Parker Hannifin's Chomerics division has introduced its next generation thermal gap PAD, therM-A-GAPTM PAD 30 and 60, for all heat transfer applications between electronic components and radiators.
For higher performance applications, therM-A-Gap PAD 60 offers an attractive combination of 6W/ M-K excellent thermal conductivity while being 40% softer than the company's existing high-performance hot GAP PAD products. With reliable thermal performance of 3.2W/ M-K, the cost-effective TherM-A-GAP PAD 30 conforms to rough surface irregularities and air gaps on heating components.
Unique formulations ensure complete consistency (with low clamping force) and minimal gas release, thus providing an effective thermal interface where uneven surface irregularities, air gaps or rough textures dominate. These products are well suited for the general industrial, life sciences and consumer markets.
"The design and use of thermal gap fillers will continue to address price-sensitive markets, as well as those requiring high-performance materials," said Brian Mahoney, Thermal Business Unit manager, Chomerics division. "We are excited to expand our already impressive family of thermal gap padding with the next generation of products."
These products are also very effective in damping vibration. Typical applications range from automotive electronics and lighting leds, telecommunications equipment, to power conversion systems, consumer electronics, servers, desktops/laptops, handheld devices, and memory modules.
