Xilinx Inc. Producten

XCZU19EG-3FFVD1760E

Xilinx Inc.

IC FPGA 308 I/O 1760FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 1143K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FCBGA (42.5x42.5)

package: 1760-BBGA, FCBGA

XC2V2000-5FG676I

Xilinx Inc.

IC FPGA 456 I/O 676FBGA

• Number of LABs/CLBs: 2688
• Number of Logic Elements/Cells: -
• Total RAM Bits: 1032192
• Number of I/O: 456
• Number of Gates: 2000000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

package: 676-BBGA, FCBGA

XC5VFX70T-1FF1136CES

Xilinx Inc.

IC FPGA 640 I/O 1136FCBGA

• Number of LABs/CLBs: 5600
• Number of Logic Elements/Cells: 71680
• Total RAM Bits: 5455872
• Number of I/O: 640
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1136-BBGA, FCBGA
• Supplier Device Package: 1136-FCBGA (35x35)

package: 1136-BBGA, FCBGA

XC2V1000-5FGG456C

Xilinx Inc.

IC FPGA 324 I/O 456FBGA

• Number of LABs/CLBs: 1280
• Number of Logic Elements/Cells: -
• Total RAM Bits: 737280
• Number of I/O: 324
• Number of Gates: 1000000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 456-BBGA
• Supplier Device Package: 456-FBGA (23x23)

package: 456-BBGA

XCS20XL-4TQG144I

Xilinx Inc.

IC FPGA 113 I/O 144TQFP

• Number of LABs/CLBs: 400
• Number of Logic Elements/Cells: 950
• Total RAM Bits: 12800
• Number of I/O: 113
• Number of Gates: 20000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

package: 144-LQFP

XC4VLX200-11FFG1513I

Xilinx Inc.

IC FPGA 960 I/O 1513FCBGA

• Number of LABs/CLBs: 22272
• Number of Logic Elements/Cells: 200448
• Total RAM Bits: 6193152
• Number of I/O: 960
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1513-BBGA, FCBGA
• Supplier Device Package: 1513-FCBGA (40x40)

package: 1513-BBGA, FCBGA

XC6VSX475T-1FF1759I

Xilinx Inc.

IC FPGA 840 I/O 1759FCBGA

• Number of LABs/CLBs: 37200
• Number of Logic Elements/Cells: 476160
• Total RAM Bits: 39223296
• Number of I/O: 840
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1759-FCBGA (42.5x42.5)

package: 1760-BBGA, FCBGA

XC6VSX475T-1FF1156C

Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

• Number of LABs/CLBs: 37200
• Number of Logic Elements/Cells: 476160
• Total RAM Bits: 39223296
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

package: 1156-BBGA, FCBGA

XC4VLX160-12FFG1148C

Xilinx Inc.

IC FPGA 768 I/O 1148FCBGA

• Number of LABs/CLBs: 16896
• Number of Logic Elements/Cells: 152064
• Total RAM Bits: 5308416
• Number of I/O: 768
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1148-BBGA, FCBGA
• Supplier Device Package: 1148-FCPBGA (35x35)

package: 1148-BBGA, FCBGA

XC7VX485T-2FFG1927C

Xilinx Inc.

IC FPGA 600 I/O 1927FCBGA

• Number of LABs/CLBs: 37950
• Number of Logic Elements/Cells: 485760
• Total RAM Bits: 37969920
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1924-BBGA, FCBGA
• Supplier Device Package: 1927-FCBGA (45x45)

package: 1924-BBGA, FCBGA

XC6VHX255T-1FFG1923I

Xilinx Inc.

IC FPGA 480 I/O 1923FCBGA

• Number of LABs/CLBs: 19800
• Number of Logic Elements/Cells: 253440
• Total RAM Bits: 19021824
• Number of I/O: 480
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1924-BBGA, FCBGA
• Supplier Device Package: 1924-FCBGA (45x45)

package: 1924-BBGA, FCBGA

XC4VLX160-10FFG1513C

Xilinx Inc.

IC FPGA 960 I/O 1513FCBGA

• Number of LABs/CLBs: 16896
• Number of Logic Elements/Cells: 152064
• Total RAM Bits: 5308416
• Number of I/O: 960
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1513-BBGA, FCBGA
• Supplier Device Package: 1513-FCBGA (40x40)

package: 1513-BBGA, FCBGA

XC5VLX110-2FFV1153I

Xilinx Inc.

IC FPGA 800 I/O 1153FCBGA

• Number of LABs/CLBs: 8640
• Number of Logic Elements/Cells: 110592
• Total RAM Bits: 4718592
• Number of I/O: 800
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1153-BBGA, FCBGA
• Supplier Device Package: 1153-FCBGA (35x35)

package: 1153-BBGA, FCBGA

XC6VLX240T-2FFG784C

Xilinx Inc.

IC FPGA 400 I/O 784FCBGA

• Number of LABs/CLBs: 18840
• Number of Logic Elements/Cells: 241152
• Total RAM Bits: 15335424
• Number of I/O: 400
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 784-BBGA, FCBGA
• Supplier Device Package: 784-FCBGA (29x29)

package: 784-BBGA, FCBGA

XCKU035-1FBVA900I

Xilinx Inc.

IC FPGA 468 I/O 900FCBGA

• Number of LABs/CLBs: 25391
• Number of Logic Elements/Cells: 444343
• Total RAM Bits: 19456000
• Number of I/O: 468
• Number of Gates: -
• Voltage - Supply: 0.922 V ~ 0.979 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 900-BBGA, FCBGA
• Supplier Device Package: 900-FCBGA (31x31)

package: 900-BBGA, FCBGA

XC5VLX50-1FFG324I

Xilinx Inc.

IC FPGA 220 I/O 324FBGA

• Number of LABs/CLBs: 3600
• Number of Logic Elements/Cells: 46080
• Total RAM Bits: 1769472
• Number of I/O: 220
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 324-BBGA, FCBGA
• Supplier Device Package: 324-FCBGA (19x19)

package: 324-BBGA, FCBGA

XC7K160T-2FBG676I

Xilinx Inc.

IC FPGA 400 I/O 676FCBGA

• Number of LABs/CLBs: 12675
• Number of Logic Elements/Cells: 162240
• Total RAM Bits: 11980800
• Number of I/O: 400
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

package: 676-BBGA, FCBGA

XC6SLX100T-2FG484I

Xilinx Inc.

IC FPGA 296 I/O 484FBGA

• Number of LABs/CLBs: 7911
• Number of Logic Elements/Cells: 101261
• Total RAM Bits: 4939776
• Number of I/O: 296
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

package: 484-BBGA

XC2VP2-6FG256I

Xilinx Inc.

IC FPGA 140 I/O 256FGBGA

• Number of LABs/CLBs: 352
• Number of Logic Elements/Cells: 3168
• Total RAM Bits: 221184
• Number of I/O: 140
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 256-BGA
• Supplier Device Package: 256-FBGA (17x17)

package: 256-BGA

XC6SLX75-L1CSG484I

Xilinx Inc.

IC FPGA 328 I/O 484CSBGA

• Number of LABs/CLBs: 5831
• Number of Logic Elements/Cells: 74637
• Total RAM Bits: 3170304
• Number of I/O: 328
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-FBGA, CSPBGA
• Supplier Device Package: 484-CSPBGA (19x19)

package: 484-FBGA, CSPBGA

XC3S2000-5FG456C

Xilinx Inc.

IC FPGA 333 I/O 456FBGA

• Number of LABs/CLBs: 5120
• Number of Logic Elements/Cells: 46080
• Total RAM Bits: 737280
• Number of I/O: 333
• Number of Gates: 2000000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 456-BBGA
• Supplier Device Package: 456-FBGA (23x23)

package: 456-BBGA

XC6SLX9-L1CSG324C

Xilinx Inc.

IC FPGA 200 I/O 324CSBGA

• Number of LABs/CLBs: 715
• Number of Logic Elements/Cells: 9152
• Total RAM Bits: 589824
• Number of I/O: 200
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 324-LFBGA, CSPBGA
• Supplier Device Package: 324-CSPBGA (15x15)

package: 324-LFBGA, CSPBGA

XC2S50-6PQ208C

Xilinx Inc.

IC FPGA 140 I/O 208QFP

• Number of LABs/CLBs: 384
• Number of Logic Elements/Cells: 1728
• Total RAM Bits: 32768
• Number of I/O: 140
• Number of Gates: 50000
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

package: 208-BFQFP

XC3S1400AN-5FGG676C

Xilinx Inc.

IC FPGA 502 I/O 676FBGA

• Number of LABs/CLBs: 2816
• Number of Logic Elements/Cells: 25344
• Total RAM Bits: 589824
• Number of I/O: 502
• Number of Gates: 1400000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BGA
• Supplier Device Package: 676-FBGA (27x27)

package: 676-BGA

XC6SLX16-2CSG324C

Xilinx Inc.

IC FPGA 232 I/O 324CSBGA

• Number of LABs/CLBs: 1139
• Number of Logic Elements/Cells: 14579
• Total RAM Bits: 589824
• Number of I/O: 232
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 324-LFBGA, CSPBGA
• Supplier Device Package: 324-CSPBGA (15x15)

package: 324-LFBGA, CSPBGA

XC9536-15VQG44C

Xilinx Inc.

IC CPLD 36MC 15NS 44VQFP

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 15.0ns
• Voltage Supply - Internal: 4.75 V ~ 5.25 V
• Number of Logic Elements/Blocks: 2
• Number of Macrocells: 36
• Number of Gates: 800
• Number of I/O: 34
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 44-TQFP
• Supplier Device Package: 44-VQFP (10x10)

package: 44-TQFP

XC95144-7PQ100C

Xilinx Inc.

IC CPLD 144MC 7.5NS 100QFP

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 7.5ns
• Voltage Supply - Internal: 4.75 V ~ 5.25 V
• Number of Logic Elements/Blocks: 8
• Number of Macrocells: 144
• Number of Gates: 3200
• Number of I/O: 81
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-BQFP
• Supplier Device Package: 100-PQFP (14x20)

package: 100-BQFP

XCKU5P-L1SFVB784I

Xilinx Inc.

XCKU5P-L1SFVB784I

• Number of LABs/CLBs: 27120
• Number of Logic Elements/Cells: 474600
• Total RAM Bits: 41984000
• Number of I/O: 304
• Number of Gates: -
• Voltage - Supply: 0.698 V ~ 0.876 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 784-BBGA, FCBGA
• Supplier Device Package: 784-FCBGA (23x23)

package: 784-BBGA, FCBGA