OmniVision released the world's first product-level CIS/EVS integrated vision chip OV60B10 | Heisener Electronics
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OmniVision released the world's first product-level CIS/EVS integrated vision chip OV60B10

Technology Cover
Post-datum: 2022-08-11, OmniVision Technologies Inc

OmniVision recently released the world's first product-level CIS/EVS fusion vision chip OV60B10. Through the fusion of the two, the characteristics of the two types of sensors are integrated on one chip.

EVS (Event-Based Vision Sensors) is a new bio-inspired vision sensor with event-based vision, enabling high dynamic range, maintaining high speed, low latency, and no motion blur, while meeting the requirements of low data rates and low power consumption. technical characteristics. Compared with the widely used CIS (CMOS Image Sensor), the output of the event camera is continuous in space and time, its response speed is not limited by the traditional exposure time and frame rate, and it can detect ultra-high-speed motion as fast as a bullet , while using a CIS camera needs to be captured at a rate of thousands or tens of thousands of frames per second; it is not affected by uniform imaging parameters such as white balance, sensitivity, exposure time, etc. , it is still possible to trigger events to obtain visual information.

Technical Highlights

1. 3D Stack process

The OV60B10 chip is manufactured using a 3D Stack process, which integrates CIS, EVS, ISP/ESP three-layer wafers into a state with the best performance and the smallest volume. High-density pixel-level connection between wafers is achieved through hybrid bonding technology. Since the detector part and the circuit part are independent of each other, the process can optimize the processing technology and minimize the size of the pixel unit.

2. Pixel-level sensor fusion

The OV60B10 chip can share the focal plane through two sensors, and has multiple signal interactions, so as to achieve high-precision matching in time and space, work together, and output in parallel (it can also be configured through software to work independently).

Through pixel-level sensor fusion technology, the advantages of the two sensors are maximized, and the redundant information and complementary information in the image are fully utilized to generate an image that meets the needs of specific applications. A more accurate, comprehensive, and reliable description.

3. The world's leading EVS technology

The OV60B10 chip adopts the unique in-pixel timestamp and related high-speed readout technology of OmniVision Group. Compared with the existing timestamping-during-readout method in the industry, it can greatly improve the time scale accuracy of EVS and reduce the time scale jitter (jitter). ). The OV60B10 also innovates a series of technologies such as noise control, multi-channel readout, event encoding and dynamic bandwidth.

The more frames per second, the smoother the motion displayed on the screen. Through the exclusive EVS technology, after the OV60B10 reconstructs the original frame rate of only 120FPS, the frame rate can reach 10000FPS. The terminal can use this sensor to use less data, less calculation and lower hardware. Cost to capture high-speed images.

4. Excellent CIS imaging performance

The OV60B10 chip also uses the industry-leading CIS platform, which has the advantages of both high resolution (15 million pixels) and large pixels (2.2um).

To sum up, the OV60B10 chip enables the event camera with the characteristics of efficiently capturing scene changes, low latency, and low data volume, and the high-resolution and large-pixel CIS to show their advantages, suitable for ultra-high-speed image reconstruction, high dynamic range Imaging, ADAS, smart cockpit, eye tracking, object tracking, SLAM and other scenarios allow users to flexibly respond to shooting needs in different fields such as mobile phones, cars, AR/VR, etc.

     

     

     

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