Xilinx Inc. Producten

XC17S40PD8I

Xilinx Inc.

IC PROM PROG I-TEMP 5V 8-DIP

• Programmable Type: OTP
• Memory Size: 400kb
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-PDIP

package: 8-DIP (0.300", 7.62mm)

XC17S100AVO8I

Xilinx Inc.

IC PROM SER 10K 8-SOIC

• Programmable Type: OTP
• Memory Size: 1Mb
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-TSOP

package: 8-SOIC (0.154", 3.90mm Width)

XC18V01PCG20C

Xilinx Inc.

IC PROM SERIAL CONFIG 1M 20-PLCC

• Programmable Type: In System Programmable
• Memory Size: 1Mb
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 20-LCC (J-Lead)
• Supplier Device Package: 20-PLCC (9x9)

package: 20-LCC (J-Lead)

XCZU11EG-2FFVF1517E

Xilinx Inc.

IC FPGA 464 I/O 1517FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 653K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

package: 1517-BBGA, FCBGA

XCZU6CG-2FFVB1156E

Xilinx Inc.

XCZU6CG-2FFVB1156E

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 533MHz, 1.3GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 469K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

package: 1156-BBGA, FCBGA

XCZU4EV-1FBVB900I

Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 900-BBGA, FCBGA
• Supplier Device Package: 900-FCBGA (31x31)

package: 900-BBGA, FCBGA

XCZU3CG-L2SBVA484E

Xilinx Inc.

IC FPGA 82 I/O 484FCBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 533MHz, 1.3GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 154K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 484-BBGA, FCBGA
• Supplier Device Package: 484-FCBGA (19x19)

package: 484-BBGA, FCBGA

XC7Z030-1FFG676I

Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 676FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 667MHz
• Primary Attributes: Kintex?-7 FPGA, 125K Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

package: 676-BBGA, FCBGA

XA2S200E-6FT256I

Xilinx Inc.

IC FPGA 182 I/O 256FTBGA

• Number of LABs/CLBs: 1176
• Number of Logic Elements/Cells: 5292
• Total RAM Bits: 57344
• Number of I/O: 182
• Number of Gates: 200000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FTBGA (17x17)

package: 256-LBGA

XC5VFX200T-1FFG1738CES

Xilinx Inc.

IC FPGA 960 I/O 1738FCBGA

• Number of LABs/CLBs: 15360
• Number of Logic Elements/Cells: 196608
• Total RAM Bits: 16809984
• Number of I/O: 960
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1738-BBGA, FCBGA
• Supplier Device Package: 1738-FCBGA (42.5x42.5)

package: 1738-BBGA, FCBGA

XC4013XL-3PQ160C

Xilinx Inc.

IC FPGA 129 I/O 160QFP

• Number of LABs/CLBs: 576
• Number of Logic Elements/Cells: 1368
• Total RAM Bits: 18432
• Number of I/O: 129
• Number of Gates: 13000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 160-BQFP
• Supplier Device Package: 160-PQFP (28x28)

package: 160-BQFP

XC2VP100-6FFG1696C

Xilinx Inc.

IC FPGA 1164 I/O 1696FCBGA

• Number of LABs/CLBs: 11024
• Number of Logic Elements/Cells: 99216
• Total RAM Bits: 8183808
• Number of I/O: 1164
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1696-BBGA, FCBGA
• Supplier Device Package: 1696-FCBGA (42.5x42.5)

package: 1696-BBGA, FCBGA

XC7K325T-2FF676I

Xilinx Inc.

IC FPGA 400 I/O 676FCBGA

• Number of LABs/CLBs: 25475
• Number of Logic Elements/Cells: 326080
• Total RAM Bits: 16404480
• Number of I/O: 400
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

package: 676-BBGA, FCBGA

XC2VP30-7FFG896C

Xilinx Inc.

IC FPGA 556 I/O 896FCBGA

• Number of LABs/CLBs: 3424
• Number of Logic Elements/Cells: 30816
• Total RAM Bits: 2506752
• Number of I/O: 556
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 896-BBGA, FCBGA
• Supplier Device Package: 896-FCBGA (31x31)

package: 896-BBGA, FCBGA

XC5VLX50-1FFG676I

Xilinx Inc.

IC FPGA 440 I/O 676FCBGA

• Number of LABs/CLBs: 3600
• Number of Logic Elements/Cells: 46080
• Total RAM Bits: 1769472
• Number of I/O: 440
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

package: 676-BBGA, FCBGA

XQ4VFX60-DIE4058

Xilinx Inc.

IC FPGA VIRTEX-4 FX 60K DIE

• Number of LABs/CLBs: 6320
• Number of Logic Elements/Cells: 56880
• Total RAM Bits: 4276224
• Number of I/O: -
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -
• Package / Case: Die
• Supplier Device Package: Die

package: Die

XC5VLX30-2FF324I

Xilinx Inc.

IC FPGA 220 I/O 324FBGA

• Number of LABs/CLBs: 2400
• Number of Logic Elements/Cells: 30720
• Total RAM Bits: 1179648
• Number of I/O: 220
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 324-BBGA, FCBGA
• Supplier Device Package: 324-FCBGA (19x19)

package: 324-BBGA, FCBGA

XC4VLX25-11SFG363I

Xilinx Inc.

IC FPGA 240 I/O 363FCBGA

• Number of LABs/CLBs: 2688
• Number of Logic Elements/Cells: 24192
• Total RAM Bits: 1327104
• Number of I/O: 240
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 363-FBGA, FCBGA
• Supplier Device Package: 363-FCBGA (17x17)

package: 363-FBGA, FCBGA

XC2VP7-5FFG896I

Xilinx Inc.

IC FPGA 396 I/O 896FCBGA

• Number of LABs/CLBs: 1232
• Number of Logic Elements/Cells: 11088
• Total RAM Bits: 811008
• Number of I/O: 396
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 896-BBGA, FCBGA
• Supplier Device Package: 896-FCBGA (31x31)

package: 896-BBGA, FCBGA

XC7A50T-3CSG325E

Xilinx Inc.

IC FPGA 150 I/O 325CSBGA

• Number of LABs/CLBs: 4075
• Number of Logic Elements/Cells: 52160
• Total RAM Bits: 2764800
• Number of I/O: 150
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 324-LFBGA, CSPBGA
• Supplier Device Package: 325-CSBGA (15x15)

package: 324-LFBGA, CSPBGA

XC3S1400A-5FGG676C

Xilinx Inc.

IC FPGA 502 I/O 676FBGA

• Number of LABs/CLBs: 2816
• Number of Logic Elements/Cells: 25344
• Total RAM Bits: 589824
• Number of I/O: 502
• Number of Gates: 1400000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BGA
• Supplier Device Package: 676-FBGA (27x27)

package: 676-BGA

XC7A35T-3FGG484E

Xilinx Inc.

IC FPGA 250 I/O 484FCBGA

• Number of LABs/CLBs: 2600
• Number of Logic Elements/Cells: 33208
• Total RAM Bits: 1843200
• Number of I/O: 250
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

package: 484-BBGA

XC3S100E-4CP132C

Xilinx Inc.

IC FPGA 83 I/O 132CSBGA

• Number of LABs/CLBs: 240
• Number of Logic Elements/Cells: 2160
• Total RAM Bits: 73728
• Number of I/O: 83
• Number of Gates: 100000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 132-TFBGA, CSPBGA
• Supplier Device Package: 132-CSPBGA (8x8)

package: 132-TFBGA, CSPBGA

XC95288XV-10TQ144C

Xilinx Inc.

IC CPLD 288MC 10NS 144TQFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 10.0ns
• Voltage Supply - Internal: 2.37 V ~ 2.62 V
• Number of Logic Elements/Blocks: 16
• Number of Macrocells: 288
• Number of Gates: 6400
• Number of I/O: 117
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

package: 144-LQFP

XC7S100-1FGGA484I

Xilinx Inc.

XC7S100-1FGGA484I

• Number of LABs/CLBs: 8000
• Number of Logic Elements/Cells: 102400
• Total RAM Bits: 4423680
• Number of I/O: 338
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BBGA, FCBGA
• Supplier Device Package: 484-FCBGA (23x23)

package: 484-BBGA, FCBGA

XCVU13P-3FLGA2577E

Xilinx Inc.

XCVU13P-3FLGA2577E

• Number of LABs/CLBs: 216000
• Number of Logic Elements/Cells: 3780000
• Total RAM Bits: 514867200
• Number of I/O: 448
• Number of Gates: -
• Voltage - Supply: 0.873 V ~ 0.927 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2577-BBGA, FCBGA
• Supplier Device Package: 2577-FCBGA (52.5x52.5)

package: 2577-BBGA, FCBGA

XCVU11P-2FLGC2104I

Xilinx Inc.

IC FPGA VIRTEX-UP 2104FCBGA

• Number of LABs/CLBs: 162000
• Number of Logic Elements/Cells: 2835000
• Total RAM Bits: 396150400
• Number of I/O: 416
• Number of Gates: -
• Voltage - Supply: 0.825 V ~ 0.876 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 2104-BBGA, FCBGA
• Supplier Device Package: 2104-FCBGA (47.5x47.5)

package: 2104-BBGA, FCBGA

XCVU080-H1FFVB1760E

Xilinx Inc.

IC FPGA VIRTEX-U 1760FCBGA

• Number of LABs/CLBs: 55714
• Number of Logic Elements/Cells: 975000
• Total RAM Bits: 51200000
• Number of I/O: 702
• Number of Gates: -
• Voltage - Supply: 0.922 V ~ 1.030 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FCBGA (42.5x42.5)

package: 1760-BBGA, FCBGA