The new AURIX™ TC4x:
High-reliability electronics power automotive innovation
Carbon neutrality, automation, comprehensive interconnection, and cybersecurity have become the core keywords of future mobility, and microelectronics are the core force of the above-mentioned changes. Infineon's next-generation 32-bit microcontroller family (MCU) - AURIX™ TC4x, drives the development of electric and electric vehicles, advanced driver assistance systems (ADAS), automotive electrical and electronic (E/E) architectures and more affordable artificial intelligence applications develop. In addition, the scalable family concept of this product family supports a common software architecture, resulting in significant savings in platform software costs.
With a scalable family concept, AURIX is a key device for reliable electronics and software-based applications. The new generation of AURIX TC4x series supports electric vehicles and autonomous driving applications, it has stronger connectivity, and improves information security and functional safety. In addition, its latest SOTA (software over-the-air) capabilities help automakers achieve fast, secure car-to-cloud connectivity, support field updates, and perform diagnostics and analysis while the vehicle is in use.
Next-generation OptiMOS™ MOSFETs:
Efficient, easy-to-use solutions for power system design
When designing power systems, high power density, optimized performance, and ease of use are key requirements. Infineon has introduced a new generation of OptiMOS™ Source-Down (SD) power MOSFETs. The product is packaged in a PQFN 3.3 x 3.3 mm2 and supports a voltage range from 25V to 100V. This package sets a new standard for power MOSFET performance with higher efficiency, higher power density, excellent thermal management and a low bill of materials (BOM). Applications for this product include motor drives, switching power supplies and OR-ing for servers and telecommunications, and battery management systems.
Compared to standard Drain-Down, the latest Source-Down packaging technology can accommodate larger silicon chips in the same package while reducing packaging constraints on overall performance. It enables up to 30% reduction in RDS(on) compared to state-of-the-art Drain-Down packages. At the system level, the new packaging technology has reduced the form factor, moving from the original 2SuperSO8 size of 5 x 6 mm2 to the PQFN2 package of 3.3 x 3.3 mm2, reducing the space by about 65%, resulting in more efficient use of space and improved termination. System power density and system efficiency.
AIROC™ SoC:
The best combination of low power consumption and high performance
How to make the Bluetooth system applied to the Internet of Things more energy-efficient and efficient is one of the focuses of the Internet of Things industry. Infineon's AIROC™ CYW20829 Bluetooth® LE system-on-chip (SoC) is designed to address this challenge. The chip is a device that complies with the Bluetooth 5.3 core specification and can support home automation, sensors, lighting, Bluetooth Mesh, remote control and other Bluetooth connections, and can be widely used in the Internet of Things, smart home and industrial fields.
Infineon's AIROC CYW20829 Bluetooth LE SoC helps designers combine low power consumption with high performance. The chip features an efficient peripheral design, low-leakage silicon with scalable and efficient MIPS, and a low-power Bluetooth radio. The AIROC™ CYW20829 Bluetooth® LE SoC enables reliable, robust connectivity and better RF performance for a better user experience in the next generation of smart connected devices.
