The next generation wireless MCU supports the new Bluetooth 5.3 LE specification | Heisener Electronics
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The next generation wireless MCU supports the new Bluetooth 5.3 LE specification

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Post-datum: 2022-03-07, Renesas Electronics America

   Renesas Electronics is developing a new MCU that will be part of the 32-bit Arm Cortex-M microcontroller family, joining the RA4W1 Bluetooth 5.0 LE device released last year. It also supports the recently released Bluetooth 5.3 low power consumption.

     The new Bluetooth 5.3 specification includes some important features, such as allowing the receiver to filter out messages without involving the host stack, thus improving the receiver's workload cycle. It also allows peripheral devices to provide preferred channels to central devices to improve throughput and reliability.

     In addition, it adds sub-rated connections to increase the switching time between low duty cycle connections and high duty cycle connections for applications that do not often need to switch to burst traffic. In addition to these features, direction finding introduced in Bluetooth 5.1 and synchronization channels for stereo audio transmission added in Bluetooth 5.2 will be supported in the company's new MCU. The inclusion of SDR capabilities will enable customers to migrate to a new version of the specification at a later date.

     Roger Wendelken, Senior vice president, Internet of Things and Infrastructure at Renesas said:"We are committed to providing the best performance, ease of use and the latest features on the market,"  "By providing early, strong support for the Bluetooth 5.3 LE specification, we are enabling our RA customers to be the first to bring the next generation to market."

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