Intel Producten

1SX250LH3F55E3VG

Intel

2912-PIN FBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 2500K Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

package: -

10AS057K1F35E1HG

Intel

IC SOC FPGA 396 I/O 1152FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 570K Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

package: 1152-BBGA, FCBGA

5ASXMB5E4F31C4N

Intel

IC FPGA 170 I/O 896FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 64KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 925MHz
• Primary Attributes: FPGA - 462K Logic Elements
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 896-BBGA, FCBGA
• Supplier Device Package: 896-FBGA (31x31)

package: 896-BBGA, FCBGA

ER3110DI

Intel

IC REG BUCK ADJ 1A SYNC 12DFN

• Function: Step-Down
• Output Configuration: Positive
• Topology: Buck
• Output Type: Adjustable
• Number of Outputs: 1
• Voltage - Input (Min): 3V
• Voltage - Input (Max): 36V
• Voltage - Output (Min/Fixed): 0.6V
• Voltage - Output (Max): 34V
• Current - Output: 1A
• Frequency - Switching: 300kHz ~ 2MHz
• Synchronous Rectifier: Yes
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 12-VFDFN Exposed Pad
• Supplier Device Package: 12-DFN (4x3)

package: 12-VFDFN Exposed Pad

EP20K1500CF33C8

Intel

IC FPGA

• Number of LABs/CLBs: 5184
• Number of Logic Elements/Cells: 51840
• Total RAM Bits: 442368
• Number of I/O: -
• Number of Gates: 2392000
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1020-BBGA
• Supplier Device Package: 1020-FBGA (33x33)

package: 1020-BBGA

EPF10K50STC144-2X

Intel

IC FPGA 102 I/O 144TQFP

• Number of LABs/CLBs: 360
• Number of Logic Elements/Cells: 2880
• Total RAM Bits: 40960
• Number of I/O: 102
• Number of Gates: 199000
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 70°C (TA)
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

package: 144-LQFP

EPF10K100EQC208-2

Intel

IC FPGA 147 I/O 208QFP

• Number of LABs/CLBs: 624
• Number of Logic Elements/Cells: 4992
• Total RAM Bits: 49152
• Number of I/O: 147
• Number of Gates: 257000
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 70°C (TA)
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

package: 208-BFQFP

EPF6024AQC240-2

Intel

IC FPGA 199 I/O 240QFP

• Number of LABs/CLBs: 196
• Number of Logic Elements/Cells: 1960
• Total RAM Bits: -
• Number of I/O: 199
• Number of Gates: 24000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 240-BQFP
• Supplier Device Package: 240-PQFP (32x32)

package: 240-BQFP

EP3SL340H1152C4N

Intel

IC FPGA 744 I/O 1152HBGA

• Number of LABs/CLBs: 13500
• Number of Logic Elements/Cells: 337500
• Total RAM Bits: 18822144
• Number of I/O: 744
• Number of Gates: -
• Voltage - Supply: 0.86 V ~ 1.15 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-HBGA (40x40)

package: 1152-BBGA, FCBGA

5SGXEA7H2F35I2

Intel

IC FPGA 552 I/O 1152FBGA

• Number of LABs/CLBs: 234720
• Number of Logic Elements/Cells: 622000
• Total RAM Bits: 59939840
• Number of I/O: 552
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

package: 1152-BBGA, FCBGA

EP2S130F780C5N

Intel

IC FPGA 534 I/O 780FBGA

• Number of LABs/CLBs: 6627
• Number of Logic Elements/Cells: 132540
• Total RAM Bits: 6747840
• Number of I/O: 534
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 780-BBGA
• Supplier Device Package: 780-FBGA (29x29)

package: 780-BBGA

5SGXMA3K2F40C2N

Intel

IC FPGA 696 I/O 1517FBGA

• Number of LABs/CLBs: 128300
• Number of Logic Elements/Cells: 340000
• Total RAM Bits: 23704576
• Number of I/O: 696
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

package: 1517-BBGA, FCBGA

EP4CGX30CF23C6N

Intel

IC FPGA 290 I/O 484FBGA

• Number of LABs/CLBs: 1840
• Number of Logic Elements/Cells: 29440
• Total RAM Bits: 1105920
• Number of I/O: 290
• Number of Gates: -
• Voltage - Supply: 1.16 V ~ 1.24 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-BGA
• Supplier Device Package: 484-FBGA (23x23)

package: 484-BGA

EP4CE22F17C8L

Intel

IC FPGA 153 I/O 256FBGA

• Number of LABs/CLBs: 1395
• Number of Logic Elements/Cells: 22320
• Total RAM Bits: 608256
• Number of I/O: 153
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FBGA (17x17)

package: 256-LBGA

EP3C5E144I7

Intel

IC FPGA 94 I/O 144EQFP

• Number of LABs/CLBs: 321
• Number of Logic Elements/Cells: 5136
• Total RAM Bits: 423936
• Number of I/O: 94
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 144-LQFP Exposed Pad
• Supplier Device Package: 144-EQFP (20x20)

package: 144-LQFP Exposed Pad

10M02DCV36C7G

Intel

IC FPGA 27 I/O 36WLCSP

• Number of LABs/CLBs: 125
• Number of Logic Elements/Cells: 2000
• Total RAM Bits: 110592
• Number of I/O: 27
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 36-UFBGA, WLCSP
• Supplier Device Package: 36-WLCSP (3x3)

package: 36-UFBGA, WLCSP

EPM7256BFC256-10N

Intel

IC CPLD 256MC 10NS 256FBGA

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 10.0ns
• Voltage Supply - Internal: 2.375 V ~ 2.625 V
• Number of Logic Elements/Blocks: 16
• Number of Macrocells: 256
• Number of Gates: 5000
• Number of I/O: 164
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 256-BGA
• Supplier Device Package: 256-FBGA (17x17)

package: 256-BGA

EPM7032BTC44-5N

Intel

IC CPLD 32MC 5NS 44TQFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 5.0ns
• Voltage Supply - Internal: 2.375 V ~ 2.625 V
• Number of Logic Elements/Blocks: 2
• Number of Macrocells: 32
• Number of Gates: 600
• Number of I/O: 36
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 44-TQFP
• Supplier Device Package: 44-TQFP (10x10)

package: 44-TQFP

1SD280PT2F55I2VG

Intel

IC FPGA 816 I/O 2912FBGA

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: 2753000
• Total RAM Bits: 240123904
• Number of I/O: 816
• Number of Gates: -
• Voltage - Supply: -
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 2912-BBGA, FCBGA
• Supplier Device Package: 2912-FBGA (55x55)

package: -

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AGFA022R31C3I3E

Intel

IC FPGA AGILEX-F 3184FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.2M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

package: -

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TN80C188EA20

Intel

IC MPU I186 20MHZ 68PLCC

• Core Processor: 80C186
• Number of Cores/Bus Width: 1 Core, 16-Bit
• Speed: 20MHz
• Co-Processors/DSP: -
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 68-LCC (J-Lead)
• Supplier Device Package: 68-PLCC

package: -

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5SGXMA5N2F45C2WN

Intel

IC FPGA 840 I/O 1932FBGA

• Number of LABs/CLBs: 185000
• Number of Logic Elements/Cells: 490000
• Total RAM Bits: 46080000
• Number of I/O: 840
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

package: -

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AGIA040R39A2I1VB

Intel

IC FPGA AGILEX-I 3948FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 4.047M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 3948-BFBGA Exposed Pad
• Supplier Device Package: 3948-BGA (56x56)

package: -

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N825306

Intel

MULTI PROTOCOL CONTROLLER

• Protocol: -
• Function: Controller
• Interface: Serial
• Standards: -
• Voltage - Supply: -
• Current - Supply: -
• Operating Temperature: -
• Package / Case: 44-LCC (J-Lead)
• Supplier Device Package: 44-PLCC

package: -

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5SGSMD4H3F35I3WN

Intel

IC FPGA 432 I/O 1152FBGA

• Number of LABs/CLBs: 135840
• Number of Logic Elements/Cells: 360000
• Total RAM Bits: 19456000
• Number of I/O: 432
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

package: -

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AGFA012R24C2E3E

Intel

IC FPGA AGILEX-F 2340FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 1.2M Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

package: -

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ET80960JT10016

Intel

IC MPU I960 100MHZ 132QFP

• Core Processor: i960
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 100MHz
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 100°C (TC)
• Security Features: -
• Package / Case: 132-QFP
• Supplier Device Package: 132-QFP

package: -

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1SG280HN2F43I1VGAS

Intel

IC FPGA 688 I/O 1760FBGA

• Number of LABs/CLBs: 350000
• Number of Logic Elements/Cells: 2800000
• Total RAM Bits: -
• Number of I/O: 688
• Number of Gates: -
• Voltage - Supply: 0.77V ~ 0.97V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FBGA (42.5x42.5)

package: -

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