THGBMFG6C1LBAIL Introduction
The THGBMFG6C1LBAIL is an 8GB e-MMC module housed in a compact 153-ball BGA package. It features Toshiba NAND flash and a controller chip integrated into a Multi-Chip Module (MCM), ensuring high reliability and performance. With its industry-standard MMC protocol, this module offers easy integration and is ideal for applications in mobile devices, automotive electronics, and industrial systems, providing fast data transfer, low power consumption, and robust endurance.
THGBMFG6C1LBAIL Working Principle
The THGBMFG6C1LBAIL operates based on the MMC protocol and exchanges data with the host device via standard interfaces. When powered on, the controller chip manages the communication with the NAND flash memory and performs read/write operations through the data bus. The controller inside the storage module handles requests from the host system and stores the data in the NAND flash memory, supporting high-speed data transfer and stable storage performance.
In terms of circuit design, the THGBMFG6C1LBAIL connects to the host system through multiple pins, including power, ground, and data input/output pins. Data exchange occurs via SPI or parallel mode, ensuring efficient read and write operations. The flash memory stores data in its internal storage cells, providing quick access as needed. The controller chip coordinates the timing of the read/write operations, ensuring correct data transmission and storage, thus preventing data loss or corruption.
THGBMFG6C1LBAIL Pin Connection
THGBMFG6C1LBAIL Specification
| Specification | Details |
| Product Type | eMMC (Embedded MultiMediaCard) Module |
| Storage Capacity | 8GB |
| Package Type | 153-FBGA |
| Protocol | MMC (MultiMediaCard) |
| Flash Type | Toshiba NAND Flash |
| Data Bus Interface | SPI or Parallel Mode |
| Operating Voltage | 2.7V ~ 3.6V |
| Data Transfer Speed | High-speed read and write operations |
| Operating Temperature Range | -25°C ~ 85°C |
| Form Factor | BGA (Ball Grid Array) |
| Package Dimensions | 12mm x 16mm |
| MTBF (Mean Time Between Failures) | > 1,000,000 hours |
| Data Retention | > 10 years |
| Compliance | RoHS Compliant |
THGBMFG6C1LBAIL Features
THGBMFG6C1LBAIL has the JEDEC/MMCA Version 5.1 interface with 1-I/O, 4-I/O and 8-I/O mode. (*) MMCA
Version 5.1 is under discussion in JEDEC.
RoHS Compliant
Reliable Data Retention
Advanced NAND Flash Technology
Integrated Controller Chip
THGBMFG6C1LBAIL Applications
Mobile Devices
Embedded Systems
Consumer Electronics
IoT (Internet of Things) Devices
Industrial Applications
Automotive Systems
Security Systems
Digital Signage
Networking Equipment
Data Loggers
THGBMFG6C1LBAIL Package
The THGBMFG6C1LBAIL uses a 153-FBGA (Fine Ball Grid Array) package with dimensions of 11.5 x 13 mm, offering a compact design widely used in applications requiring high-density connections and limited space. This package type is ideal for devices that demand high-speed data transfer and large storage capabilities. It features 153 ball grid pads inside the package, providing a high-density electrical connection that ensures reliable signal transmission and stable power management.
Key specifications of this package include:
- Package Type: 153-FBGA
- Package Size: 11.5 x 13 mm
- Ball Pitch: 0.8 mm
- Number of Ball Pads: 153
THGBMFG6C1LBAIL Manufacturer
The THGBMFG6C1LBAIL is manufactured by Kioxia America, Inc., a leading global provider of storage solutions, specializing in innovative flash memory technologies and products. As the successor to Toshiba Memory, Kioxia has a rich technical foundation and extensive experience in NAND flash technology and memory products. Its products are widely used in smartphones, personal computers, servers, and various consumer electronic devices, earning global trust for their outstanding performance and reliability.
How to Use THGBMFG6C1LBAIL?
1. Hardware Connection: Solder the THGBMFG6C1LBAIL onto the PCB, ensuring that the ball pads of the 153-FBGA package are aligned with the PCB solder pads to avoid cold solder joints or short circuits.
2. Power and Signal Configuration: Provide a 3.3V (VCC) and 1.8V (VCCQ) power supply for the module. Connect the data lines (D0-D7), command line (CMD), and clock line (CLK), ensuring compatibility with the main control device interface.
3. Software Driver and Initialization: Load the e-MMC driver, send initialization commands, and ensure the module enters the ready state. Allocate logical storage blocks for data management.
4. Data Read/Write Operations: Use the MMC protocol for data transmission between the host and e-MMC. The controller manages read/write requests, ensuring data integrity and enabling error correction (ECC).
5. Monitoring and Maintenance: Regularly check voltage, temperature, and data integrity. If the module supports health status reports, monitor wear leveling, and update the firmware and driver as needed.
FAQs
What is THGBMFG6C1LBAIL?
THGBMFG6C1LBAIL is an 8GB e-MMC (embedded MultiMediaCard) module with a 153-FBGA package. It uses advanced Toshiba NAND flash memory and a controller chip, designed for high-density storage applications.
What kind of applications can THGBMFG6C1LBAIL be used in?
It is ideal for applications that require high-density, high-performance storage, such as in smartphones, personal computers, embedded systems, and industrial devices.
Is it necessary to update firmware or drivers for THGBMFG6C1LBAIL?
Yes, to maintain optimal performance, it’s recommended to periodically check for firmware updates and keep the driver software up to date for compatibility and security.
