Pagina 176 - Nieuwe Technologieën | Heisener Electronics
Contacteer ons
SalesDept@heisener.com +86-755-83210559-836
Language Translation

* Please refer to the English Version as our Official Version.

Nieuwe Technologieën

Archief 4.647
Pagina  176/259
Technology Cover

2019-04-06, Texas Instruments - BAW technology shrinks BOM and improves network performance

Texas Instruments offers new BAW-based embedded processing and analog chips for the next generation of connectivity and communications infrastructure.

Technology Cover

2019-04-06, Bourns - New family of P-TCO devices to protect USB-C cables

Bourns has introduced a new family of Polymeric Thermal Cutoff (P-TCO) devices created to protect USB-C cables from destructive and potentially dangerous thermal runaway events.

Technology Cover

2019-04-04, Texas Instruments - Smart high-side switches for 12V automotive system usage

Texas Instruments TPS1HA08-Q1 Smart High-side Switches provide robust protection and diagnostic features designed for use with 12V automotive systems.

Technology Cover

2019-04-04, Diodes Incorporated - Bipolar transistors enable higher power density

The Diodes Incorporated family of NPN and PNP power bipolar transistors supplied in a small form factor (3.3mm x 3.3mm), provide increased power density for applications demanding up to 100V and 3A.

Technology Cover

2019-04-04, ON Semiconductor - Out-of-the-box sensor development kit for power-optimised IoT applications

ON Semiconductor has introduced the RSL10 Sensor Development Kit, designed to give engineering teams a comprehensive platform for creating IoT applications with cutting-edge smart sensor technology, and enabled by what is claimed to be the industry’s lowest power Bluetooth Low Energy radio.

Technology Cover

2019-04-04, Analog Devices - Audio bus and processor technologies improve energy efficiency and infotainment experience

Analog Devices has announced that BYD Co., Ltd has chosen the company’s A2B and SHARC DSP to build more energy efficient and eco-friendly vehicle platforms while improving the immersive audio entertainment encounter for drivers.

Technology Cover

2019-04-04, TDK - Low loss DIN rail redundancy module has load sharing balance indication

TDK Corporation has introduced the DRM40 series of DIN rail mount redundancy modules. Two 10V to 30VDC inputs are each rated at 20A and the output at 40A. A 150% peak load ability for four seconds is offered for capacitive and inductive loading.

Technology Cover

2019-02-22, Murata - Narrow-band IoT module stretches battery life in a small size

Murata has released what it believes to be the world’s smallest narrow-band IoT cellular wireless module. The device measures just 15.6mm x 14mm x 2.2mm and is manufactured on a PCB with a metal casing, and is intended for use in compact, battery-powered IoT/IIoT applications.

Technology Cover

2019-02-22, Vishay Intertechnology - Add heart rate monitoring capability to any type of consumer electronics device

Vishay Intertechnology can help manufacturers add a heart rate monitoring capability to any type of consumer electronic device.

Technology Cover

2019-02-22, Microchip - Technology simplifies automotive infotainment networking

Microchip has announced what is claimed to be the industry’s most efficient automotive infotainment networking solution. The solution supports all data types, including video, audio, control and Ethernet, over a single cable.

Technology Cover

2019-02-22, Renesas Electronics - System-level EV and power management expertise boosts performance for racing team

Renesas Electronics has announced it is expanding its strategic technology partnership with Mahindra & Mahindra, Ltd and Mahindra Racing competing in the ABB FIA Formula E Championship, for the 2018-19 season.

Technology Cover

2019-02-22, ROHM – New SiC power module achieves high level of reliability in extreme environments

ROHM has developed a 1700V/250A rated SiC power module that gives what is claimed to be the industry’s highest level of reliability optimised for inverter and converter applications including outdoor power generation systems and industrial high power supplies.

Technology Cover

2019-02-22, Texas Instruments - Current-shunt monitors accurate current measurements in the microamp range (INA190)

Texas Instruments INA190 Current-Shunt Monitors give overcurrent protection, precision current measurement for system optimisation, or in closed-loop feedback circuits.

Technology Cover

2019-02-22, ON Semiconductor – Intelligent power modules provide space and power saving

ON Semiconductor has a new Automotive Intelligent Power Modules (IPMs) that provides class-leading power density and improve overall performance in on-board charging and other high-voltage DC-DC conversion applications for EVs and plug-in PHEVs.

Technology Cover

2019-02-09, TDK - Series of rugged AC filter capacitors extended

TDK Corporation has expanded its EPCOS B32754* to B32758* series of AC filter capacitors.

Technology Cover

2019-02-09, Analog Devices - Demo board provides high efficiency, high-density power management IC development tool (DC2268A-G)

The Analog Devices DC2268A-G Demonstration Board is a high efficiency, high-density power management IC development tool.

Technology Cover

2019-02-09, Texas Instruments - Amplifier EVM highlights digital input closed-loop automotive Class-D audio amplifier (TAS5720A-Q1EVM)

Texas Instruments TAS5720A-Q1EVM Amplifier EVM highlights the TAS5720A-Q1 digital input closed-loop automotive Class-D audio amplifier.

Technology Cover

2019-02-09, ON Semiconductor - CE certification for Sigfox verified RF SiP solution

ON Semiconductor has achieved CE certification for its AX-SIP-SFEU SiP solution, meaning the device conforms to health, safety and environmental protection standards for products sold within the European Economic Area.