Xilinx Inc. Producten

XCMECH-FFG1152

Xilinx Inc.

FFG1152 MECHANICAL SAMPLE

• Type: Mechanical Sample
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

XCZU6CG-2FFVB1156I

Xilinx Inc.

XCZU6CG-2FFVB1156I

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 533MHz, 1.3GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 469K+ Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

package: 1156-BBGA, FCBGA

XCZU11EG-1FFVC1156E

Xilinx Inc.

IC FPGA 360 I/O 1156FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 653K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

package: 1156-BBGA, FCBGA

XC7Z030-1FFG676C

Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 676FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 667MHz
• Primary Attributes: Kintex?-7 FPGA, 125K Logic Cells
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

package: 676-BBGA, FCBGA

XC2V500-4FGG456I

Xilinx Inc.

IC FPGA 264 I/O 456FBGA

• Number of LABs/CLBs: 768
• Number of Logic Elements/Cells: -
• Total RAM Bits: 589824
• Number of I/O: 264
• Number of Gates: 500000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 456-BBGA
• Supplier Device Package: 456-FBGA (23x23)

package: 456-BBGA

XC2V40-6CSG144C

Xilinx Inc.

IC FPGA 88 I/O 144CSBGA

• Number of LABs/CLBs: 64
• Number of Logic Elements/Cells: -
• Total RAM Bits: 73728
• Number of I/O: 88
• Number of Gates: 40000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 144-TFBGA, CSPBGA
• Supplier Device Package: 144-LCSBGA (12x12)

package: 144-TFBGA, CSPBGA

XC5VFX30T-1FF665CES

Xilinx Inc.

IC FPGA 360 I/O 665FCBGA

• Number of LABs/CLBs: 2560
• Number of Logic Elements/Cells: 32768
• Total RAM Bits: 2506752
• Number of I/O: 360
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 665-BBGA, FCBGA
• Supplier Device Package: 665-FCBGA (27x27)

package: 665-BBGA, FCBGA

XCV800-6FG680C

Xilinx Inc.

IC FPGA 512 I/O 680FBGA

• Number of LABs/CLBs: 4704
• Number of Logic Elements/Cells: 21168
• Total RAM Bits: 114688
• Number of I/O: 512
• Number of Gates: 888439
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 680-LBGA Exposed Pad
• Supplier Device Package: 680-FTEBGA (40x40)

package: 680-LBGA Exposed Pad

XCV600E-7HQ240I

Xilinx Inc.

IC FPGA 158 I/O 240HQFP

• Number of LABs/CLBs: 3456
• Number of Logic Elements/Cells: 15552
• Total RAM Bits: 294912
• Number of I/O: 158
• Number of Gates: 985882
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 240-BFQFP Exposed Pad
• Supplier Device Package: 240-PQFP (32x32)

package: 240-BFQFP Exposed Pad

XCV50-5BG256C

Xilinx Inc.

IC FPGA 180 I/O 256BGA

• Number of LABs/CLBs: 384
• Number of Logic Elements/Cells: 1728
• Total RAM Bits: 32768
• Number of I/O: 180
• Number of Gates: 57906
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 256-BBGA
• Supplier Device Package: 256-PBGA (27x27)

package: 256-BBGA

XCV300-4FG456I

Xilinx Inc.

IC FPGA 312 I/O 456FBGA

• Number of LABs/CLBs: 1536
• Number of Logic Elements/Cells: 6912
• Total RAM Bits: 65536
• Number of I/O: 312
• Number of Gates: 322970
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 456-BBGA
• Supplier Device Package: 456-FBGA (23x23)

package: 456-BBGA

XC4020E-3HQ240I

Xilinx Inc.

IC FPGA 193 I/O 240HQFP

• Number of LABs/CLBs: 784
• Number of Logic Elements/Cells: 1862
• Total RAM Bits: 25088
• Number of I/O: 193
• Number of Gates: 20000
• Voltage - Supply: 4.5 V ~ 5.5 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 240-BFQFP Exposed Pad
• Supplier Device Package: 240-PQFP (32x32)

package: 240-BFQFP Exposed Pad

XCVU9P-1FLGC2104I

Xilinx Inc.

XCVU9P-1FLGC2104I

• Number of LABs/CLBs: 147780
• Number of Logic Elements/Cells: 2586150
• Total RAM Bits: 354201600
• Number of I/O: 416
• Number of Gates: -
• Voltage - Supply: 0.825 V ~ 0.876 V
• Mounting Type: -
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

package: -

XCKU5P-L1FFVA676I

Xilinx Inc.

IC FPGA 256 I/O 676FCBGA

• Number of LABs/CLBs: 27120
• Number of Logic Elements/Cells: 474600
• Total RAM Bits: 35737600
• Number of I/O: 256
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

package: 676-BBGA, FCBGA

XC5VLX50T-3FF1136C

Xilinx Inc.

IC FPGA 480 I/O 1136FCBGA

• Number of LABs/CLBs: 3600
• Number of Logic Elements/Cells: 46080
• Total RAM Bits: 2211840
• Number of I/O: 480
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1136-BBGA, FCBGA
• Supplier Device Package: 1136-FCBGA (35x35)

package: 1136-BBGA, FCBGA

XC6VCX130T-2FF484I

Xilinx Inc.

IC FPGA 240 I/O 484FCBGA

• Number of LABs/CLBs: 10000
• Number of Logic Elements/Cells: 128000
• Total RAM Bits: 9732096
• Number of I/O: 240
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BBGA, FCBGA
• Supplier Device Package: 484-FCBGA (23x23)

package: 484-BBGA, FCBGA

XC6VCX75T-1FF784I

Xilinx Inc.

IC FPGA 360 I/O 784FCBGA

• Number of LABs/CLBs: 5820
• Number of Logic Elements/Cells: 74496
• Total RAM Bits: 5750784
• Number of I/O: 360
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 784-BBGA, FCBGA
• Supplier Device Package: 784-FCBGA (29x29)

package: 784-BBGA, FCBGA

XC4VLX40-10FF668I

Xilinx Inc.

IC FPGA 448 I/O 668FCBGA

• Number of LABs/CLBs: 4608
• Number of Logic Elements/Cells: 41472
• Total RAM Bits: 1769472
• Number of I/O: 448
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 668-BBGA, FCBGA
• Supplier Device Package: 668-FCBGA (27x27)

package: 668-BBGA, FCBGA

XC2VP2-5FG456C

Xilinx Inc.

IC FPGA 156 I/O 456FBGA

• Number of LABs/CLBs: 352
• Number of Logic Elements/Cells: 3168
• Total RAM Bits: 221184
• Number of I/O: 156
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 456-BBGA
• Supplier Device Package: 456-FBGA (23x23)

package: 456-BBGA

XC7A50T-1CS324I

Xilinx Inc.

IC FPGA ARTIX7 210 I/O 324CSBGA

• Number of LABs/CLBs: 4075
• Number of Logic Elements/Cells: 52160
• Total RAM Bits: 2764800
• Number of I/O: 210
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 324-LFBGA, CSPBGA
• Supplier Device Package: 324-CSPBGA (15x15)

package: 324-LFBGA, CSPBGA

XC3S1000-4FGG320I

Xilinx Inc.

IC FPGA 221 I/O 320 FBGA

• Number of LABs/CLBs: 1920
• Number of Logic Elements/Cells: 17280
• Total RAM Bits: 442368
• Number of I/O: 221
• Number of Gates: 1000000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 320-BGA
• Supplier Device Package: 320-FBGA (19x19)

package: 320-BGA

XC6SLX45T-3CSG484C

Xilinx Inc.

IC FPGA 296 I/O 484CSBGA

• Number of LABs/CLBs: 3411
• Number of Logic Elements/Cells: 43661
• Total RAM Bits: 2138112
• Number of I/O: 296
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-FBGA, CSPBGA
• Supplier Device Package: 484-CSPBGA (19x19)

package: 484-FBGA, CSPBGA

XC3S500E-4PQG208C

Xilinx Inc.

IC FPGA 158 I/O 208QFP

• Number of LABs/CLBs: 1164
• Number of Logic Elements/Cells: 10476
• Total RAM Bits: 368640
• Number of I/O: 158
• Number of Gates: 500000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

package: 208-BFQFP

XC95216-15PQG160C

Xilinx Inc.

IC CPLD 216MC 15NS 160QFP

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 15.0ns
• Voltage Supply - Internal: 4.75 V ~ 5.25 V
• Number of Logic Elements/Blocks: 12
• Number of Macrocells: 216
• Number of Gates: 4800
• Number of I/O: 133
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 160-BQFP
• Supplier Device Package: 160-PQFP (28x28)

package: 160-BQFP

XC95108-20TQG100C

Xilinx Inc.

IC CPLD 108MC 20NS 100TQFP

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 20.0ns
• Voltage Supply - Internal: 4.75 V ~ 5.25 V
• Number of Logic Elements/Blocks: 6
• Number of Macrocells: 108
• Number of Gates: 2400
• Number of I/O: 81
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Supplier Device Package: 100-TQFP (14x14)

package: 100-LQFP

XC2C384-10FG324I

Xilinx Inc.

IC CPLD 384MC 9.2NS 324FBGA

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 9.2ns
• Voltage Supply - Internal: 1.7 V ~ 1.9 V
• Number of Logic Elements/Blocks: 24
• Number of Macrocells: 384
• Number of Gates: 9000
• Number of I/O: 240
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 324-BBGA
• Supplier Device Package: 324-FBGA (23x23)

package: 324-BBGA

XC2C32A-6VQ44C

Xilinx Inc.

IC CPLD 32MC 5.5NS 44VQFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 5.5ns
• Voltage Supply - Internal: 1.7 V ~ 1.9 V
• Number of Logic Elements/Blocks: 2
• Number of Macrocells: 32
• Number of Gates: 750
• Number of I/O: 33
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 44-TQFP
• Supplier Device Package: 44-VQFP (10x10)

package: 44-TQFP

XCVU160-H1FLGC2104E

Xilinx Inc.

IC FPGA VIRTEX-U 2104FCBGA

• Number of LABs/CLBs: 115800
• Number of Logic Elements/Cells: 2026500
• Total RAM Bits: 130969600
• Number of I/O: 416
• Number of Gates: -
• Voltage - Supply: 0.922 V ~ 1.030 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2104-BBGA, FCBGA
• Supplier Device Package: 2104-FCBGA (47.5x47.5)

package: 2104-BBGA, FCBGA