ERNI – Three-row 25Gbs board-to-board connector deals with more data throughput | Heisener Electronics
Contacteer ons
SalesDept@heisener.com +86-755-83210559 ext. 813
Language Translation

* Please refer to the English Version as our Official Version.

ERNI – Three-row 25Gbs board-to-board connector deals with more data throughput

Technology Cover
Post-datum: 2015-05-26
ERNI, a leading connector and value-added service provider, has expanded its 1mm pitch MicroSpeed ??high-speed connector system to include a new three-row version. The MicroSpeed ??connector system has a SMT terminal that provides high contact density and a maximum speed of 25Gbps. The open pin design allows the third row (center), which can optionally be used as ground to optimize the signal quality of high-speed signal conductors or between rows. MicroSpeed ??connectors' open pin structure can accommodate differential or single-ended signals while maintaining the highest performance speeds. MicroSpeed ??straight (180 degree) connectors are ideal for board-to-board connections (sandwich) or board connections via flexible PCBs. The initial board-to-board distance was 5mm (male 1mm, female 4mm). Considering the 1.5mm long wipe length, an effective pitch of up to 6.5mm can be achieved. The new connectors are well-suited for next-generation communication standards, such as Ethernet 100Gbps (IEEE 802.3ba), Optical Internetwork Forum (OIF), PCIe, and USB 3.1. Typical applications that benefit from connectors are data communications and telecommunications, high-end computing, medical technology or industrial automation with high-speed transmission and high data volumes. "With the latest MicroSpeed ??variant, ERNI can meet customers' requirements for higher data throughput without affecting electrical performance or shielding. Improvements in shielding design have further reduced inductive coupling, while open pin arrays "It provides maximum flexibility in isolating low- and high-speed signal requirements," said Kevin N. Oursler, director of US sales and marketing. The frame design of the three-row MicroSpeed ??high-speed connector system has a polarized mating surface and automatic centering during connector placement, a 1.5mm wipe length, and a sturdy blind-mate design that provides safe and reliable use for industrial needs. The unique contact design has sufficient mismatch margin to provide system-integrated safety measures. Its longitudinal misalignment tolerance is +/- 0.7mm and the angular misalignment tolerance is up to 4 degrees. In addition, the dual beam female contact design provides high tolerance compensation and reliable reliability throughout the life of the product. The signal pin rows in the board-to-board configuration are shielded at the periphery of the connector body and can be optimized for high-impedance signal transmission. Impedance-matched (50 / 100ohm) connectors are rated over the temperature range of -55C to + 125C. The SMT coplanarity is completely guaranteed, and the SMT coplanarity of all contacts is specified as less than 0.1mm. 1.0mm vertical spacing and 1.5mm line spacing allow horizontal and vertical alignment of differential pairs or single-ended signals based on crosstalk applications and / or requirements. The best crosstalk behavior can be achieved through special layout configurations-ERNI provides support in the form of field test recommendations. MicroSpeed ??connectors are capable of 500+ mating cycles and are compatible with the extended temperature range of -55C to + 125C. The current carrying capacity of the signal contact is 1A, and the current carrying capacity of the shielding layer is 10A. The company says the connector is available in 75 and 192 pins (3 x 25 and 3 x 64) and other pin numbers are available on request.