
• Speed: -
• Primary Attributes: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

package: -

5CSEBA4U23I7SN

Intel

IC FPGA 188 I/O 672UBGA

• Architecture: MCU, FPGA
• Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 64KB
• Peripherals: DMA, POR, WDT
• Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 800MHz
• Primary Attributes: FPGA - 40K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 672-FBGA
• Supplier Device Package: 672-UBGA (23x23)

package: 672-FBGA

EPC8QC100DM

Intel

IC CONFIG DEVICE

• Programmable Type: In System Programmable
• Memory Size: 8MB
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 100-BQFP
• Supplier Device Package: 100-PQFP (20x14)

package: 100-BQFP

EP1M120F484C7ES

Intel

IC FPGA

• Number of LABs/CLBs: 480
• Number of Logic Elements/Cells: 4800
• Total RAM Bits: 49152
• Number of I/O: 303
• Number of Gates: 120000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-BBGA, FCBGA
• Supplier Device Package: 484-FBGA (23x23)

package: 484-BBGA, FCBGA

10M04SFE144C8G

Intel

IC FPGA/CPLD NV 144EQFP

• Number of LABs/CLBs: 250
• Number of Logic Elements/Cells: 4000
• Total RAM Bits: 193536
• Number of I/O: 101
• Number of Gates: -
• Voltage - Supply: 2.85 V ~ 3.465 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 144-LQFP Exposed Pad
• Supplier Device Package: 144-EQFP (20x20)

package: 144-LQFP Exposed Pad

EPF6024ATC144-1

Intel

IC FPGA 117 I/O 144TQFP

• Number of LABs/CLBs: 196
• Number of Logic Elements/Cells: 1960
• Total RAM Bits: -
• Number of I/O: 117
• Number of Gates: 24000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

package: 144-LQFP

EP2SGX90FF1508C5ES

Intel

IC FPGA 650 I/O 1508FBGA

• Number of LABs/CLBs: 4548
• Number of Logic Elements/Cells: 90960
• Total RAM Bits: 4520448
• Number of I/O: 650
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1508-BBGA, FCBGA
• Supplier Device Package: 1508-FBGA (30x30)

package: 1508-BBGA, FCBGA

EP1K50FI256-2N

Intel

IC FPGA 186 I/O 256FBGA

• Number of LABs/CLBs: 360
• Number of Logic Elements/Cells: 2880
• Total RAM Bits: 40960
• Number of I/O: 186
• Number of Gates: 199000
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 256-BBGA
• Supplier Device Package: 256-FBGA (17x17)

package: 256-BBGA

EP1K100QC208-2

Intel

IC FPGA 147 I/O 208QFP

• Number of LABs/CLBs: 624
• Number of Logic Elements/Cells: 4992
• Total RAM Bits: 49152
• Number of I/O: 147
• Number of Gates: 257000
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 70°C (TA)
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

package: 208-BFQFP

EP4SGX360NF45C3N

Intel

IC FPGA 920 I/O 1932FBGA

• Number of LABs/CLBs: 14144
• Number of Logic Elements/Cells: 353600
• Total RAM Bits: 23105536
• Number of I/O: 920
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

package: 1932-BBGA, FCBGA

EP4SE360H29C4N

Intel

IC FPGA 488 I/O 780HBGA

• Number of LABs/CLBs: 14144
• Number of Logic Elements/Cells: 353600
• Total RAM Bits: 23105536
• Number of I/O: 488
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-HBGA (33x33)

package: 780-BBGA, FCBGA

5SGXEA3K2F40I3N

Intel

IC FPGA 696 I/O 1517FBGA

• Number of LABs/CLBs: 128300
• Number of Logic Elements/Cells: 340000
• Total RAM Bits: 23704576
• Number of I/O: 696
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

package: 1517-BBGA, FCBGA

EP4CE115F29C8L

Intel

IC FPGA 528 I/O 780FBGA

• Number of LABs/CLBs: 7155
• Number of Logic Elements/Cells: 114480
• Total RAM Bits: 3981312
• Number of I/O: 528
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 780-BGA
• Supplier Device Package: 780-FBGA (29x29)

package: 780-BGA

EP3C25U256C7N

Intel

IC FPGA 156 I/O 256UBGA

• Number of LABs/CLBs: 1539
• Number of Logic Elements/Cells: 24624
• Total RAM Bits: 608256
• Number of I/O: 156
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 256-LFBGA
• Supplier Device Package: 256-UBGA (14x14)

package: 256-LFBGA

EP4CE10F17C7N

Intel

IC FPGA 179 I/O 256FBGA

• Number of LABs/CLBs: 645
• Number of Logic Elements/Cells: 10320
• Total RAM Bits: 423936
• Number of I/O: 179
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FBGA (17x17)

package: 256-LBGA

EPM570T144C5

Intel

IC CPLD 440MC 5.4NS 144TQFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 5.4ns
• Voltage Supply - Internal: 2.5V, 3.3V
• Number of Logic Elements/Blocks: 570
• Number of Macrocells: 440
• Number of Gates: -
• Number of I/O: 116
• Operating Temperature: 0°C ~ 85°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

package: 144-LQFP

EP2AGX125DF25I5G

Intel

IC FPGA 260 I/O 572FBGA

• Number of LABs/CLBs: 4964
• Number of Logic Elements/Cells: 118143
• Total RAM Bits: 8315904
• Number of I/O: 260
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 572-BGA, FCBGA
• Supplier Device Package: 572-FBGA, FC (25x25)

package: 572-BGA, FCBGA

YW80C196NU40

Intel

IC MCU 16BIT ROMLESS

• Core Processor: MCS 96
• Core Size: 16-Bit
• Speed: 40MHz
• Connectivity: SIO
• Peripherals: PWM
• Number of I/O: 32
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-BFQFP
• Supplier Device Package: -

package: -

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1SG280HN2F43I2VG

Intel

IC FPGA 688 I/O 1760FBGA

• Number of LABs/CLBs: 350000
• Number of Logic Elements/Cells: 2800000
• Total RAM Bits: -
• Number of I/O: 688
• Number of Gates: -
• Voltage - Supply: 0.77V ~ 0.97V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FBGA (42.5x42.5)

package: -

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1SG280HU2F50E2VGAS

Intel

IC FPGA 704 I/O 2397BGA

• Number of LABs/CLBs: 350000
• Number of Logic Elements/Cells: 2800000
• Total RAM Bits: -
• Number of I/O: 704
• Number of Gates: -
• Voltage - Supply: 0.77V ~ 0.97V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2397-BBGA, FCBGA
• Supplier Device Package: 2397-FBGA, FC (50x50)

package: -

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AGFA008R16A2I3V

Intel

IC FPGA AGILEX-F 1546FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 764K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

package: -

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1SG211HN1F43E2VG

Intel

IC FPGA 688 I/O 1760FBGA

• Number of LABs/CLBs: 263750
• Number of Logic Elements/Cells: 2110000
• Total RAM Bits: -
• Number of I/O: 688
• Number of Gates: -
• Voltage - Supply: 0.77V ~ 0.97V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FBGA (42.5x42.5)

package: -

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MR87C51FB16

Intel

8-BIT UVPROM

• Core Processor: 87C51FB
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: -
• Peripherals: WDT
• Number of I/O: 32
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: EPROM
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 4V ~ 6V
• Data Converters: -
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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AGFB022R31C2I2V

Intel

IC FPGA AGILEX-F 3184FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.2M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

package: -

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1ST280EU3F50I3VG

Intel

IC FPGA 440 I/O 2397BGA

• Number of LABs/CLBs: 350000
• Number of Logic Elements/Cells: 2800000
• Total RAM Bits: -
• Number of I/O: 440
• Number of Gates: -
• Voltage - Supply: 0.77V ~ 0.97V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 2397-BBGA, FCBGA
• Supplier Device Package: 2397-FBGA, FC (50x50)

package: -

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1SX280HH3F55I2LG

Intel

IC FPGA STRATIX 10 2912FBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 2800K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 2912-BBGA, FCBGA
• Supplier Device Package: 2912-FBGA, FC (55x55)

package: -

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5SGXMA7K2F40C1G

Intel

IC FPGA 696 I/O 1517FBGA

• Number of LABs/CLBs: 234720
• Number of Logic Elements/Cells: 622000
• Total RAM Bits: 51200000
• Number of I/O: 696
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

package: -

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