Xilinx Inc. Producten

XC17S30XLPD8C

Xilinx Inc.

IC PROM PROG C-TEMP 3.3V 8-DIP

• Programmable Type: OTP
• Memory Size: 300kb
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-PDIP

package: 8-DIP (0.300", 7.62mm)

XC17512LPD8C

Xilinx Inc.

IC PROM SER C-TEMP 512K 8-DIP

• Programmable Type: OTP
• Memory Size: 512kb
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-PDIP

package: 8-DIP (0.300", 7.62mm)

XCZU15EG-2FFVC900I

Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 747K+ Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 900-BBGA, FCBGA
• Supplier Device Package: 900-FCBGA (31x31)

package: 900-BBGA, FCBGA

XC7Z045-2FBG676E

Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 676FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 800MHz
• Primary Attributes: Kintex?-7 FPGA, 350K Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

package: 676-BBGA, FCBGA

XCZU4CG-2SFVC784E

Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 533MHz, 1.3GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 784-BBGA, FCBGA
• Supplier Device Package: 784-FCBGA (23x23)

package: 784-BBGA, FCBGA

XCZU3CG-2SFVA625I

Xilinx Inc.

XCZU3CG-2SFVA625I

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 533MHz, 1.3GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 154K+ Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 625-BFBGA, FCBGA
• Supplier Device Package: 625-FCBGA (21x21)

package: 625-BFBGA, FCBGA

XC7K325T-3FFG900E

Xilinx Inc.

IC FPGA 500 I/O 900FCBGA

• Number of LABs/CLBs: 25475
• Number of Logic Elements/Cells: 326080
• Total RAM Bits: 16404480
• Number of I/O: 500
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 900-BBGA, FCBGA
• Supplier Device Package: 900-FCBGA (31x31)

package: 900-BBGA, FCBGA

XA3S250E-4PQG208Q

Xilinx Inc.

IC FPGA 158 I/O 208QFP

• Number of LABs/CLBs: 612
• Number of Logic Elements/Cells: 5508
• Total RAM Bits: 221184
• Number of I/O: 158
• Number of Gates: 250000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

package: 208-BFQFP

XC5VLX110T-1FFG1136CES

Xilinx Inc.

IC FPGA 640 I/O 1136FCBGA

• Number of LABs/CLBs: 8640
• Number of Logic Elements/Cells: 110592
• Total RAM Bits: 5455872
• Number of I/O: 640
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1136-BBGA, FCBGA
• Supplier Device Package: 1136-FCBGA (35x35)

package: 1136-BBGA, FCBGA

XCV150-4FG456I

Xilinx Inc.

IC FPGA 260 I/O 456FBGA

• Number of LABs/CLBs: 864
• Number of Logic Elements/Cells: 3888
• Total RAM Bits: 49152
• Number of I/O: 260
• Number of Gates: 164674
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 456-BBGA
• Supplier Device Package: 456-FBGA (23x23)

package: 456-BBGA

XC4010XL-1PC84I

Xilinx Inc.

IC FPGA 61 I/O 84PLCC

• Number of LABs/CLBs: 400
• Number of Logic Elements/Cells: 950
• Total RAM Bits: 12800
• Number of I/O: 61
• Number of Gates: 10000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 84-LCC (J-Lead)
• Supplier Device Package: 84-PLCC (29.31x29.31)

package: 84-LCC (J-Lead)

XC4005XL-2PQ208C

Xilinx Inc.

IC FPGA 112 I/O 208QFP

• Number of LABs/CLBs: 196
• Number of Logic Elements/Cells: 466
• Total RAM Bits: 6272
• Number of I/O: 112
• Number of Gates: 5000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

package: 208-BFQFP

XC4005E-2PG156I

Xilinx Inc.

IC FPGA 112 I/O 156CPGA

• Number of LABs/CLBs: 196
• Number of Logic Elements/Cells: 466
• Total RAM Bits: 6272
• Number of I/O: 112
• Number of Gates: 5000
• Voltage - Supply: 4.5 V ~ 5.5 V
• Mounting Type: Through Hole
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 156-BCPGA
• Supplier Device Package: 156-CPGA (42.17x42.17)

package: 156-BCPGA

XC4005E-2PC84I

Xilinx Inc.

IC FPGA 61 I/O 84PLCC

• Number of LABs/CLBs: 196
• Number of Logic Elements/Cells: 466
• Total RAM Bits: 6272
• Number of I/O: 61
• Number of Gates: 5000
• Voltage - Supply: 4.5 V ~ 5.5 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 84-LCC (J-Lead)
• Supplier Device Package: 84-PLCC (29.31x29.31)

package: 84-LCC (J-Lead)

XC4013E-2PQ208C

Xilinx Inc.

IC FPGA 160 I/O 208QFP

• Number of LABs/CLBs: 576
• Number of Logic Elements/Cells: 1368
• Total RAM Bits: 18432
• Number of I/O: 160
• Number of Gates: 13000
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

package: 208-BFQFP

XC3164A-3PC84C

Xilinx Inc.

IC FPGA 70 I/O 84PLCC

• Number of LABs/CLBs: 224
• Number of Logic Elements/Cells: -
• Total RAM Bits: 46064
• Number of I/O: 70
• Number of Gates: 4500
• Voltage - Supply: 4.25 V ~ 5.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 84-LCC (J-Lead)
• Supplier Device Package: 84-PLCC (29.31x29.31)

package: 84-LCC (J-Lead)

XCVU7P-1FLVB2104E

Xilinx Inc.

XCVU7P-1FLVB2104E

• Number of LABs/CLBs: 98520
• Number of Logic Elements/Cells: 1724100
• Total RAM Bits: 236134400
• Number of I/O: 702
• Number of Gates: -
• Voltage - Supply: 0.825 V ~ 0.876 V
• Mounting Type: -
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

package: -

XC2VP100-5FF1704C

Xilinx Inc.

IC FPGA 1040 I/O 1704FCBGA

• Number of LABs/CLBs: 11024
• Number of Logic Elements/Cells: 99216
• Total RAM Bits: 8183808
• Number of I/O: 1040
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1704-BBGA, FCBGA
• Supplier Device Package: 1704-CFCBGA (42.5x42.5)

package: 1704-BBGA, FCBGA

XC5VLX110-3FFG1760C

Xilinx Inc.

IC FPGA 800 I/O 1760FBGA

• Number of LABs/CLBs: 8640
• Number of Logic Elements/Cells: 110592
• Total RAM Bits: 4718592
• Number of I/O: 800
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FCBGA (42.5x42.5)

package: 1760-BBGA, FCBGA

XC5VLX110-1FFG676I

Xilinx Inc.

IC FPGA 440 I/O 676FCBGA

• Number of LABs/CLBs: 8640
• Number of Logic Elements/Cells: 110592
• Total RAM Bits: 4718592
• Number of I/O: 440
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

package: 676-BBGA, FCBGA

XC2VP40-6FG676I

Xilinx Inc.

IC FPGA 416 I/O 676FBGA

• Number of LABs/CLBs: 4848
• Number of Logic Elements/Cells: 43632
• Total RAM Bits: 3538944
• Number of I/O: 416
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

package: 676-BBGA, FCBGA

XC6SLX150T-2FGG484I

Xilinx Inc.

IC FPGA 296 I/O 484FBGA

• Number of LABs/CLBs: 11519
• Number of Logic Elements/Cells: 147443
• Total RAM Bits: 4939776
• Number of I/O: 296
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

package: 484-BBGA

XC3S1000-4FT256C

Xilinx Inc.

IC FPGA 173 I/O 256FTBGA

• Number of LABs/CLBs: 1920
• Number of Logic Elements/Cells: 17280
• Total RAM Bits: 442368
• Number of I/O: 173
• Number of Gates: 1000000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FTBGA (17x17)

package: 256-LBGA

XC3S700A-4FGG400C

Xilinx Inc.

IC FPGA 311 I/O 400FBGA

• Number of LABs/CLBs: 1472
• Number of Logic Elements/Cells: 13248
• Total RAM Bits: 368640
• Number of I/O: 311
• Number of Gates: 700000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 400-BGA
• Supplier Device Package: 400-FBGA (21x21)

package: 400-BGA

XC3S100E-5CP132C

Xilinx Inc.

IC FPGA 83 I/O 132CSBGA

• Number of LABs/CLBs: 240
• Number of Logic Elements/Cells: 2160
• Total RAM Bits: 73728
• Number of I/O: 83
• Number of Gates: 100000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 132-TFBGA, CSPBGA
• Supplier Device Package: 132-CSPBGA (8x8)

package: 132-TFBGA, CSPBGA

XC3S500E-5PQG208C

Xilinx Inc.

IC FPGA 158 I/O 208QFP

• Number of LABs/CLBs: 1164
• Number of Logic Elements/Cells: 10476
• Total RAM Bits: 368640
• Number of I/O: 158
• Number of Gates: 500000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

package: 208-BFQFP

XC9572XL-7TQG100C

Xilinx Inc.

IC CPLD 72MC 7.5NS 100TQFP

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 7.5ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 4
• Number of Macrocells: 72
• Number of Gates: 1600
• Number of I/O: 72
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Supplier Device Package: 100-TQFP (14x14)

package: 100-LQFP

XCVU190-3FLGC2104E

Xilinx Inc.

IC FPGA VIRTEX-U 2104FCBGA

• Number of LABs/CLBs: 134280
• Number of Logic Elements/Cells: 2349900
• Total RAM Bits: 150937600
• Number of I/O: 416
• Number of Gates: -
• Voltage - Supply: 0.970 V ~ 1.030 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2104-BBGA, FCBGA
• Supplier Device Package: 2104-FCBGA (47.5x47.5)

package: 2104-BBGA, FCBGA