Trenz Electronic GmbH Producten

TE0741-02-325-2IF

Trenz Electronic GmbH

SOM KINTEX-7 325T 32MB FLASH AES

• Module/Board Type: FPGA
• Core Processor: Kintex-7 325T
• Co-Processor: -
• Speed: 200MHz
• Flash Size: 32MB
• RAM Size: -
• Connector Type: Samtec LSHM
• Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
• Operating Temperature: -40°C ~ 85°C

package: -

TE0741-02-160-2IF

Trenz Electronic GmbH

SOM KINTEX-7 160T 32MB FLASH AES

• Module/Board Type: FPGA
• Core Processor: Kintex-7 160T
• Co-Processor: -
• Speed: 200MHz
• Flash Size: 32MB
• RAM Size: -
• Connector Type: Samtec LSHM
• Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
• Operating Temperature: -40°C ~ 85°C

package: -

TE0741-02-160-2CF

Trenz Electronic GmbH

SOM KINTEX-7 160T 32MB FLASH AES

• Module/Board Type: FPGA
• Core Processor: Kintex-7 160T
• Co-Processor: -
• Speed: 200MHz
• Flash Size: 32MB
• RAM Size: -
• Connector Type: Samtec LSHM
• Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
• Operating Temperature: 0°C ~ 70°C

package: -

TE0725-02-100-2C

Trenz Electronic GmbH

SOM ARTIX-7 100T FLASH 2C

• Module/Board Type: FPGA
• Core Processor: Artix-7 A100T
• Co-Processor: -
• Speed: 100MHz
• Flash Size: 32MB
• RAM Size: -
• Connector Type: 50 Pin
• Size / Dimension: 2.87" x 1.38" (73mm x 35mm)
• Operating Temperature: 0°C ~ 70°C

package: -

TE0841-01-040-1C

Trenz Electronic GmbH

SOM USCALE XCKU040-1C 1GB DDR4

• Module/Board Type: FPGA
• Core Processor: Kintex UltraScale KU40
• Co-Processor: -
• Speed: -
• Flash Size: 32MB
• RAM Size: 4GB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
• Operating Temperature: 0°C ~ 70°C

package: -

TE0600-03IVFN

Trenz Electronic GmbH

FPGA MICROMOD SPARTAN-6 LX

• Module/Board Type: FPGA
• Core Processor: Spartan-6 LX-150
• Co-Processor: -
• Speed: 125MHz
• Flash Size: 16MB
• RAM Size: 256MB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
• Operating Temperature: -40°C ~ 85°C

package: -

TE0711-01-35-2C

Trenz Electronic GmbH

SOM ARTIX-7 HIGH IO 35T USB 2C

• Module/Board Type: FPGA
• Core Processor: Artix-7 A35T
• Co-Processor: -
• Speed: 100MHz
• Flash Size: 32MB
• RAM Size: -
• Connector Type: Samtec LSHM
• Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
• Operating Temperature: 0°C ~ 70°C

package: -

TE0720-03-1CFA

Trenz Electronic GmbH

SOC MODULE 1GB DDR3

• Module/Board Type: MCU, FPGA
• Core Processor: ARM Cortex-A9
• Co-Processor: Zynq-7000 (Z-7020)
• Speed: -
• Flash Size: 32MB
• RAM Size: 1GB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
• Operating Temperature: 0°C ~ 70°C

package: -

TEC0850-03-15EG1EA

Trenz Electronic GmbH

IC MODULE

• Module/Board Type: -
• Core Processor: -
• Co-Processor: -
• Speed: -
• Flash Size: -
• RAM Size: -
• Connector Type: -
• Size / Dimension: -
• Operating Temperature: -

package: -

TE0630-02I

Trenz Electronic GmbH

IC MOD SPARTAN-6 100MHZ 128MB

• Module/Board Type: FPGA, USB Core
• Core Processor: Spartan-6 LX-45
• Co-Processor: Cypress EZ-USB FX2LP
• Speed: 100MHz
• Flash Size: 8MB
• RAM Size: 128MB
• Connector Type: B2B
• Size / Dimension: 1.6" x 1.9" (40.5mm x 47.5mm)
• Operating Temperature: -40°C ~ 85°C

package: -

TE0803-03-4DE11-A

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

• Module/Board Type: MPU Core
• Core Processor: Zynq UltraScale+ XCZU4EV-1SFVC784E
• Co-Processor: -
• Speed: -
• Flash Size: 128MB
• RAM Size: 2GB
• Connector Type: B2B
• Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
• Operating Temperature: 0°C ~ 85°C

package: -

TE0713-02-100-2C

Trenz Electronic GmbH

IC MOD ARTIX7 XC7A100T-2F 200MHZ

• Module/Board Type: FPGA Core
• Core Processor: Artix-7 XC7A100T-2FGG484C
• Co-Processor: -
• Speed: 200MHz
• Flash Size: 32MB
• RAM Size: 1GB
• Connector Type: B2B
• Size / Dimension: 1.57" x 1.97" (40mm x 50mm)
• Operating Temperature: 0°C ~ 70°C

package: -

TE0712-02-81I36-A

Trenz Electronic GmbH

FPGA MODULE ARTIX7

• Module/Board Type: FPGA Core
• Core Processor: Artix-7 A200T
• Co-Processor: -
• Speed: 200MHz
• Flash Size: 32MB
• RAM Size: 1GB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: -40°C ~ 85°C

package: -

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TE0716-01-61C32-A

Trenz Electronic GmbH

TE0716 - SOM WITH XILINX ZYNQ-70

• Module/Board Type: FPGA
• Core Processor: Zynq™ 7000 SoC XC7Z020
• Co-Processor: -
• Speed: -
• Flash Size: 32MB
• RAM Size: 1GB
• Connector Type: Board-to-Board (BTB) Socket, USB
• Size / Dimension: 2.559" L x 1.772" W (65.00mm x 45.00mm)
• Operating Temperature: 0°C ~ 70°C

package: -

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TE0813-01-5DI21-A

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

• Module/Board Type: MPU Core
• Core Processor: Zynq UltraScale+ XCZU5EV-1SFVC784I
• Co-Processor: -
• Speed: -
• Flash Size: 128MB
• RAM Size: 4GB
• Connector Type: Board-to-Board (BTB) Socket - 240
• Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
• Operating Temperature: -40°C ~ 85°C

package: -

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TE0712-03-81I36-L

Trenz Electronic GmbH

FPGA MODULE ARTIX7

• Module/Board Type: FPGA Core
• Core Processor: Artix-7 XC7A200T-1I
• Co-Processor: -
• Speed: -
• Flash Size: 32MB
• RAM Size: 1GB
• Connector Type: Board-to-Board (BTB) Socket
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: -40°C ~ 85°C

package: -

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TE0808-05-9GI81-A

Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH ZYNQ

• Module/Board Type: -
• Core Processor: -
• Co-Processor: -
• Speed: -
• Flash Size: -
• RAM Size: -
• Connector Type: -
• Size / Dimension: -
• Operating Temperature: -

package: -

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TE0729-02-62I63FA

Trenz Electronic GmbH

IC SOC MODULE ZYNQ

• Module/Board Type: MCU, FPGA
• Core Processor: ARM Cortex-A9
• Co-Processor: Zynq-7000 (Z-7020)
• Speed: -
• Flash Size: 32MB
• RAM Size: 512MB
• Connector Type: B2B
• Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
• Operating Temperature: -40°C ~ 85°C

package: -

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TE0808-05-9BE21-LZ

Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH AMD

• Module/Board Type: MPU Core
• Core Processor: Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E
• Co-Processor: -
• Speed: -
• Flash Size: 128MB
• RAM Size: 4GB
• Connector Type: Board-to-Board (BTB) Socket - 4 x 160
• Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
• Operating Temperature: 0°C ~ 85°C

package: -

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TE0741-04-A2I-1-A

Trenz Electronic GmbH

MODULE FPGA KINTEX

• Module/Board Type: FPGA Core
• Core Processor: Xilinx Kintex-7 FPGA XC7K70T-2FBG676I
• Co-Processor: -
• Speed: -
• Flash Size: 32MB
• RAM Size: -
• Connector Type: Board-to-Board (BTB) Socket
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: -40°C ~ 85°C

package: -

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AM0010-02-2AE21MA

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

• Module/Board Type: MPU Core
• Core Processor: Zynq™ UltraScale+™ ZU2CG
• Co-Processor: -
• Speed: -
• Flash Size: 128MB
• RAM Size: 4GB
• Connector Type: Board-to-Board (BTB) Socket
• Size / Dimension: 2.205" L x 1.575" W (56.00mm x 40.00mm)
• Operating Temperature: 0°C ~ 85°C

package: -

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TE0741-05-A2I-1-A

Trenz Electronic GmbH

MODULE FPGA KINTEX

• Module/Board Type: FPGA
• Core Processor: Xilinx Kintex-7 FPGA XC7K70T-2FBG676I
• Co-Processor: -
• Speed: -
• Flash Size: 32MB
• RAM Size: -
• Connector Type: Board-to-Board (BTB) Socket
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: -40°C ~ 85°C

package: -

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TE0807-03-4BE21-AK

Trenz Electronic GmbH

MPSOC MODULE TE0807 WITH ZYNQ UL

• Module/Board Type: MPU Core
• Core Processor: Zynq™ UltraScale+™ XCZU4EG-1FBVB900E
• Co-Processor: -
• Speed: -
• Flash Size: 128MB
• RAM Size: 4GB
• Connector Type: Board-to-Board (BTB) Socket - 160
• Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
• Operating Temperature: 0°C ~ 85°C

package: -

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TE0720-03-31C33FA

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

• Module/Board Type: MCU, FPGA
• Core Processor: ARM Cortex-A9
• Co-Processor: Zynq-7000 (Z-7014S)
• Speed: 125MHz
• Flash Size: 4GB
• RAM Size: 1GB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: 0°C ~ 70°C

package: -

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TE0745-02-92I11-A

Trenz Electronic GmbH

SOM 1GB DDR3 XC7Z045-2FBG676I

• Module/Board Type: -
• Core Processor: -
• Co-Processor: -
• Speed: -
• Flash Size: -
• RAM Size: -
• Connector Type: -
• Size / Dimension: -
• Operating Temperature: -

package: -

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TE0712-02-71I01-M

Trenz Electronic GmbH

IC MODULE ARTIX7

• Module/Board Type: FPGA Core
• Core Processor: -
• Co-Processor: -
• Speed: 200MHz
• Flash Size: 32MB
• RAM Size: 1GB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: -40°C ~ 85°C

package: -

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TE0745-03-93E31-AK

Trenz Electronic GmbH

SOM WITH AMD ZYNQ 7045-3E AND HE

• Module/Board Type: MPU Core
• Core Processor: ARM Cortex-A9
• Co-Processor: Xilinx Zynq 7045 SoC XC7Z045-3FFG676E
• Speed: -
• Flash Size: 64MB
• RAM Size: 1GB
• Connector Type: Samtec ST5
• Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
• Operating Temperature: -40°C ~ 85°C

package: -

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TE0818-02-9GI81-A

Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH ZYNQ

• Module/Board Type: MPU Core
• Core Processor: Xilinx Zynq UltraScale+ XCZU9EG-2FFVC900I
• Co-Processor: -
• Speed: -
• Flash Size: 128MB
• RAM Size: 4GB
• Connector Type: Board-to-Board (BTB) Socket - 4 x 240
• Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
• Operating Temperature: -40°C ~ 85°C

package: -

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