Vishay Intertechnology, Inc. announced that it has launched a new series of leadless NTC thermistor bare chip --- NTCC201E4, with upper and lower surface contact, providing designers with a variety of installation options. Vishay BCcomponents NTCC201E4 uses a silver metal solder layer, supports aluminum wire bonding, can be vacuum reflowed or formic acid/forming gas reflow, SAC or SMP soldering, and nano-silver paste sintering.
The devices announced today operate from -55 °C to +175 °C and are AEC-Q200 qualified for temperature sensing, control and compensation in automotive and alternative energy applications. End products include IGBT modules, power MOSFET modules, power inverters for electric vehicles (EV) and hybrid electric vehicles (HEV), solar panels and wind turbines.
The metal layer of NTCC201E4 thermistor is divided into upper and lower layers. The outer layer has excellent resistance to solder leaching compared to previous generation devices, especially when using high melting point solders up to +360 C. The inner layer is resistant to formic acid attack of the circuit board when using preformed solder and H2/N2 forming gas.
Thermistors are RoHS and Vishay Green compliant, halogen free, 4.7 kΩ to 20 kΩ at +25 °C (R25), tolerances down to ± 1 %, beta (B25/85) 3435 K to 3865 K , the tolerance is only ± 1 %. The device consumes a maximum power consumption of 50 mW, has a response time of 3 seconds, and is packaged in PS bubble tape.
