Intel Producten

5CSXFC6C6U23A7N

Intel

IC FPGA 145 I/O 672UBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 64KB
• Peripherals: DMA, POR, WDT
• Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 700MHz
• Primary Attributes: FPGA - 110K Logic Elements
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 672-FBGA
• Supplier Device Package: 672-UBGA (23x23)

package: 672-FBGA

10AX016E3F29I1SG

Intel

IC FPGA 288 I/O 780FBGA

• Number of LABs/CLBs: 61510
• Number of Logic Elements/Cells: 160000
• Total RAM Bits: 10086400
• Number of I/O: 288
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.98 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-FBGA (29x29)

package: 780-BBGA, FCBGA

MPM7128SQC100AC

Intel

IC FPGA

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: -
• Total RAM Bits: -
• Number of I/O: -
• Number of Gates: -
• Voltage - Supply: -
• Mounting Type: Surface Mount
• Operating Temperature: -
• Package / Case: 100-BQFP
• Supplier Device Package: 100-PQFP (20x14)

package: 100-BQFP

EPF10K70RC240-3GZ

Intel

IC FPGA

• Number of LABs/CLBs: 468
• Number of Logic Elements/Cells: 3744
• Total RAM Bits: 18432
• Number of I/O: 189
• Number of Gates: 118000
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 70°C (TA)
• Package / Case: 240-BFQFP Exposed Pad
• Supplier Device Package: 240-RQFP (32x32)

package: 240-BFQFP Exposed Pad

10AX115H2F34I2SGE2

Intel

IC FPGA 504 I/O 1152FCBGA

• Number of LABs/CLBs: 427200
• Number of Logic Elements/Cells: 1150000
• Total RAM Bits: 68857856
• Number of I/O: 504
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.98 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FCBGA (35x35)

package: 1152-BBGA, FCBGA

EPF10K30ETC144-2

Intel

IC FPGA 102 I/O 144TQFP

• Number of LABs/CLBs: 216
• Number of Logic Elements/Cells: 1728
• Total RAM Bits: 24576
• Number of I/O: 102
• Number of Gates: 119000
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 70°C (TA)
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

package: 144-LQFP

EP20K300EFI672-2X

Intel

IC FPGA 408 I/O 672FBGA

• Number of LABs/CLBs: 1152
• Number of Logic Elements/Cells: 11520
• Total RAM Bits: 147456
• Number of I/O: 408
• Number of Gates: 728000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 672-BBGA
• Supplier Device Package: 672-FBGA (27x27)

package: 672-BBGA

EP1SGX10CF672C5N

Intel

IC FPGA 362 I/O 672FBGA

• Number of LABs/CLBs: 1057
• Number of Logic Elements/Cells: 10570
• Total RAM Bits: 920448
• Number of I/O: 362
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 672-BBGA, FCBGA
• Supplier Device Package: 672-FBGA (27x27)

package: 672-BBGA, FCBGA

EP1S80F1020C7

Intel

IC FPGA 773 I/O 1020FBGA

• Number of LABs/CLBs: 7904
• Number of Logic Elements/Cells: 79040
• Total RAM Bits: 7427520
• Number of I/O: 773
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1020-BBGA
• Supplier Device Package: 1020-FBGA (33x33)

package: 1020-BBGA

EP3C40F780C7

Intel

IC FPGA 535 I/O 780FBGA

• Number of LABs/CLBs: 2475
• Number of Logic Elements/Cells: 39600
• Total RAM Bits: 1161216
• Number of I/O: 535
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 780-BGA
• Supplier Device Package: 780-FBGA (29x29)

package: 780-BGA

5SGSED6N3F45I3L

Intel

IC FPGA 840 I/O 1932FBGA

• Number of LABs/CLBs: 220000
• Number of Logic Elements/Cells: 583000
• Total RAM Bits: 54553600
• Number of I/O: 840
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

package: 1932-BBGA, FCBGA

EP4SGX290KF40C3

Intel

IC FPGA 744 I/O 1517FBGA

• Number of LABs/CLBs: 11648
• Number of Logic Elements/Cells: 291200
• Total RAM Bits: 17661952
• Number of I/O: 744
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

package: 1517-BBGA, FCBGA

5SGXEB6R3F43C4

Intel

IC FPGA 600 I/O 1760FBGA

• Number of LABs/CLBs: 225400
• Number of Logic Elements/Cells: 597000
• Total RAM Bits: 61688832
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FBGA, FC (42.5x42.5)

package: 1760-BBGA, FCBGA

10AX090R2F40E1SG

Intel

IC FPGA 342 I/O 1517FCBGA

• Number of LABs/CLBs: 339620
• Number of Logic Elements/Cells: 900000
• Total RAM Bits: 59234304
• Number of I/O: 342
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.98 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

package: 1517-BBGA, FCBGA

10AX115S3F45E2SG

Intel

IC FPGA 624 I/O 1932FCBGA

• Number of LABs/CLBs: 427200
• Number of Logic Elements/Cells: 1150000
• Total RAM Bits: 68857856
• Number of I/O: 624
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

package: 1932-BBGA, FCBGA

EP2AGX125EF35C4

Intel

IC FPGA 452 I/O 1152FBGA

• Number of LABs/CLBs: 4964
• Number of Logic Elements/Cells: 118143
• Total RAM Bits: 8315904
• Number of I/O: 452
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

package: 1152-BBGA, FCBGA

5CGTFD5C5F23I7

Intel

IC FPGA 240 I/O 484FBGA

• Number of LABs/CLBs: 29080
• Number of Logic Elements/Cells: 77000
• Total RAM Bits: 5001216
• Number of I/O: 240
• Number of Gates: -
• Voltage - Supply: 1.07 V ~ 1.13 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BGA
• Supplier Device Package: 484-FBGA (23x23)

package: 484-BGA

EP4CE75F29C9LN

Intel

IC FPGA 426 I/O 780FBGA

• Number of LABs/CLBs: 4713
• Number of Logic Elements/Cells: 75408
• Total RAM Bits: 2810880
• Number of I/O: 426
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 780-BGA
• Supplier Device Package: 780-FBGA (29x29)

package: 780-BGA

EP4CE22E22C7

Intel

IC FPGA 79 I/O 144EQFP

• Number of LABs/CLBs: 1395
• Number of Logic Elements/Cells: 22320
• Total RAM Bits: 608256
• Number of I/O: 79
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 144-LQFP Exposed Pad
• Supplier Device Package: 144-EQFP (20x20)

package: 144-LQFP Exposed Pad

EP4CE10F17C8

Intel

IC FPGA 179 I/O 256FBGA

• Number of LABs/CLBs: 645
• Number of Logic Elements/Cells: 10320
• Total RAM Bits: 423936
• Number of I/O: 179
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FBGA (17x17)

package: 256-LBGA

EPM7032BTC48-5

Intel

IC CPLD 32MC 5NS 48TQFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 5.0ns
• Voltage Supply - Internal: 2.375 V ~ 2.625 V
• Number of Logic Elements/Blocks: 2
• Number of Macrocells: 32
• Number of Gates: 600
• Number of I/O: 36
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-TQFP
• Supplier Device Package: -

package: 48-TQFP

EPM1270GF256C4N

Intel

IC CPLD 980MC 6.2NS 256FBGA

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 6.2ns
• Voltage Supply - Internal: 1.71 V ~ 1.89 V
• Number of Logic Elements/Blocks: 1270
• Number of Macrocells: 980
• Number of Gates: -
• Number of I/O: 212
• Operating Temperature: 0°C ~ 85°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 256-BGA
• Supplier Device Package: 256-FBGA (17x17)

package: 256-BGA

1SX280HU3F50E1VG

Intel

IC FPGA STRATIX 10 2397FBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 2800K Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2397-BBGA, FCBGA
• Supplier Device Package: 2397-FBGA, FC (50x50)

package: -

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GCIXF440AC

Intel

LAN CONTROLLER, 8 CHANNEL(S), 12

• Protocol: Ethernet
• Function: Controller
• Interface: -
• Standards: -
• Voltage - Supply: 3V ~ 3.6V
• Current - Supply: 830mA
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 352-BGA
• Supplier Device Package: -

package: -

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1ST250EY1F55E2VG

Intel

IC FPGA 296 I/O 2912BGA

• Number of LABs/CLBs: 312500
• Number of Logic Elements/Cells: 2500000
• Total RAM Bits: -
• Number of I/O: 296
• Number of Gates: -
• Voltage - Supply: 0.77V ~ 0.97V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2912-BBGA, FCBGA
• Supplier Device Package: 2912-FBGA, FC (55x55)

package: -

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AGID023R31B1E2VB

Intel

IC FPGA AGILEX-I 3184BGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.3M Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 3184-BFBGA Exposed Pad
• Supplier Device Package: 3184-BGA (56x45)

package: -

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AGFB006R24C2E1VB

Intel

IC FPGA AGILEX-F 2340BGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 573K Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2340-BFBGA Exposed Pad
• Supplier Device Package: 2340-BGA (45x42)

package: -

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5ASXBB3D4F35C5G

Intel

IC SOC CORTEX-A9 800MHZ 1152FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 64KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 800MHz
• Primary Attributes: FPGA - 350K Logic Elements
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA, FC (35x35)

package: -

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