Winbond's latest LPDDR4/4X products are packaged in a space-saving 100BGA package, measuring only 7.5X10mm2. The product can significantly reduce PCB size for a more compact design for IoT applications that require higher data throughput in a small package.
Winbond currently provides LPDDR4/4X memory with capacities of 1Gb and 2Gb, with data transfer rates up to 4267Mbps. In addition, Winbond also offers a product portfolio of 2Gb single-chip package (SDP) and 4Gb dual-chip package (DDP). Compared with DDR4 x16 3200Mbps, the data transfer rate of Winbond LPDDR4 1CH x16 4267Mbps has been greatly improved, and the performance is more excellent, which is of great significance for consumer applications.
Winbond also guarantees a continuous and stable supply of LPDDR4/4X for at least the next ten years, which will greatly benefit automotive and industrial applications with long design cycles.
Winbond said: "Winbond has been deeply involved in the memory product market for many years, and Winbond has always paid close attention to customer needs and the development trend of new technologies. The launch of the new package 100BGA marks that Winbond has successfully developed the next generation of LPDDR4/4X, which can meet the needs of emerging IoT, Consumer Electronics, Industrial and Automotive Applications".
