Xilinx Inc. Producten

XCMECH-FF1136

Xilinx Inc.

FF1136 MECHANICAL SAMPLE

• Type: Mechanical Sample
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

XC17S20XLPD8I

Xilinx Inc.

IC PROM PROG I-TEMP 3.3V 8-DIP

• Programmable Type: OTP
• Memory Size: 200kb
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-PDIP

package: 8-DIP (0.300", 7.62mm)

XCZU11EG-L2FFVF1517E

Xilinx Inc.

IC FPGA 464 I/O 1517FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 653K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

package: 1517-BBGA, FCBGA

XCZU4EG-1FBVB900I

Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 900-BBGA, FCBGA
• Supplier Device Package: 900-FCBGA (31x31)

package: 900-BBGA, FCBGA

XCZU4CG-L2SFVC784E

Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 533MHz, 1.3GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 784-BBGA, FCBGA
• Supplier Device Package: 784-FCBGA (23x23)

package: 784-BBGA, FCBGA

XCV300E-8PQ240C

Xilinx Inc.

IC FPGA 158 I/O 240QFP

• Number of LABs/CLBs: 1536
• Number of Logic Elements/Cells: 6912
• Total RAM Bits: 131072
• Number of I/O: 158
• Number of Gates: 411955
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 240-BFQFP
• Supplier Device Package: 240-PQFP (32x32)

package: 240-BFQFP

XCV100E-6CS144C

Xilinx Inc.

IC FPGA 94 I/O 144CSBGA

• Number of LABs/CLBs: 600
• Number of Logic Elements/Cells: 2700
• Total RAM Bits: 81920
• Number of I/O: 94
• Number of Gates: 128236
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 144-TFBGA, CSPBGA
• Supplier Device Package: 144-LCSBGA (12x12)

package: 144-TFBGA, CSPBGA

XC3120A-3PC68C

Xilinx Inc.

IC FPGA 58 I/O 68PLCC

• Number of LABs/CLBs: 64
• Number of Logic Elements/Cells: -
• Total RAM Bits: 14779
• Number of I/O: 58
• Number of Gates: 1500
• Voltage - Supply: 4.25 V ~ 5.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 68-LCC (J-Lead)
• Supplier Device Package: 68-PLCC (24.23x24.23)

package: 68-LCC (J-Lead)

XQ7VX330T-1RF1157I

Xilinx Inc.

IC FPGA VIRTEX-7 330K 1157BGA

• Number of LABs/CLBs: 25500
• Number of Logic Elements/Cells: 326400
• Total RAM Bits: 27648000
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1157-FCBGA (35x35)

package: 1156-BBGA, FCBGA

XC6VSX315T-L1FFG1759C

Xilinx Inc.

IC FPGA 720 I/O 1759FCBGA

• Number of LABs/CLBs: 24600
• Number of Logic Elements/Cells: 314880
• Total RAM Bits: 25952256
• Number of I/O: 720
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1759-FCBGA (42.5x42.5)

package: 1760-BBGA, FCBGA

XC2VP50-6FFG1152I

Xilinx Inc.

IC FPGA 692 I/O 1152FCBGA

• Number of LABs/CLBs: 5904
• Number of Logic Elements/Cells: 53136
• Total RAM Bits: 4276224
• Number of I/O: 692
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FCBGA (35x35)

package: 1152-BBGA, FCBGA

XCKU13P-1FFVE900I

Xilinx Inc.

XCKU13P-1FFVE900I

• Number of LABs/CLBs: 42660
• Number of Logic Elements/Cells: 746550
• Total RAM Bits: 59084800
• Number of I/O: 304
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: -
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

package: -

XCKU5P-2FFVA676E

Xilinx Inc.

XCKU5P-2FFVA676E

• Number of LABs/CLBs: 27120
• Number of Logic Elements/Cells: 474600
• Total RAM Bits: 35737600
• Number of I/O: 256
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

package: 676-BBGA, FCBGA

XC4VSX35-11FF668C

Xilinx Inc.

IC FPGA 448 I/O 668FCBGA

• Number of LABs/CLBs: 3840
• Number of Logic Elements/Cells: 34560
• Total RAM Bits: 3538944
• Number of I/O: 448
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 668-BBGA, FCBGA
• Supplier Device Package: 668-FCBGA (27x27)

package: 668-BBGA, FCBGA

XC6VLX75T-1FFV484C

Xilinx Inc.

IC FPGA 240 I/O 484FCBGA

• Number of LABs/CLBs: 5820
• Number of Logic Elements/Cells: 74496
• Total RAM Bits: 5750784
• Number of I/O: 240
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-BBGA, FCBGA
• Supplier Device Package: 484-FCBGA (23x23)

package: 484-BBGA, FCBGA

XC6SLX150-3FG484I

Xilinx Inc.

IC FPGA 338 I/O 484FBGA

• Number of LABs/CLBs: 11519
• Number of Logic Elements/Cells: 147443
• Total RAM Bits: 4939776
• Number of I/O: 338
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

package: 484-BBGA

XC7K70T-1FB676I

Xilinx Inc.

IC FPGA 300 I/O 676FCBGA

• Number of LABs/CLBs: 5125
• Number of Logic Elements/Cells: 65600
• Total RAM Bits: 4976640
• Number of I/O: 300
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

package: 676-BBGA, FCBGA

XA6SLX75-3CSG484Q

Xilinx Inc.

IC FPGA 320 I/O 484BGA

• Number of LABs/CLBs: 5831
• Number of Logic Elements/Cells: 74637
• Total RAM Bits: 3170304
• Number of I/O: 328
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 484-FBGA, CSPBGA
• Supplier Device Package: 484-CSPBGA (19x19)

package: 484-FBGA, CSPBGA

XC7A75T-1FTG256C

Xilinx Inc.

IC FPGA ARTIX7 170 I/O 256FTBGA

• Number of LABs/CLBs: 5900
• Number of Logic Elements/Cells: 75520
• Total RAM Bits: 3870720
• Number of I/O: 170
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FTBGA (17x17)

package: 256-LBGA

XC3S1400A-5FG484C

Xilinx Inc.

IC FPGA 375 I/O 484FBGA

• Number of LABs/CLBs: 2816
• Number of Logic Elements/Cells: 25344
• Total RAM Bits: 589824
• Number of I/O: 375
• Number of Gates: 1400000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

package: 484-BBGA

XC2S30-6VQ100C

Xilinx Inc.

IC FPGA 60 I/O 100QFP

• Number of LABs/CLBs: 216
• Number of Logic Elements/Cells: 972
• Total RAM Bits: 24576
• Number of I/O: 60
• Number of Gates: 30000
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 100-TQFP
• Supplier Device Package: 100-VQFP (14x14)

package: 100-TQFP

XC3S50-5TQG144C

Xilinx Inc.

IC FPGA 97 I/O 144TQFP

• Number of LABs/CLBs: 192
• Number of Logic Elements/Cells: 1728
• Total RAM Bits: 73728
• Number of I/O: 97
• Number of Gates: 50000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

package: 144-LQFP

XCKU035-1FBVA676C

Xilinx Inc.

IC FPGA 312 I/O 676FCBGA

• Number of LABs/CLBs: 25391
• Number of Logic Elements/Cells: 444343
• Total RAM Bits: 19456000
• Number of I/O: 312
• Number of Gates: -
• Voltage - Supply: 0.922 V ~ 0.979 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

package: 676-BBGA, FCBGA

XC95288-20BG352I

Xilinx Inc.

IC CPLD 288MC 20NS 352BGA

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 20.0ns
• Voltage Supply - Internal: 4.5 V ~ 5.5 V
• Number of Logic Elements/Blocks: 16
• Number of Macrocells: 288
• Number of Gates: 6400
• Number of I/O: 192
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 352-LBGA, Metal
• Supplier Device Package: 352-MBGA (35x35)

package: 352-LBGA, Metal

XA2C384-11TQG144Q

Xilinx Inc.

IC CPLD 384MC 9.2NS 144TQFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 9.2ns
• Voltage Supply - Internal: 1.7 V ~ 1.9 V
• Number of Logic Elements/Blocks: 24
• Number of Macrocells: 384
• Number of Gates: 9000
• Number of I/O: 118
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

package: 144-LQFP

XA9572XL-15VQG44Q

Xilinx Inc.

IC CPLD 72MC 15.5NS 44VQFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 15.5ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 4
• Number of Macrocells: 72
• Number of Gates: 1600
• Number of I/O: 34
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 44-TQFP
• Supplier Device Package: 44-VQFP (10x10)

package: 44-TQFP

XCR3128XL-10VQ100C

Xilinx Inc.

IC CPLD 128MC 9.1NS 100VQFP

• Programmable Type: In System Programmable (min 1K program/erase cycles)
• Delay Time tpd(1) Max: 9.1ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 8
• Number of Macrocells: 128
• Number of Gates: 3000
• Number of I/O: 84
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-TQFP
• Supplier Device Package: 100-VQFP (14x14)

package: 100-TQFP

XC7K70T-1FB484C

Xilinx Inc.

IC FPGA 185 I/O 484FCBGA

• Number of LABs/CLBs: 5125
• Number of Logic Elements/Cells: 65600
• Total RAM Bits: 4976640
• Number of I/O: 185
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 484-BBGA, FCBGA
• Supplier Device Package: 484-FCBGA (23x23)

package: 484-BBGA, FCBGA