Xilinx Inc. Producten

XCMECH-FF668

Xilinx Inc.

FF668 MECHANICAL SAMPLE

• Type: Mechanical Sample
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

XC17128ELVO8I

Xilinx Inc.

IC 3V SER CFG PROM 128K 8-SOIC

• Programmable Type: OTP
• Memory Size: 128kb
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-TSOP

package: 8-SOIC (0.154", 3.90mm Width)

XC17256EPC20C

Xilinx Inc.

IC SERIAL CFG PROM 256K 20-PLCC

• Programmable Type: OTP
• Memory Size: 256Kb
• Voltage - Supply: 4.75 V ~ 5.25 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 20-LCC (J-Lead)
• Supplier Device Package: 20-PLCC (9x9)

package: 20-LCC (J-Lead)

XCZU9CG-L1FFVB1156I

Xilinx Inc.

IC FPGA 328 I/O 1156FCBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 533MHz, 1.3GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 599K+ Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

package: 1156-BBGA, FCBGA

XCZU2EG-3SFVA625E

Xilinx Inc.

IC FPGA 180 I/O 625FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 625-BFBGA, FCBGA
• Supplier Device Package: 625-FCBGA (21x21)

package: 625-BFBGA, FCBGA

XC7Z030-2FFG676E

Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 676FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 800MHz
• Primary Attributes: Kintex?-7 FPGA, 125K Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

package: 676-BBGA, FCBGA

XC5VSX50T-1FFG665CES

Xilinx Inc.

IC FPGA 360 I/O 665FCBGA

• Number of LABs/CLBs: 4080
• Number of Logic Elements/Cells: 52224
• Total RAM Bits: 4866048
• Number of I/O: 360
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 665-BBGA, FCBGA
• Supplier Device Package: 665-FCBGA (27x27)

package: 665-BBGA, FCBGA

XCV1000E-7FG680I

Xilinx Inc.

IC FPGA 512 I/O 680FBGA

• Number of LABs/CLBs: 6144
• Number of Logic Elements/Cells: 27648
• Total RAM Bits: 393216
• Number of I/O: 512
• Number of Gates: 1569178
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 680-LBGA Exposed Pad
• Supplier Device Package: 680-FTEBGA (40x40)

package: 680-LBGA Exposed Pad

XCS20XL-5VQ100C

Xilinx Inc.

IC FPGA 77 I/O 100VQFP

• Number of LABs/CLBs: 400
• Number of Logic Elements/Cells: 950
• Total RAM Bits: 12800
• Number of I/O: 77
• Number of Gates: 20000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 100-TQFP
• Supplier Device Package: 100-VQFP (14x14)

package: 100-TQFP

XC4008E-3PG191C

Xilinx Inc.

IC FPGA 144 I/O 191CPGA

• Number of LABs/CLBs: 324
• Number of Logic Elements/Cells: 770
• Total RAM Bits: 10368
• Number of I/O: 144
• Number of Gates: 8000
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Through Hole
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 191-BCPGA
• Supplier Device Package: 191-CPGA (47.25x47.25)

package: 191-BCPGA

XC4003E-4VQ100C

Xilinx Inc.

IC FPGA 77 I/O 100VQFP

• Number of LABs/CLBs: 100
• Number of Logic Elements/Cells: 238
• Total RAM Bits: 3200
• Number of I/O: 77
• Number of Gates: 3000
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 100-TQFP
• Supplier Device Package: 100-VQFP (14x14)

package: 100-TQFP

XCVU080-3FFVD1517E

Xilinx Inc.

IC FPGA 338 I/O 1517FCBGA

• Number of LABs/CLBs: 55714
• Number of Logic Elements/Cells: 975000
• Total RAM Bits: 51200000
• Number of I/O: 338
• Number of Gates: -
• Voltage - Supply: 0.970 V ~ 1.030 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

package: 1517-BBGA, FCBGA

XCKU095-1FFVB2104I

Xilinx Inc.

IC FPGA 702 I/O 2104FCBGA

• Number of LABs/CLBs: 67200
• Number of Logic Elements/Cells: 1176000
• Total RAM Bits: 60518400
• Number of I/O: 702
• Number of Gates: -
• Voltage - Supply: 0.922 V ~ 0.979 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 2104-BBGA, FCBGA
• Supplier Device Package: 2104-FCBGA (47.5x47.5)

package: 2104-BBGA, FCBGA

XC7VX485T-2FFG1761C

Xilinx Inc.

IC FPGA 700 I/O 1761FCBGA

• Number of LABs/CLBs: 37950
• Number of Logic Elements/Cells: 485760
• Total RAM Bits: 37969920
• Number of I/O: 700
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1761-FCBGA (42.5x42.5)

package: 1760-BBGA, FCBGA

XC5VLX155T-1FF1136I

Xilinx Inc.

IC FPGA 640 I/O 1136FCBGA

• Number of LABs/CLBs: 12160
• Number of Logic Elements/Cells: 155648
• Total RAM Bits: 7815168
• Number of I/O: 640
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1136-BBGA, FCBGA
• Supplier Device Package: 1136-FCBGA (35x35)

package: 1136-BBGA, FCBGA

XC6VLX240T-L1FFG784I

Xilinx Inc.

IC FPGA 400 I/O 784FCBGA

• Number of LABs/CLBs: 18840
• Number of Logic Elements/Cells: 241152
• Total RAM Bits: 15335424
• Number of I/O: 400
• Number of Gates: -
• Voltage - Supply: 0.91 V ~ 0.97 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 784-BBGA, FCBGA
• Supplier Device Package: 784-FCBGA (29x29)

package: 784-BBGA, FCBGA

XC5VLX85-3FF676C

Xilinx Inc.

IC FPGA 440 I/O 676FCBGA

• Number of LABs/CLBs: 6480
• Number of Logic Elements/Cells: 82944
• Total RAM Bits: 3538944
• Number of I/O: 440
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

package: 676-BBGA, FCBGA

XC2VP30-6FFG896C

Xilinx Inc.

IC FPGA 556 I/O 896FCBGA

• Number of LABs/CLBs: 3424
• Number of Logic Elements/Cells: 30816
• Total RAM Bits: 2506752
• Number of I/O: 556
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 896-BBGA, FCBGA
• Supplier Device Package: 896-FCBGA (31x31)

package: 896-BBGA, FCBGA

XQ6SLX150T-3CSG484I

Xilinx Inc.

IC FPGA SPARTAN-6Q 484-CSBGA

• Number of LABs/CLBs: 11519
• Number of Logic Elements/Cells: 147443
• Total RAM Bits: 4939776
• Number of I/O: 296
• Number of Gates: -
• Voltage - Supply: 1.2 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-FBGA, CSPBGA
• Supplier Device Package: 484-CSPBGA (19x19)

package: 484-FBGA, CSPBGA

XC2VP4-5FGG456C

Xilinx Inc.

IC FPGA 248 I/O 456FBGA

• Number of LABs/CLBs: 752
• Number of Logic Elements/Cells: 6768
• Total RAM Bits: 516096
• Number of I/O: 248
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 456-BBGA
• Supplier Device Package: 456-FBGA (23x23)

package: 456-BBGA

XC2S100-6PQ208C

Xilinx Inc.

IC FPGA 140 I/O 208QFP

• Number of LABs/CLBs: 600
• Number of Logic Elements/Cells: 2700
• Total RAM Bits: 40960
• Number of I/O: 140
• Number of Gates: 100000
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

package: 208-BFQFP

XC3S400-4PQ208C

Xilinx Inc.

IC FPGA 141 I/O 208QFP

• Number of LABs/CLBs: 896
• Number of Logic Elements/Cells: 8064
• Total RAM Bits: 294912
• Number of I/O: 141
• Number of Gates: 400000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

package: 208-BFQFP

XC3S50-4PQ208C

Xilinx Inc.

IC FPGA 124 I/O 208QFP

• Number of LABs/CLBs: 192
• Number of Logic Elements/Cells: 1728
• Total RAM Bits: 73728
• Number of I/O: 124
• Number of Gates: 50000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

package: 208-BFQFP

XC7A200T-1FBG484C

Xilinx Inc.

IC FPGA ARTIX7 285 I/O 484FCBGA

• Number of LABs/CLBs: 16825
• Number of Logic Elements/Cells: 215360
• Total RAM Bits: 13455360
• Number of I/O: 285
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-BBGA, FCBGA
• Supplier Device Package: 484-FCBGA (23x23)

package: 484-BBGA, FCBGA

XC3S50A-4TQG144I

Xilinx Inc.

IC FPGA 108 I/O 144TQFP

• Number of LABs/CLBs: 176
• Number of Logic Elements/Cells: 1584
• Total RAM Bits: 55296
• Number of I/O: 108
• Number of Gates: 50000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

package: 144-LQFP

XC95216-15HQ208C

Xilinx Inc.

IC CPLD 216MC 15NS 208HQFP

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 15.0ns
• Voltage Supply - Internal: 4.75 V ~ 5.25 V
• Number of Logic Elements/Blocks: 12
• Number of Macrocells: 216
• Number of Gates: 4800
• Number of I/O: 166
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 208-BFQFP Exposed Pad
• Supplier Device Package: 208-PQFP (28x28)

package: 208-BFQFP Exposed Pad

XC7Z030-2FF676I

Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 676FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: -
• Peripherals: DMA
• Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 800MHz
• Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

package: 676-BBGA, FCBGA

XCVU9P-3FSGD2104E

Xilinx Inc.

XCVU9P-3FSGD2104E

• Number of LABs/CLBs: 147780
• Number of Logic Elements/Cells: 2586150
• Total RAM Bits: 391168000
• Number of I/O: 676
• Number of Gates: -
• Voltage - Supply: 0.873 V ~ 0.927 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2104-BBGA, FCBGA
• Supplier Device Package: 2104-FCBGA (47.5x47.5)

package: 2104-BBGA, FCBGA