Samsung's "Exynos 2400" chip is expected to be released next year and will once again be installed on Samsung's smartphone Galaxy, according to EDN Electronic Technology design cited by Korean media. The Korean media said that the "Exynos 2400" will be based on the newly introduced cutting-edge chip technology to achieve tremendous changes. Samsung's "Exynos 2400" chip is expected to be released next year and will once again be installed on Samsung's smartphone Galaxy, according to EDN Electronic Technology design cited by Korean media. The Korean media said that the "Exynos 2400" will be based on the newly introduced cutting-edge chip technology to achieve tremendous changes.
Herald Corp says a TrendForce report suggests that Samsung's Galaxy S24 series will be equipped with the Exynos 2400, an SoC with a 4-core GPU. Gpus are likely to be based on AMD's architecture, as Samsung and processor makers recently renewed their licensing agreements.Last year, the semiconductor industry continued to raise concerns over Samsung's 4 nm yield. In response, Samsung explained at the Samsung Foundry Forum 2022 held in October last year, "Initially, there were concerns about the yield, such as 4 nanometers, but we have improved (the yield) to the level of existing front-end nodes. "
The biggest improvement to the Exynos 2400 is said to be mass production based on Samsung's 4nm LPP process. According to TrendForce, the LPP is an energy efficient node that is also optimized for performance. This manufacturing process was considered superior to Samsung's earlier 4nm iterations, and the node product was evaluated as having more improvement features than Samsung's previously developed 4-nanometer LPE (Low Power Early) and LPI (Low Power Improv) products. Named after the new node Samsung introduced last year, it is a product corresponding to the SF4.
However, industry experts say that depending on whether the Galaxy S24 is equipped with the Exynos2400, it will be possible to gauge Samsung's technology development level. At a press conference held in September last year, Samsung Electronics President Gye-hyun Gye-hyun said, "(Samsung) is actively developing the 3-nanometer system, and the 4 and 5-nanometer system has improved the performance and cost compared to the past." "Around the end of next year (2023), the factory will look different."
In addition, the Exynos 2400 is likely to use fan-out wafer-level packaging (FOWLP) technology. Fan-out wafer-level packaging is an integrated circuit packaging technology that is an enhancement of standard wafer-level packaging solutions. In traditional technology, the wafer is first cut and the individual cores are then encapsulated; A single core is then encapsulated on a wafer. Package sizes are usually much larger than chip sizes.
Samsung may also want to return to its Exynos line of chipsets, as continuing to rely on Qualcomm would mean the latter could charge more for its third-generation Snapdragon 8, increasing the South Korean giant's component costs and eating into its smartphone margins. However, rumors continue to circulate about Samsung's earlier agreement with Qualcomm to form a new "multi-year" partnership between the two companies. As a result, Samsung is likely to stick with Qualcomm for a few years.
